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公开(公告)号：US20250078727A1
公开(公告)日：2025-03-06
申请号：US18029106
申请日：2022-06-21
Applicant: BOE Technology Group Co., Ltd.
Inventor： Jinfei NIU , Minghua XUAN , Can ZHANG , Can WANG , Ning CONG , Jingjing ZHANG , Xiao BAI
IPC: G09G3/32
Abstract: A pixel circuit, a driving method therefor, a display substrate and a display device are provided. The pixel circuit includes a drive circuit and a light emitting element connected in series between a first power supply terminal and a third power supply terminal; the drive circuit is used for providing a drive current and controlling a time length of conduction of a current path between the first power supply terminal and the third power supply terminal; the light emitting element is used for receiving the drive current in the current path and emitting light; the drive circuit includes a drive control sub-circuit, a light emitting control sub-circuit and a time-length control sub-circuit; the drive control sub-circuit is used for providing a drive current to the first node under control of the first scan signal terminal, the first data signal terminal and the second node.
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公开(公告)号：US20250006873A1
公开(公告)日：2025-01-02
申请号：US18260656
申请日：2022-06-20
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Wei LI , Mingxing WANG , Xiao ZHANG , Minghua XUAN , Can ZHANG , Can WANG , Dongliang ZHANG , Qian JIN , Xiang LI , Jingjing ZHANG , Jinfei NIU
Abstract: A chip structure is provided. The chip structure includes: a chip wafer unit and a color conversion layer unit arranged on a light-exit side of the chip wafer unit. The chip wafer unit includes a plurality of sub-pixel light-emitting function layers. The color conversion layer unit includes color conversion layers arranged on the light-exit side of the chip wafer unit. The chip structure further includes: an attaching layer, arranged between the chip wafer unit and the color conversion layer unit and configured to attach the chip wafer unit and the color conversion layer unit.
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公开(公告)号：US20250006774A1
公开(公告)日：2025-01-02
申请号：US18884221
申请日：2024-09-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ming YANG , Wei HAO , Qibing GU , Guofeng HU , Lingyun SHI , Minghua XUAN , Can ZHANG
Abstract: A light emitting plate, a wiring plate and a display device are provided. The light emitting plate includes light emitting units. Each light emitting unit includes a light emitting sub-unit including a connection line unit and a light emitting diode chip connected with the connection line unit. The connection line unit includes electrical contact pairs, and each electrical contact pairs includes a first electrode contact and a second electrode contact; in each connection line unit, the second electrode contacts are electrically connected with each other, the first electrode contacts are electrically connected with each other, and only one electrical contact pairs in each connection line unit is connected with the light emitting diode chip; in each connection line unit, at least two first electrode contacts are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts.
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公开(公告)号：US20240413274A1
公开(公告)日：2024-12-12
申请号：US18261680
申请日：2022-05-31
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Wei LI , Mingxing WANG , Qian SUN , Huajie YAN , Zhiqiang JIAO , Xuan LIANG , Qian JIN , Xiang LI , Can WANG , Minghua XUAN , Can ZHANG
Abstract: A chip structure is provided. The chip structure includes a chip wafer unit and a color conversion layer substrate unit arranged on a light-exit side of the chip wafer unit. The chip wafer unit includes a plurality of sub-pixel light-emitting functional layers. The color conversion layer substrate unit includes a color conversion layer arranged on the light-exit side of the chip wafer unit. The chip wafer unit further includes a first bonding layer, arranged between the sub-pixel light-emitting functional layers and the color conversion layer, and configured to bond the chip wafer unit and the color conversion layer substrate unit.
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公开(公告)号：US20240405172A1
公开(公告)日：2024-12-05
申请号：US18261958
申请日：2022-07-19
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Can ZHANG , Can WANG , Minghua XUAN , Xiaochuan CHEN , Ning CONG , Jinfei NIU , Jingjing ZHANG
Abstract: The present disclosure provides a light-emitting substrate. The light-emitting substrate includes a backboard, a light-emitting layer and a plurality of first optical bodies. The light-emitting layer is located on a side of the backboard; the light-emitting layer includes a plurality of light-emitting units, and the plurality of light-emitting units are arranged in an array. Each first optical body includes a first optical portion and a second optical portion; a gap between two adjacent light-emitting units is filled with the first optical portion, and the second optical portion is located on a side of the light-emitting layer away from the backboard, and is connected to the first optical portion. The second optical portion includes a first surface extending outwards from an edge of the first optical portion.
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Patent Agency Ranking
公开(公告)号：US20240284711A1
公开(公告)日：2024-08-22
申请号：US18018563
申请日：2022-02-23
Inventor： Ning CONG , Can ZHANG , Minghua XUAN , Jinfei NIU , Can WANG , Wei LI , Jingjing ZHANG , Xiaochuan CHEN
IPC: H10K59/121 , H10K59/12
CPC classification number: H10K59/1216 , H10K59/1201
Abstract: A display substrate, a preparation method therefor, and a display device. A display substrate includes a plurality of conductive layers disposed on a silicon-based substrate (101), a conductive layer includes a first sub-electrode plate (110) and a second sub-electrode plate (120), the first sub-electrode plate (110) and the second sub-electrode plate (120) form a first storage capacitor of a MOM capacitance structure, and another conductive layer comprises a third sub-electrode plate (130) and a fourth sub-electrode plate (140), the third sub-electrode plate (130) and the fourth sub-electrode plate (140) form a second storage capacitor of a MOM capacitance structure; the first sub-electrode plate (110) and the fourth sub-electrode plate (140) constitute a third storage capacitor of a MIM capacitance structure, and/or the second sub-electrode plate (120) and the third sub-electrode plate (130) constitute a fourth storage capacitor of a MIM capacitance structure.
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公开(公告)号：US20240251631A1
公开(公告)日：2024-07-25
申请号：US18004756
申请日：2022-02-17
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Can ZHANG , Xiaochuan CHEN , Dacheng ZHANG
IPC: H10K59/00 , H10K59/122 , H10K59/35
CPC classification number: H10K59/771 , H10K59/122 , H10K59/35
Abstract: An embodiment of the present disclosure provides a display substrate comprising a substrate comprising a display area and a peripheral area; a plurality of sub-pixels spaced apart by a pixel defining layer on the substrate and located in the display area, wherein the sub-pixels comprise: a first electrode; a first light-emitting layer; and a charge generating layer, wherein the pixel defining layer has a first opening exposing the first electrode, wherein an edge portion of the pixel defining layer adjacent to the first opening covers an edge portion of the first electrode, wherein the charge generating layer has a second opening, and an orthographic projection of the second opening on the substrate at least partially overlaps with an orthographic projection of the pixel defining layer on the substrate, wherein the charge generating layer has an edge portion adjacent to the second opening.
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公开(公告)号：US20240079443A1
公开(公告)日：2024-03-07
申请号：US18507284
申请日：2023-11-13
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Ming YANG , Wei HAO , Qibing GU , Guofeng HU , Lingyun SHI , Minghua XUAN , Can ZHANG
CPC classification number: H01L27/156 , H01L33/387 , H01L33/62
Abstract: A light emitting plate, a wiring plate and a display device are provided. The light emitting plate includes light emitting units. Each light emitting unit includes a light emitting sub-unit including a connection line unit and a light emitting diode chip connected with the connection line unit. The connection line unit includes electrical contact pairs, and each electrical contact pairs includes a first electrode contact and a second electrode contact; in each connection line unit, the second electrode contacts are electrically connected with each other, the first electrode contacts are electrically connected with each other, and only one electrical contact pairs in each connection line unit is connected with the light emitting diode chip; in each connection line unit, at least two first electrode contacts are arranged adjacent to each other, and at least two first electrode contacts are arranged between at least two second electrode contacts.
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公开(公告)号：US20230197007A1
公开(公告)日：2023-06-22
申请号：US18167166
申请日：2023-02-10
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Can WANG , Han YUE , Can ZHANG , Minghua XUAN , Ming YANG
IPC: G09G3/3241
CPC classification number: G09G3/3241 , G09G2310/08
Abstract: Disclosed are a pixel circuit and a driving method thereof, an array substrate and a display apparatus. The pixel circuit includes a pixel sub-circuit. The pixel sub-circuit includes a first adjusting circuit and a second adjusting circuit. The first adjusting circuit is configured to receive a first data signal and a light-emitting control signal to control a magnitude of a driving current used for driving a light-emitting element to emit light; the second adjusting circuit is configured to receive a second data signal and a time control signal to control a time duration in which the driving current is applied to the light-emitting element; and the time control signal changes within a time period during which the light-emitting control signal allows the driving current to be generated.
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公开(公告)号：US20230163157A1
公开(公告)日：2023-05-25
申请号：US17634287
申请日：2021-03-11
Applicant: BOE TECHNOLOGY GROUP CO., LTD.
Inventor： Can WANG , Wei LI , Lijun YUAN , Jingjing ZHANG , Can ZHANG , Jinfei NIU , Ning CONG , Minghua XUAN , Xiaochuan CHEN , Xue DONG , Qi QI
IPC: H01L27/15
CPC classification number: H01L27/156
Abstract: A display substrate and a display device are provided. The display substrate includes light emitting diode chips, each light emitting diode chip includes light emitting units which respectively emit light of different colors, each light emitting unit includes a first electrode, a light emitting layer, a base and a second electrode, and the base and the second electrode are respectively located at both sides of the light emitting layer. In each light emitting diode chip, the light emitting units share the base and the first electrode, the light emitting layers of the light emitting units emit light of the same color, and at least one light emitting unit further includes a first color conversion layer located at a side of the base away from the light emitting layer, so as to convert first color light emitted by the light emitting layer into second color light.
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