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公开(公告)号：US20230256559A1
公开(公告)日：2023-08-17
申请号：US18012042
申请日：2021-06-11
Applicant: KCTECH CO., LTD.
Inventor： Ji Hoon SON
IPC: B24B37/04 , B24B37/013
CPC classification number: B24B37/042 , B24B37/013
Abstract: The substrate polishing system, according to an example embodiment, includes a plurality of polishing apparatuses configured to sequentially polish a substrate, and each of the polishing apparatuses includes a polishing platen polishing a substrate, a data collector collecting a signal generated in a polishing process of the substrate, a data analyzer detecting a thickness of a substrate by analyzing the collected signal, and a polishing endpoint detector determining a polishing endpoint of a substrate based on the detected thickness of a substrate, and the plurality of polishing apparatuses is configured to share data with each other, and based on a polishing order of a substrate, the data obtained from one polishing apparatus of the plurality of polishing apparatuses is configured to be reflected in a detection process of a substrate thickness detection of another polishing apparatus of the plurality of polishing apparatuses in next sequence.
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公开(公告)号：US20230225807A1
公开(公告)日：2023-07-20
申请号：US18074806
申请日：2022-12-05
Applicant: Samsung Display Co., Ltd. , KCTECH CO.,LTD.
Inventor： YUNKU KANG , JUN HO KANG , EUN HO PARK , SUNGMIN PARK
IPC: A61B34/30
CPC classification number: A61B34/30 , A61B2034/306
Abstract: A robot arm includes a first hand, a second hand, and a distance adjusting part for adjusting a distance between the first hand and the second hand. The first hand includes a first body portion and a plurality of first protruding portions protruded from the first body portion to a second direction and arranged in a first direction crossing the second direction. The second hand includes a second body portion and a plurality of second protruding portions protruded from the second body portion to the second direction and arranged in the first direction. The first protruding portions and the second protruding portions are disposed between the first body portion and the second body portion.
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公开(公告)号：US11701693B2
公开(公告)日：2023-07-18
申请号：US17781700
申请日：2020-11-05
Applicant: KCTECH CO., LTD.
Inventor： Hyung Chul Kim , Dong Hwa Lee , You Sun Jung
CPC classification number: B08B13/00 , B08B7/0021
Abstract: The substrate processing device according to one embodiment may comprise: a chamber unit provided with a processing space therein and comprising an inclined chamber surface having an opening; a door unit comprising an inclined door surface, which corresponds to the inclined chamber surface, and capable of being coupled to the chamber unit; and a door driving unit for driving the door unit so as to open/close the processing space.
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公开(公告)号：US20230072716A1
公开(公告)日：2023-03-09
申请号：US17897222
申请日：2022-08-29
Applicant: KCTECH CO., LTD.
Inventor： Jung Hun KIM , Jeong Gyu LEE , Hyo Jun JANG
Abstract: The present disclosure relates to cerium oxide abrasive particles and a polishing slurry composition, and more particularly, to cerium oxide abrasive particles comprising: an element cerium; and a modifier and satisfying the agglomeration ratios calculated from the relational expressions of the primary particle sizes and the secondary particle sizes, and a polishing slurry composition comprising the same.
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公开(公告)号：US20220305611A1
公开(公告)日：2022-09-29
申请号：US17697891
申请日：2022-03-17
Applicant: KCTECH CO., LTD.
Inventor： Hee Cheul JUNG , Geun Sik YUN , Hyung Seob SHIM , Sung Ho SHIN
IPC: B24B37/015 , B24B37/20 , B24B57/02 , B24B55/03
Abstract: A substrate polishing method for polishing a substrate through a polishing pad according to an embodiment may comprise: a preheating step of increasing the temperature of the polishing pad by supplying heated pure water to the polishing pad before polishing the substrate; and a temperature control step of controlling the temperature of the polishing pad by adjusting the temperature of the slurry supplied to the polishing pad in a polishing process of the substrate.
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Patent Agency Ranking
公开(公告)号：US20220277963A1
公开(公告)日：2022-09-01
申请号：US17575913
申请日：2022-01-14
Applicant: KCTech Co., Ltd.
Inventor： Hee Sung Chae , Seung Eun Lee , Geun Sik Yun
IPC: H01L21/306 , H01L21/687 , H01L21/67 , H01L21/677 , H01L21/673
Abstract: A substrate polishing system may include a substrate transfer unit comprising a shaft to rotate on a rotation axis perpendicular to a ground and at least one transfer arm to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit by rotation of the shaft, and at least one carrier to perform polishing the substrate transferred by the substrate transfer unit.
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公开(公告)号：US20220274228A1
公开(公告)日：2022-09-01
申请号：US17579189
申请日：2022-01-19
Applicant: KCTECH CO., LTD.
Inventor： Hee Sung CHAE , Seung Eun LEE , Geun Sik YUN
Abstract: A substrate polishing system may include a substrate transfer unit to support a bottom surface of a substrate and transfer the substrate while forming a transfer orbit in a circle by a rotational motion, at least one carrier to perform polishing on the substrate received from the substrate transfer unit, and a loader to load the substrate which is seated on the substrate transfer unit to the carrier or unload a substrate placed on the carrier to the substrate transfer unit.
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公开(公告)号：US11407081B2
公开(公告)日：2022-08-09
申请号：US16416736
申请日：2019-05-20
Applicant: KCTECH CO., LTD.
Inventor： Jong-Tae Joo , Sang Hyun Kim , Ho Cheon Jeong , Jae Yeol Kim
IPC: B24B37/005 , B24B37/30
Abstract: The present invention relates to a substrate polishing system comprising a polishing pad covered on the polishing platen; a plurality of substrate carriers including a first substrate carrier which moves in a state in which a substrate is mounted and performs a polishing process in a state in which the substrate is in contact with the polishing pad on the polishing pad; a monitoring unit of displaying the information including the identity, position of at least one of the substrate carriers; and a control unit of outputting a warning signal and/or changes the operation of operating devices when an error occurs in real time thereby improving the monitoring efficiency and operation reliability of the polishing process of the substrate.
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公开(公告)号：US20220111486A1
公开(公告)日：2022-04-14
申请号：US17495818
申请日：2021-10-07
Applicant: KCTECH CO., LTD.
Inventor： Hee Sung CHAE , Seung Eun LEE , Geun Sik YUN
Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first cleaning line and the second cleaning line, a first retransfer robot configured to transfer a substrate from the front-end module to the first stage, a second stage disposed between the first polishing line and the second polishing line, and a second retransfer robot configured to transfer the substrate between at least two locations of the first cleaning line, the second cleaning line, the first stage, and the second stage.
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公开(公告)号：US20220111485A1
公开(公告)日：2022-04-14
申请号：US17495816
申请日：2021-10-07
Applicant: KCTECH CO., LTD.
Inventor： Hee Sung CHAE , Seung Eun LEE , Geun Sik YUN
Abstract: A substrate processing system includes a front-end module, a first processing line including a first polishing line and a first cleaning line, a second processing line including a second polishing line and a second cleaning line and disposed in parallel to the first processing line, a first stage disposed between the first processing line and the second processing line, and a first retransfer robot configured to transfer a substrate from the front-end module to the first stage.
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