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公开(公告)号:US11968540B2
公开(公告)日:2024-04-23
申请号:US17340819
申请日:2021-06-07
Inventor: Thao Tran-Nhu Nguyen , Michael Rafat Souryal
IPC: H04W16/14 , H04W72/0453 , H04W72/541
CPC classification number: H04W16/14 , H04W72/0453 , H04W72/541
Abstract: Systems and methods for independently managing wireless transmission by individual spectrum access systems in a radio frequency spectrum shared by a plurality of spectrum access systems. An example method includes: receiving, by the spectrum access system, an interference budget from a sensor; determining, by the spectrum access system, secondary users managed by the spectrum access system in a radio frequency spectrum shared by a plurality of spectrum access systems; managing a move list for the spectrum access system independently of the other spectrum access systems in an absence of exchange of spectrum grant information with the other spectrum access systems; and determining the move list for the spectrum access system from a first moment and a second moment of an aggregate interference distribution such that the spectrum access system provides grants to its secondary users in a dynamic protection area of the spectrum access system.
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公开(公告)号:US11956601B2
公开(公告)日:2024-04-09
申请号:US17835478
申请日:2022-06-08
Inventor: Richard Albert Allen , Randall Paul Wagner , Qian Dong
IPC: H04R29/00
CPC classification number: H04R29/004
Abstract: An interferometric microphone calibrator for comparison calibrating a microphone, the interferometric microphone calibrator comprising: an interferometer in optical communication with a microphone and that produces an interferometer measurement light, communicates the interferometer measurement light to the microphone, and receives an interferometer backscattered light from the microphone, such that a sensitivity of a test microphone is interferometrically calibrated to a reference microphone from the interferometer backscattered light; a preamplifier-controller in electrical communication with the microphone, and that receives a driver signal from a microphone driver and drives the microphone driver; the microphone driver in electrical communication with the preamplifier-controller and that receives a driver control signal from a calibration controller and produces the driver signal based on the driver control signal; and a calibration controller in electrical communication with the microphone driver and that produces the driver control signal and communicates the driver control signal to the microphone driver.
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公开(公告)号:US11940714B2
公开(公告)日:2024-03-26
申请号:US17545451
申请日:2021-12-08
Applicant: University of Maryland, College Park , Government of the United States of America, as Represented by the Secretary of Commerce
Inventor: Ivan A. Burenkov , Sergey V. Polyakov
CPC classification number: G02F1/3534 , G02F1/313 , G02F1/365
Abstract: A quantum EIT-based optical switch includes a first waveguide, linear or nonlinear, a separate nonlinear waveguide evanescently coupled to the first waveguide, and a pump coupled to the nonlinear waveguide. A quantum STIRAP-based optical transduction device, which includes an auxiliary, intermediate spectral state for the quantum signal that aids efficient transduction of the quantum signal from the input spectral state to the output spectral state in a single device.
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84.
公开(公告)号:US11940276B2
公开(公告)日:2024-03-26
申请号:US17177895
申请日:2021-02-17
Inventor: John Edward Kitching , Elizabeth Ann Donley , Azure Lynn Hansen , Yun-Jhih Chen
IPC: G01C19/62 , G01B9/02015 , G01P15/093 , G21K1/06 , G21K1/12 , G01C19/64
CPC classification number: G01C19/62 , G01B9/0203 , G01P15/093 , G21K1/067 , G21K1/12 , G01C19/64
Abstract: An inertial point-source matter-wave atom interferometer gyroscope includes an analyzer that receives fringe images of gyroscope atoms and includes: a first fringe image that includes a first fringe phase, a second fringe image that includes a second fringe phase; and a third fringe image that includes a third fringe phase, wherein the first fringe phase, the second fringe phase, and the third fringe phase are different; a phase mapper of the analyzer that produces a interferometric phase map for the gyroscope atoms from the fringe images of the gyroscope atoms; and a fitter of the analyzer in communication with the phase mapper and that receives the interferometric phase map from the analyzer and determines inertial parameters of the gyroscope atoms from the interferometric phase map, the inertial parameters including an acceleration and a rotation rate of the inertial point-source matter-wave atom interferometer gyroscope relative to the gyroscope atoms.
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公开(公告)号:US11906350B2
公开(公告)日:2024-02-20
申请号:US17336964
申请日:2021-06-02
Inventor: Michael Gaitan , Jon Clement Geist , Benjamin James Reschovsky , Akobuije Douglas Eziani Chijioke
IPC: G01H9/00
CPC classification number: G01H9/002
Abstract: A calibration apparatus for calibrating a laser Doppler vibrometer includes: a frequency shifter stage that: receives, from the laser Doppler vibrometer, primary laser light; produces frequency shifted light; communicates the frequency shifted light to a reflector; receives frequency shifted light reflected by the reflector; produces secondary light; and communicates the secondary light to the laser Doppler vibrometer, such that the laser Doppler vibrometer receives the secondary light from the frequency shifter stage and produces a synthetic velocity shift from the secondary light; and the reflector that receives and reflects the frequency shifted light back to the frequency shifter stage.
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公开(公告)号:US11876211B2
公开(公告)日:2024-01-16
申请号:US17018898
申请日:2020-09-11
IPC: H01M4/134 , H01M10/0525 , H01M4/04 , H01M4/66 , H01M4/1395 , H01M50/409
CPC classification number: H01M4/134 , H01M4/0423 , H01M4/1395 , H01M4/661 , H01M10/0525 , H01M50/409
Abstract: A prelithiated lithium ion battery includes: ion beam implanted lithium; a cathode; and an anode disposed on the cathode and an electrolyte in electrical communication with the cathode and the anode, the cathode or the anode including the ion beam implanted lithium such that: when the cathode includes the ion beam implanted lithium, the ion beam implanted lithium is present in an absence of solid electrolyte interface composition in the cathode; and when the anode includes the ion beam implanted lithium, the ion beam implanted lithium is present in an absence of solid electrolyte interface composition in the anode.
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公开(公告)号:US20240014903A1
公开(公告)日:2024-01-11
申请号:US18035896
申请日:2021-11-08
Inventor: David Alexander Long , Benjamin James Reschovsky
IPC: H04B10/50 , H04B10/508 , H04B10/556
CPC classification number: H04B10/504 , H04B10/508 , H04B10/556
Abstract: Disclosed is a direct digital chirp synthesizer for generating a chirped optical frequency comb that includes: a direct digital synthesizer that receives a repetition frequency signal from a delay generator, receives a clock frequency from a frequency converter, produces a radiofrequency chirp waveform based on the repetition frequency signal and the clock frequency, and communicates the radiofrequency chirp waveform; and an electro optic modulator in electrical communication with the direct digital synthesizer and that receives the radiofrequency chirp waveform from the direct digital synthesizer, receives laser light, and produces the chirped optical frequency comb from the laser light based on the radiofrequency chirp waveform.
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88.
公开(公告)号:US11867775B2
公开(公告)日:2024-01-09
申请号:US17435807
申请日:2020-03-04
Applicant: UNIVERSITY OF MARYLAND, COLLEGE PARK , GOVERNMENT OF THE UNITED STATES OF AMERICA, AS REPRESENTED BY THE SECRETARY OF COMMERCE, NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY
Inventor: Randolph Elmquist , Albert Rigosi , Mattias Kruskopf
IPC: G01R33/00 , G01R33/035 , G01R33/07 , H10N60/81 , H10N60/85
CPC classification number: G01R33/0052 , G01R33/035 , G01R33/07 , H10N60/81 , H10N60/85
Abstract: A quantum Hall resistance apparatus is to improve resistance standards and includes a substrate, a graphene epitaxially grown on the substrate and having a plurality of first contact patterns at edges of the graphene, a plurality of contacts, each including a second contact pattern and configured to connect to a corresponding first contact pattern, and a protective layer configured to protect the graphene and to increase adherence between the first contact patterns and the second contact patterns. The contacts become a superconductor at a temperature lower than or equal to a predetermined temperature and under up to a predetermined magnetic flux density.
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公开(公告)号:US11860420B2
公开(公告)日:2024-01-02
申请号:US17674079
申请日:2022-02-17
Applicant: University of Maryland, College Park , Government of the United States of America, as Represented by the Secretary of Commerce
Inventor: Kartik Srinivasan , Xiyuan Lu
CPC classification number: G02B6/29341 , G02B6/122 , G02B6/12007 , G02B6/29338 , B82Y20/00 , G02F2203/15
Abstract: An optical cavity includes a ring defining an internal boundary and an external boundary, at least one of which is periodically modulated to define a gear-shaped configuration including a plurality of teeth, thereby enabling a plurality of slow-light modes. At least one physical defect may be defined within the periodically modulated internal boundary and/or external boundary to thereby enable at least one localized mode. At least one waveguide is coupled to the ring.
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公开(公告)号:US20230402816A1
公开(公告)日:2023-12-14
申请号:US18207731
申请日:2023-06-09
Inventor: Eric John Stanton , Nima Nader
CPC classification number: H01S5/0215 , H01S5/22
Abstract: Embodiments of the present invention relate to a wafer bonding method for heterogenous integration of multiple wafers to a carrier substrate and bonding multiple functional wafers to the substrate to transfer semiconductor thin films. A routing layer for electrical or optical signals is defined on the substrate before a first wafer is bonded to the substrate and is optionally buried with subsequent planarization. Functional ridges are lithographically defined and etched after the first wafer is bonded to the substrate and a thin film is transferred to the substrate. A portion of the wafer surface is then cleared to expose the initial bonding surface on the substrate. A second wafer is bonded to the resulting material by etching pockets in the second functional wafer at the locations of the functional ridges from the first wafer bond.
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