Methods of fabricating high density mask ROM cells
    81.
    发明授权
    Methods of fabricating high density mask ROM cells 有权
    制造高密度掩膜ROM细胞的方法

    公开(公告)号:US06673682B2

    公开(公告)日:2004-01-06

    申请号:US10144874

    申请日:2002-05-13

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: H01L27/11253 H01L27/112 H01L27/1126

    Abstract: Methods for making integrated circuit devices, such as high density memory devices and memory devices exhibiting dual bits per cell, include forming multiple oxide fences on a semiconductor substrate between multiple polybars. The oxide fences create a hole pre-code pattern that facilitates ion implantation into trenches disposed between the polybars. The holes, or voids, formed by the oxide fences provide greater control of the critical dimension of ion implantation, for example, the critical dimension of the trench sidewalls. Semiconductor devices used in the manufacture of memory devices include the oxide fences during the manufacturing process.

    Abstract translation: 用于制造诸如高密度存储器件和表现出每个单元双位的存储器件的集成电路器件的方法包括在多个多边形之间的半导体衬底上形成多个氧化物围栅。 氧化物栅栏产生一个孔预编码图案,便于将离子注入到设置在多边形之间的沟槽中。 由氧化物栅栏形成的孔或空隙提供了对离子注入的关键尺寸(例如沟槽侧壁的临界尺寸)的更大控制。 用于制造存储器件的半导体器件包括在制造过程中的氧化物栅栏。

    Method of repairing a phase shifting mask

    公开(公告)号:US06607674B2

    公开(公告)日:2003-08-19

    申请号:US09726459

    申请日:2000-11-30

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    Abstract: A phase shifting mask repair process is described. The process uses an etching gas or a hydrofluoric acid solution to etch the quartz substrate and the characteristics of the phase shifter layer being only slightly etched when clean with a NH3/H2O2/H2O2 solution to calculate and adjust the respective processing time accordingly. As a result, the phase difference between the quartz substrate and the MoSiON phase shifter layer stays relatively the same before and after the repair process.

    Method for shrinking critical dimension

    公开(公告)号:US06569761B2

    公开(公告)日:2003-05-27

    申请号:US09903667

    申请日:2001-07-13

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    Abstract: In accordance with the present invention, a method is provided for shrinking critical dimension in semiconductor processes. This method comprises a step of performing an over-exposure process to a photosensitive layer to form a patterned photosensitive layer on a substrate by using a patterned reticle. Due to the unexposed region of the photosensitive layer being diminished by over-exposure the critical dimension is shrunk. Then, a sacrificial layer is applied for the purpose of pattern reverse-transferring. Next, the patterned photosensitive layer is removed such that the pattern is transferred to the sacrificial layer with a shrunk critical dimension. In cooperation of the present exposure technology with the present invention, the shrinkage of a critical dimension is accomplished, for example, using an I-line exposure light source in a critical dimension of 0.25 &mgr;m process, or using a deep UV (ultraviolet) exposure light source in a critical dimension of 0.13 &mgr;m process.

    Method for forming protrusive alignment-mark

    公开(公告)号:US06562691B2

    公开(公告)日:2003-05-13

    申请号:US09799003

    申请日:2001-03-06

    Abstract: A method for forming a protrusive alignment-mark in semiconductor devices is disclosed. A photolithography process is performed to form a photoresist layer on a substrate wherein the substrate has an element region and an alignment region, and the photoresist layer has an element photoresist region and an alignment photoresist region. Afterwards, a first dielectric layer is deposited on the element photoresist region and the alignment photoresist region. The excess portion of first dielectric layer above the photoresist layer is removed such that the photoresist layer is coplanar with the first dielectric layer and thus the photoresist layer is exposed. The photoresist layer on the element region and said alignment region is stripped to form a protrusive alignment-mark on the alignment region.

    Method of fabricating gate
    85.
    发明授权

    公开(公告)号:US06448605B1

    公开(公告)日:2002-09-10

    申请号:US09924904

    申请日:2001-08-08

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: H01L28/92 H01L21/28273 H01L21/32139 H01L29/66545

    Abstract: A method of fabricating a gate is described. A first dielectric layer having a first opening is formed on a substrate. A gate dielectric layer is formed in the opening. A lower portion of a floating gate is formed on the gate dielectric layer. A source/drain region is formed in the substrate beside the lower portion of the floating gate. A conductive layer is formed on the first dielectric layer to completely fill the first opening. The conductive layer is patterned to form a second opening in the conductive layer. The second opening is above the first opening and does not expose the first dielectric layer. The second opening has a tapered sidewall and a predetermined depth. A mask layer is formed to cover the conductive layer and fill the second opening. The mask layer outside the second opening is removed to expose the conductive layer. A portion of the mask layer is removed to leave a first etching mask layer in the second opening. An anisotropic etching process using the first etching mask layer as a mask is performed to etch the conductive layer. An upper portion of the floating gate is formed. The first dielectric layer is exposed. The first etching mask is removed. Thereafter, a dielectric layer between gates and a control gate is formed over the floating gate.

    Photosensitive material and method of photolithography
    87.
    发明授权
    Photosensitive material and method of photolithography 有权
    感光材料和光刻方法

    公开(公告)号:US09261786B2

    公开(公告)日:2016-02-16

    申请号:US13437674

    申请日:2012-04-02

    Applicant: Ching-Yu Chang

    Inventor: Ching-Yu Chang

    CPC classification number: G03F7/0397 G03F7/2041 G03F7/26 G03F7/325

    Abstract: Methods and materials directed to solubility of photosensitive material in negative tone developer are described. The photosensitive material may include greater than 50% acid labile groups as branches to a polymer chain. In another embodiment, a photosensitive material, after exposure or irradiation, is treated. Exemplary treatments include applying a base to the photosensitive material.

    Abstract translation: 描述了涉及感光材料在负色调显影剂中的溶解度的方法和材料。 感光材料可以包括大于50%的酸不稳定基团作为聚合物链的分支。 在另一个实施方案中,在曝光或照射之后对感光材料进行处理。 示例性的处理包括将基底施加到感光材料上。

    Photoresist and patterning process
    88.
    发明授权
    Photoresist and patterning process 有权
    光刻胶和图案化工艺

    公开(公告)号:US08956806B2

    公开(公告)日:2015-02-17

    申请号:US12562761

    申请日:2009-09-18

    CPC classification number: G03F7/0045 G03F7/0382 G03F7/0392 G03F7/091 G03F7/11

    Abstract: A method and material layer for forming a pattern are disclosed. The method includes providing a substrate; forming a first material layer over the substrate; forming a second material layer over the first material layer, wherein the second material layer comprises a photoacid generator and a photobase generator; and exposing one or more portions of the second material layer.

    Abstract translation: 公开了用于形成图案的方法和材料层。 该方法包括提供基板; 在所述衬底上形成第一材料层; 在所述第一材料层上形成第二材料层,其中所述第二材料层包括光酸产生剂和光碱产生剂; 以及暴露所述第二材料层的一个或多个部分。

    Method and composition of a dual sensitive resist
    89.
    发明授权
    Method and composition of a dual sensitive resist 有权
    双敏感抗蚀剂的方法和组成

    公开(公告)号:US08741551B2

    公开(公告)日:2014-06-03

    申请号:US13442687

    申请日:2012-04-09

    CPC classification number: G03F7/095 G03F7/0045 G03F7/0392

    Abstract: The present disclosure provides a sensitive material. The sensitive material includes a polymer that turns soluble to a base solution in response to reaction with acid; a plurality of photo-base generators (PBGs) that decompose to form base in response to radiation energy; and a thermal sensitive component that generates acid in response to thermal energy.

    Abstract translation: 本公开提供敏感材料。 敏感材料包括响应于与酸的反应而将可溶于碱溶液的聚合物; 响应于辐射能分解形成底座的多个光源发生器(PBG); 以及响应于热能产生酸的热敏组分。

    Apparatus and method for immersion lithography
    90.
    发明授权
    Apparatus and method for immersion lithography 有权
    浸没式光刻装置及方法

    公开(公告)号:US08564759B2

    公开(公告)日:2013-10-22

    申请号:US11697469

    申请日:2007-04-06

    CPC classification number: B08B3/12 G03F7/2041 G03F7/70341 G03F7/70925

    Abstract: A lithography apparatus includes an imaging lens module, a substrate table positioned underlying the imaging lens module and configured to hold a substrate, and a cleaning module adapted to clean the lithography apparatus. The cleaning module comprises one inlet and one outlet for providing a cleaning fluid to and from a portion of the lithography apparatus to be cleaned, and an ultrasonic unit configured to provide ultrasonic energy to the cleaning fluid.

    Abstract translation: 光刻设备包括成像透镜模块,位于成像透镜模块下方并构造成保持基板的基板台,以及适于清洁光刻设备的清洁模块。 清洁模块包括一个入口和一个出口,用于向待清洁的光刻设备的一部分提供清洁流体;以及超声波单元,被配置为向清洁流体提供超声波能量。

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