Interferometric microphone calibrator and comparison calibrating a microphone

    公开(公告)号:US11956601B2

    公开(公告)日:2024-04-09

    申请号:US17835478

    申请日:2022-06-08

    CPC classification number: H04R29/004

    Abstract: An interferometric microphone calibrator for comparison calibrating a microphone, the interferometric microphone calibrator comprising: an interferometer in optical communication with a microphone and that produces an interferometer measurement light, communicates the interferometer measurement light to the microphone, and receives an interferometer backscattered light from the microphone, such that a sensitivity of a test microphone is interferometrically calibrated to a reference microphone from the interferometer backscattered light; a preamplifier-controller in electrical communication with the microphone, and that receives a driver signal from a microphone driver and drives the microphone driver; the microphone driver in electrical communication with the preamplifier-controller and that receives a driver control signal from a calibration controller and produces the driver signal based on the driver control signal; and a calibration controller in electrical communication with the microphone driver and that produces the driver control signal and communicates the driver control signal to the microphone driver.

    WAFER BONDING METHOD FOR TRANSFERING THIN FILMS TO A SUBSTRATE

    公开(公告)号:US20230402816A1

    公开(公告)日:2023-12-14

    申请号:US18207731

    申请日:2023-06-09

    CPC classification number: H01S5/0215 H01S5/22

    Abstract: Embodiments of the present invention relate to a wafer bonding method for heterogenous integration of multiple wafers to a carrier substrate and bonding multiple functional wafers to the substrate to transfer semiconductor thin films. A routing layer for electrical or optical signals is defined on the substrate before a first wafer is bonded to the substrate and is optionally buried with subsequent planarization. Functional ridges are lithographically defined and etched after the first wafer is bonded to the substrate and a thin film is transferred to the substrate. A portion of the wafer surface is then cleared to expose the initial bonding surface on the substrate. A second wafer is bonded to the resulting material by etching pockets in the second functional wafer at the locations of the functional ridges from the first wafer bond.

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