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81.发明授权公开(公告)号：US12146898B2
公开(公告)日：2024-11-19
申请号：US17888384
申请日：2022-08-15
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani
Abstract: Probe structures having multiple beams are joined at their ends with at least one functioning as a current carrying beam (i.e. an electrical beam) and at least one functioning as a structural beam (i.e. non-current carrying beam) that conveys desired mechanical or structural parameters for the probe such as spring force, scrubbing, over travel, operational stability and repeatability, and the like. The current carrying beam provides little with regard to mechanical properties, and the structural beam is separated from the current carrying beam along a majority of its length and does not pass current between the probe ends due to its dielectric nature or the presence of at least one dielectric barrier located at an end or along its length.
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公开(公告)号：US11973301B2
公开(公告)日：2024-04-30
申请号：US17680211
申请日：2022-02-24
Applicant: Microfabrica Inc.
Inventor： Uri Frodis
Abstract: Embodiments are directed to microscale and millimeter scale multi-layer structures (e.g. probe structures for making contact between two electronic components for example in semiconductor wafer and chip and electronic component test applications). Some embodiments of the invention provide structures that include a core and shell on at least one layer where the layer including the shell is formed from at least one core material and at least one shell material wherein the shell material is different from a shell material or a single structural material on at least one of an immediately preceding layer or an immediately succeeding layer and wherein the core material is different from any core material on at least one of an immediately preceding layer or an immediately succeeding layer.
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83.发明公开公开(公告)号：US20240094259A1
公开(公告)日：2024-03-21
申请号：US17888384
申请日：2022-08-15
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani
CPC classification number: G01R1/07357 , G01R1/06722 , G01R1/06738
Abstract: Probe structures having multiple beams are joined at their ends with at least one functioning as a current carrying beam (i.e. an electrical beam) and at least one functioning as a structural beam (i.e. non-current carrying beam) that conveys desired mechanical or structural parameters for the probe such as spring force, scrubbing, over travel, operational stability and repeatability, and the like. The current carrying beam provides little with regard to mechanical properties, and the structural beam is separated from the current carrying beam along a majority of its length and does not pass current between the probe ends due to its dielectric nature or the presence of at least one dielectric barrier located at an end or along its length.
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公开(公告)号：US20240094258A1
公开(公告)日：2024-03-21
申请号：US17968638
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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85.发明公开公开(公告)号：US20240094247A1
公开(公告)日：2024-03-21
申请号：US17464612
申请日：2021-09-01
Applicant: Microfabrica Inc.
Inventor： Onnik Yaglioglu
CPC classification number: G01R1/06716 , G01R1/06755 , G01R1/06761 , G01R1/07342 , H01R13/03 , H01R13/2407 , H01R2201/20
Abstract: Probe structures, probe arrays) and methods for making such structures include incorporation of nano-fibers and metal composites to provide structures with improved material properties. Nano-fiber incorporation may occur by co-deposition of fibers and metal, selective placement of fibers followed by deposition of metal, or general placement of fibers followed by selective deposition of a metal. Structures may be formed from single layers of fibers and deposited metal or from multiple layers formed adjacent to one another or attached to one another after formation. All portions, or only selected portions, of a structure may include composites of metal and nano-fibers.
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Patent Agency Ranking
公开(公告)号：US11802891B1
公开(公告)日：2023-10-31
申请号：US17139933
申请日：2020-12-31
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu
IPC: G01R1/067
CPC classification number: G01R1/06722
Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two flat spring segments with at least one of those segments being used in a compressive manner wherein the probe additionally includes guide elements, framing structures or other structural configurations that limit or inhibit one or more compressive spring segments from bowing or deflecting out of a desired position when subjected to loading.
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公开(公告)号：US11761982B1
公开(公告)日：2023-09-19
申请号：US17139925
申请日：2020-12-31
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include a plurality of compliant modules stacked in a serial configuration, which are supported by an exoskeleton or an endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Other probes are formed from single compliant modules or pairs of back-to-back modules that may share a common base. Module bases may include configurations that allow for one or both lateral alignment and longitudinal alignment of probes relative to array structures (e.g., array substrates, guide plates) or other modules they contact or to which they adhere.
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公开(公告)号：US20230243870A1
公开(公告)日：2023-08-03
申请号：US18295712
申请日：2023-04-04
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/06722 , G01R1/07314 , G01R1/06733
Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes in the lower array plate and an upper retention feature undergoing lateral displacement relative to the upper plate probe hole such that it can no longer longitudinally pass through the extension of the upper plate probe hole in the upper array plate.
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89.发明授权公开(公告)号：US11211228B1
公开(公告)日：2021-12-28
申请号：US16380159
申请日：2019-04-10
Applicant: Microfabrica Inc.
Inventor： Rulon J. Larsen, III , Adam L. Cohen
Abstract: Embodiments are directed to forming reentrant multi-layer micro-scale or millimeter scale three dimensional structures, parts, components, or devices where each layer is formed from a plurality of deposited materials and more specifically where each layer is formed from at least one metal structural material and at least one organic sacrificial material (e.g. polymer) that are co-planarized and a portion of the sacrificial material located on a plurality of layers is removed after formation of the plurality of layers via one or more plasma etching operations or one or more neutral radical etching operations.
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公开(公告)号：US10806557B1
公开(公告)日：2020-10-20
申请号：US15647243
申请日：2017-07-11
Applicant: Microfabrica Inc.
Inventor： Richard T. Chen , Eric C. Miller
Abstract: Embodiments of the present invention are directed to microscale and millimeter scale tissue scaffolding structures that may be static or expandable and which may be formed of biocompatible metals or other materials that may be coated to become biocompatible. Scaffold structures may include features for holding desired biological or physiological materials to enhance selected tissue growth. Scaffolding devices may be formed by multi-layer, multi-material electrochemical fabrication methods.
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