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12 条记录 (耗时 0.013 秒)

    Leadframe package using selectively pre-plated leadframe
    2.
    发明授权
    Leadframe package using selectively pre-plated leadframe 有权

    公开(公告)号：US10763195B2

    公开(公告)日：2020-09-01

    申请号：US15934783

    申请日：2018-03-23

    申请人： STMICROELECTRONICS S.r.l.

    发明人： Paolo Crema

    IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L21/48

    摘要： The present disclosure is directed to a leadframe package with a surface mounted semiconductor die coupled to leads of the leadframe package through wire bonding. The leads are partially exposed outside the package and configured to couple to another structure, like a printed circuit board (PCB). The exposed portions, namely outer segments, of the leads include a plating or coating layer of a material that enhances the solder wettability of the leads to the PCB through solder bonding. The enclosed portions, namely inner segments, of the leads do not include the plating layer of the outer segment and, thus, include a different surface material or surface finish.

    LEAD FRAME SURFACE FINISHING
    3.
    发明申请
    LEAD FRAME SURFACE FINISHING 审中-公开

    公开(公告)号：US20190279942A1

    公开(公告)日：2019-09-12

    申请号：US16299085

    申请日：2019-03-11

    申请人： STMICROELECTRONICS INTERNATIONAL N.V. ,  STMICROELECTRONICS S.R.L.

    发明人： Paolo Crema ,  Jürgen Barthelmes ,  Din-Ghee Neoh

    IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L21/48 ,  C25D3/38 ,  C25D5/48

    摘要： The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

    Die attachment method and material between a semiconductor device and die pad of a leadframe
    6.
    发明授权
    Die attachment method and material between a semiconductor device and die pad of a leadframe 有权

    公开(公告)号：US11640931B2

    公开(公告)日：2023-05-02

    申请号：US16899342

    申请日：2020-06-11

    申请人： STMICROELECTRONICS S.R.L.

    发明人： Paolo Crema

    IPC分类号： H01L23/495 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/00

    摘要： Manufacturing a semiconductor device, such as an integrated circuit, comprises: providing a leadframe having a die pad area, attaching onto the die pad area of the leadframe one or more semiconductor die or dice via soft-solder die attach material, and forming a device package by molding package material onto the semiconductor die or dice attached onto the die pad area of the leadframe. An enhancing layer, provided onto the leadframe to counter device package delamination, is selectively removed via laser beam ablation from the die pad area, and the semiconductor die or dice are attached onto the die pad area via soft-solder die attach material provided where the enhancing layer has been removed to promote wettability by the soft-solder material.

    Lead frame surface finishing
    7.
    发明授权
    Lead frame surface finishing 有权

    公开(公告)号：US11011476B2

    公开(公告)日：2021-05-18

    申请号：US16299085

    申请日：2019-03-11

    申请人： STMICROELECTRONICS INTERNATIONAL N.V. ,  STMICROELECTRONICS S.R.L.

    发明人： Paolo Crema ,  Jürgen Barthelmes ,  Din-Ghee Neoh

    IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  C25D5/48 ,  H01L21/48 ,  C25D3/38

    摘要： The present disclosure is directed to a lead frame design that includes a copper alloy base material coated with an electroplated copper layer, a precious metal, and an adhesion promotion compound. The layers compensate for scratches or surface irregularities in the base material while promoting adhesion from the lead frame to the conductive connectors, and to the encapsulant by coupling them to different layers of a multilayer coating on the lead frame. The first layer of the multilayer coating is a soft electroplated copper to smooth the surface of the base material. The second layer of the multilayer coating is a thin precious metal to facilitate a mechanical coupling between leads of the lead frame and conductive connectors. The third layer of the multilayer coating is the adhesion promotion compound for facilitating a mechanical coupling to an encapsulant around the lead frame.

    Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device
    10.
    发明授权
    Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor device 有权

    公开(公告)号：US11610849B2

    公开(公告)日：2023-03-21

    申请号：US17108187

    申请日：2020-12-01

    申请人： STMicroelectronics S.r.l.

    发明人： Paolo Crema

    IPC分类号： H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/495

    摘要： A leadframe has a die pad area and an outer layer of a first metal having a first oxidation potential. The leadframe is placed in contact with a solution containing a second metal having a second oxidation potential, the second oxidation potential being more negative than the first oxidation potential. Radiation energy is then applied to the die pad area of the leadframe contacted with the solution to cause a local increase in temperature of the leadframe. As a result of the temperature increase, a layer of said second metal is selectively provided at the die pad area of the leadframe by a galvanic displacement reaction. An oxidation of the outer layer of the leadframe is then performed to provide an enhancing layer which counters device package delamination.