SiC wafer producing method
    71.
    发明授权

    公开(公告)号:US10155323B2

    公开(公告)日:2018-12-18

    申请号:US15833556

    申请日:2017-12-06

    申请人: DISCO CORPORATION

    发明人: Kazuya Hirata

    摘要: A SiC wafer producing method produces an SiC wafer from a single crystal SiC ingot. The method includes a separation layer forming step of setting a focal point of a pulsed laser beam having a transmission wavelength to single crystal SiC inside the ingot at a predetermined depth from an end surface of the ingot, the predetermined depth corresponding to the thickness of the wafer to be produced, and next applying the pulsed laser beam to the ingot, thereby forming a plurality of modified portions on a c-plane present in the ingot at the predetermined depth and also forming cracks isotropically on the c-plane so as to extend from each modified portion, each modified portion being a region where SiC has been decomposed into Si and C, the modified portions and the cracks constituting a separation layer along which the wafer is to be separated from the ingot.

    Simultaneous Break and Expansion System for Integrated Circuit Wafers

    公开(公告)号:US20180323105A1

    公开(公告)日:2018-11-08

    申请号:US15957794

    申请日:2018-04-19

    申请人: pSemi Corporation

    摘要: Improved methods and apparatuses for singulating integrated circuit (IC) dies that reduce or eliminate die collisions and work well with very small dies. Embodiments simultaneously separate dies in two dimensions by utilizing a break and expansion system that avoids die collisions by maintaining IC die separation after singulation. Singulation is achieved by placing the joined dies of the wafer substrate on a dicing tape, scoring the wafer substrate between the joined dies, and imposing a bending action by pressing a curved surface against the scored wafer substrate, which also expands the wafer substrate by stretching the dicing tape. After breaking, an inner expansion grip ring is pressed into an outer expansion grip ring in a nested configuration so as to maintain the stretched state of the dicing tape after the curved surface is fully removed, thereby maintaining the dicing tape in tension and the singulated die in spaced apart relation.

    Waterjet stream catcher
    74.
    发明授权

    公开(公告)号:US10099397B2

    公开(公告)日:2018-10-16

    申请号:US14619059

    申请日:2015-02-10

    申请人: PaR Systems, Inc.

    IPC分类号: B26F3/00 B24C9/00 B05B14/00

    摘要: A catcher for a fluid stream and a method of capturing a fluid stream from a nozzle and dissipating the energy therein includes receiving the fluid stream into a housing through an aperture; and deflecting the fluid stream obliquely within the housing in one or more preselected directions.

    Waterjet safety enclosure system
    76.
    发明授权

    公开(公告)号:US10052779B2

    公开(公告)日:2018-08-21

    申请号:US15420297

    申请日:2017-01-31

    申请人: Zuluboy, Inc.

    摘要: A waterjet safety enclosure formed by walls using a detection device or light curtain to detect unsafe conditions. The waterjet safety enclosure walls can be used in new work areas or retrofitted and shaped to fit existing work areas. The waterjet safety enclosure walls may form a partial or complete perimeter about a work area and may be adjustable or mobile. The waterjet safety enclosure wall detects unsafe conditions when a high pressure stream of water from a waterjet cutting machine approaches, contacts or penetrates the waterjet safety enclosure wall. The detection device detects the high pressure stream of water and sends a signal to a controller to stop the operation of the waterjet cutting machine.

    Dispensing apparatus
    77.
    发明授权

    公开(公告)号:US10023421B2

    公开(公告)日:2018-07-17

    申请号:US14435325

    申请日:2013-10-16

    申请人: Custom S.p.A.

    发明人: Alberto Campanini

    摘要: An apparatus and a method distributes printed slips or tickets that are obtained from a continuous strip of material in which the strip is cut by a stationary blade when the user tensions the strip by pulling an end thereof. A driven dragging roller that makes the strip advance in an intermittent manner is interrupted if a sensor detects that the strip is tensioned to be cut.

    Wafer producing method
    79.
    发明授权

    公开(公告)号:US09925619B2

    公开(公告)日:2018-03-27

    申请号:US14988378

    申请日:2016-01-05

    申请人: DISCO CORPORATION

    摘要: A hexagonal single crystal wafer is produced from a hexagonal single crystal ingot. A separation start point is formed by setting a focal point of a laser beam inside the ingot at a predetermined depth from the upper surface of the ingot, which depth corresponds to a thickness of the wafer to be produced. The laser beam is applied to the upper surface of the ingot while relatively moving the focal point and the ingot to thereby form a modified layer parallel to the upper surface of the ingot and form cracks extending from the modified layer along a c-plane, thus forming a separation start point. The wafer is separated by immersing the ingot in water and then applying ultrasonic vibration to the ingot, thereby separating a plate-shaped member having a thickness corresponding to the thickness of the wafer from the ingot.