SYSTEM AND METHOD FOR DETERMINING WHETHER AN ELECTRONIC DEVICE IS LOCATED ON A STATIONARY OR STABLE SURFACE

    公开(公告)号:US20240134468A1

    公开(公告)日:2024-04-25

    申请号:US18048360

    申请日:2022-10-19

    CPC classification number: G06F3/0346 G06F3/03547

    Abstract: A method includes receiving electrostatic sensor data in a processor of an electronic device from an electrostatic sensor mounted behind a touchscreen of the electronic device and using the electrostatic sensor data to determine when the touchscreen is being used. Based on whether or not the touchscreen is being used, an on-table detection (OTD) algorithm is selected from a plurality of available OTD algorithms. In one or more examples, the OTD algorithm may also be selected based on the current device mode of the electronic device, which may be determined from a lid angle, a screen angle, and a keyboard angle of the electronic device. The selected OTD algorithm is run to determine whether or not the electronic device is located on a stationary or stable surface.

    Gesture and handedness determination

    公开(公告)号:US11954260B2

    公开(公告)日:2024-04-09

    申请号:US17374815

    申请日:2021-07-13

    CPC classification number: G06F3/017 H04M1/0281

    Abstract: A system and method for determining handedness in a device. The system including a first electrode, a second electrode, a sensor, and a processing circuit coupled to each other. The first electrode is placed at a first location, and the second electrode is placed at a second location on the device—the first location is different from the second location. The electrodes are configured to sense a variation in an electrostatic field in response to a user interacting with the device. The sensor detects a differential potential between the first electrode and the second electrode, and the processing circuit determines whether the user is interacting with the device using a left hand or a right hand. The determining is based on data received from the sensor corresponding to the differential potential.

    Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor device

    公开(公告)号:US11948806B2

    公开(公告)日:2024-04-02

    申请号:US17549280

    申请日:2021-12-13

    Inventor: Paolo Crema

    Abstract: In a method of manufacturing a multi-die semiconductor device, a metal leadframe includes a die pad and electrically-conductive leads arranged around the die pad. First and second semiconductor dice are arranged on the die pad. A laser-activatable material is disposed on the dice and leads, and a set of laser-activated lines is patterned, including a first subset coupling selected bonding pads of the dice to selected leads, a second subset coupling selected bonding pads amongst themselves, and a third subset coupling the lines in the second subset to at least one line in the first subset. A first metallic layer is deposited onto the laser-activated lines to provide first, second and third subsets of electrically-conductive lines. A second metallic layer is selectively deposited onto the first and second subsets by electroplating to provide first and second subsets of electrically-conductive tracks. The electrically-conductive lines in the third subset are selectively removed.

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