公开(公告)号：US20250126465A1

公开(公告)日：2025-04-17

申请号：US18568499

申请日：2022-07-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kiran Gurudev KAPALE ,  Arunprasath RAMAMOORTHY ,  Basavaraj Jayawant PATTAN

IPC: H04W12/02 ,  H04L67/306 ,  H04L67/52

Abstract: The disclosure relates to a 5G or 6G communication system for supporting a higher data transmission rate. The present subject matter refers to method and apparatus for managing provision (or, dissemination) of a location information of a client device. The method includes instructing a client device for sharing the location information; receiving the location information and a request for managing dissemination of the location information; receiving a list for managing dissemination of the location information from the client device. The method includes determining if the client device is authorized to request managing dissemination of the location information based on a client profile and managing dissemination of the location information to the one or more MCX service user in accordance with the list based on determination that the client device is authorized to request managing dissemination of the location information.

公开(公告)号：US20250126355A1

公开(公告)日：2025-04-17

申请号：US18990192

申请日：2024-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： Daehee PARK ,  Chonghwa SEO ,  Jongwon LEE

IPC: H04N23/65 ,  G06T7/80

Abstract: An embodiment of the disclosure provides a method and a device configured to: in a state in which transmission power of a communication module is cut off, obtain a reference image using a camera module; store the obtained reference image in a memory; in a state in which a designated transmission power related to malfunction of the camera module is configured in the communication module, obtain a comparison image using the camera module; compare the reference image and the comparison image to determine an error in the comparison image; and determine, based on a result of the determination, the maximum transmission power of the communication module at the time of using the camera module.

公开(公告)号：US20250126237A1

公开(公告)日：2025-04-17

申请号：US18999455

申请日：2024-12-23

Applicant: SAMSUNG ELECTRONICS CO.,LTD.

Inventor： Kisung LEE ,  Bonseuk GOO ,  Youngtae KIM ,  Byungseok SOH ,  Sangki YOON ,  Youngchol LEE ,  Weonhee LEE

IPC: H04N9/31

Abstract: Provided is an electronic device including a projector, a communication interface configured to communicate with an external device, and at least one processor configured to, based on receiving a user input for projecting a first content from the electronic device and projecting a second content from the external device, obtain a difference value between a first luminance value corresponding to the first content and a second luminance value corresponding to the second content, obtain a projection interval of the first content and the second content based on the difference value, control the projector to project the first content based on the projection interval, and transmit the second content and a control signal for projecting the second content to the external device through the communication interface.

公开(公告)号：US20250125998A1

公开(公告)日：2025-04-17

申请号：US18401971

申请日：2024-01-02

Applicant: Samsung Electronics Co., Ltd.

Inventor： Minsoo CHOI ,  Hiep PHAM ,  Chih-Wei YAO ,  Hyojun KIM

IPC: H04L25/02

Abstract: A wireline transceiver system includes a predriver configured to generate a signal; a source-series termination (SST) driver configured to receive the generated signal; and a replica driver configured to continuously generate bias voltages in real time to modulate current of a push-pull current source of the SST driver based on a voltage of the received signal across a process, voltage, and temperature (PVT) range.

公开(公告)号：US20250125302A1

公开(公告)日：2025-04-17

申请号：US18808869

申请日：2024-08-19

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jing Cheng LIN ,  Youngkun Jee

IPC: H01L25/16 ,  H01L23/00 ,  H01L23/31 ,  H10B80/00

Abstract: A semiconductor package includes a first semiconductor chip including a plurality of upper pads, a non-conductive support layer on a top surface of the first semiconductor chip and including a plurality of openings, a second semiconductor chip on the first semiconductor chip and including a plurality of lower pads, a plurality of chip connecting terminals extending between the plurality of upper pads and the plurality of lower pads, and an insulation adhesive layer between the first semiconductor chip and the second semiconductor chip and at least partially covering the plurality of chip connecting terminals and the non-conductive support layer. A top surface of the non-conductive support layer is disposed closer to a bottom surface of the second semiconductor chip than top surfaces of the plurality of upper pads are disposed to the bottom surface of the second semiconductor chip.

公开(公告)号：US20250125247A1

公开(公告)日：2025-04-17

申请号：US18779913

申请日：2024-07-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Jaeean Lee ,  Dongwon Kang ,  Jieun Park ,  Changyeon Song ,  Sunguk Lee

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L23/31 ,  H01L25/10

Abstract: An IC package includes a lower redistribution structure, a connection structure (with cavity) on the lower redistribution structure, a semiconductor chip in the cavity, a molding layer filling the cavity, covering the connection structure and the semiconductor chip, and having an upper through hole therein. An upper redistribution structure is provided that includes: an upper insulating layer on the molding layer, a first protrusion inside the upper through hole, and an upper redistribution pattern, which includes a first upper via pattern, inside the first protrusion. The upper through hole of the molding layer is located above the via structure of the connection structure, the first upper via pattern is electrically connected to the via structure of the connection structure, and a portion of the first upper line pattern of the upper redistribution structure is buried in the upper insulating layer.

公开(公告)号：US20250125245A1

公开(公告)日：2025-04-17

申请号：US18628890

申请日：2024-04-08

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hansae Lim

IPC: H01L23/498 ,  H01L23/00 ,  H01L23/31

Abstract: A semiconductor package includes a wiring substrate including a wiring pattern, a solder resist layer disposed on the wiring pattern and including an opening region, and a first penetrating contact disposed in the opening region of the solder resist layer. The semiconductor chip disposed in the opening region and connected to the wiring substrate. The molding portion includes a first portion covering the semiconductor chip and a second portion disposed below the semiconductor chip. The second portion includes a penetrating molding portion disposed in the first penetrating contact.

公开(公告)号：US20250125182A1

公开(公告)日：2025-04-17

申请号：US18628404

申请日：2024-04-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： HYUN HO CHOI ,  JAEHWAN KIM ,  YONG-HO BAEK ,  HYEOK-JIN JEONG ,  HO YUNG CHONG

IPC: H01L21/687 ,  H01L21/673

Abstract: Disclosed are substrate rotating apparatuses, substrate processing systems, and substrate processing methods. The substrate rotating apparatus comprises vertically arranged stages and a rotary driver that turns the stages upside down. The stage includes a lower support assembly and an upper support assembly adjacent to the lower support assembly. The lower support assembly includes a lower support member having a lower support surface that supports one surface of a substrate. The upper support assembly includes upper support members. The upper support members are spaced apart from each other in a horizontal direction. A substrate placement space is between the upper support members. The upper support member includes an upper support surface that supports another surface of the substrate. The upper support surface is inclined toward the substrate placement space and makes an acute angle with the horizontal direction.

公开(公告)号：US20250125163A1

公开(公告)日：2025-04-17

申请号：US18778009

申请日：2024-07-19

Applicant: Samsung Electronics Co., Ltd.

Inventor： Kyo-Eun LEE ,  Young Chul KWON

IPC: H01L21/67 ,  H01L21/687

Abstract: An apparatus for dicing a wafer includes a stage configured to receive a wafer, and move the wafer in a first direction, and a plurality of laser heads above the stage along the first direction, and as the stage moves the wafer in the first direction, the plurality of laser heads are configured to emit a plurality of laser beams onto the wafer along a plurality of cutting lines, the plurality of cutting lines extending in the first direction and each cutting line spaced apart from other cutting lines in a second direction, the second direction perpendicular to the first direction.

公开(公告)号：US20250124970A1

公开(公告)日：2025-04-17

申请号：US18905764

申请日：2024-10-03

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Miji Jang ,  Kyuseok Lee

IPC: G11C11/4091 ,  G11C11/4074 ,  G11C11/4094

Abstract: An offset compensated sense amplifier and a memory device including the same are disclosed. A sense amplifier for sensing and amplifying data stored in a memory cell includes a first sense amplifier circuit including first and second PMOS transistors connected to a first sensing driving signal line and a second sense amplifier circuit including first and second NMOS transistors connected to a second sensing driving signal line. The sense amplifier the sense amplifier is configured to perform an offset compensation operation before sensing and amplifying the data stored in the memory cell, the offset compensation operation including a first offset compensation operation based on a threshold voltage difference between the first NMOS transistor and the second NMOS transistor, and a second offset compensation operation based on a threshold voltage difference between the first PMOS transistor and the second PMOS transistor.