System and method for wafer back-grinding control
    81.
    发明授权
    System and method for wafer back-grinding control 有权
    晶圆背面磨削控制系统及方法

    公开(公告)号:US08298041B2

    公开(公告)日:2012-10-30

    申请号:US12900683

    申请日:2010-10-08

    IPC分类号: B24B49/00 B24B51/00

    摘要: In a system or method for controlling wafer back-grinding, a chuck table has a surface for supporting a semiconductor wafer during a back-grinding process, one or more holes in the surface, and one or more sensors disposed in the one or more holes for monitoring a parameter during back-grinding. A computer-implemented process control tool is coupled to receive one or mote outputs from the one or more sensors and control the back-grinding process based on the received one or more outputs.

    摘要翻译: 在用于控制晶片背面磨削的系统或方法中,卡盘台具有用于在后磨削过程中支撑半导体晶片的表面,表面中的一个或多个孔以及设置在一个或多个孔中的一个或多个传感器 用于在后研磨期间监测参数。 计算机实现的过程控制工具被耦合以从一个或多个传感器接收一个或微尘输出,并且基于所接收的一个或多个输出来控制背面磨削过程。

    CONTROL METHOD FOR STEREOLITHOGRAPHY STRUCTURE
    82.
    发明申请
    CONTROL METHOD FOR STEREOLITHOGRAPHY STRUCTURE 有权
    立体结构的控制方法

    公开(公告)号:US20120257175A1

    公开(公告)日:2012-10-11

    申请号:US13438276

    申请日:2012-04-03

    IPC分类号: G03B35/14

    摘要: Disclosed is a control method for stereolithography structure, including the steps of: providing a stereolithography structure including a main circuit system, an interface system, and a USB transmission interface. The main circuit system controls the interface system and the interface system includes a printing driving platform for allowing an user to operate the stereolithography structure; providing a computer system including a data transmission platform for generating printing data by performing a slicing operation according to operational instructions and converting slicing process data of a 3-D object into 2-D slicing printing format image data; and transmitting and receiving the 2-D slicing printing format image data through the USB transmission interface, and deciphering data and re-formatting data, in order to finish pre-planning procedure of driving operation, thereby transmitting data to the printing driving platform to drive the printing driving platform to finish object forming operation by ink spraying operations.

    摘要翻译: 公开了一种用于立体光刻结构的控制方法,包括以下步骤:提供包括主电路系统,接口系统和USB传输接口的立体光刻结构。 主电路系统控制接口系统,接口系统包括用于允许用户操作立体光刻结构的打印驱动平台; 提供一种计算机系统,包括用于通过根据操作指令执行切片操作来生成打印数据的数据传输平台,并将3-D对象的切片处理数据转换为2-D切片打印格式图像数据; 通过USB传输接口发送和接收2-D分片打印格式的图像数据,解密数据和重新格式化数据,以完成驾驶操作的预先规划过程,从而将数据传输到打印驱动平台以驱动 打印驱动平台通过喷墨操作完成物体成型操作。

    Efficient and consistent software transactional memory
    83.
    发明授权
    Efficient and consistent software transactional memory 有权
    高效一致的软件事务内存

    公开(公告)号:US08060482B2

    公开(公告)日:2011-11-15

    申请号:US11648012

    申请日:2006-12-28

    IPC分类号: G06F7/00 G06F17/00 G06F17/30

    摘要: A method and apparatus for efficient and consistent validation/conflict detection in a Software Transactional Memory (STM) system is herein described. A version check barrier is inserted after a load to compare versions of loaded values before and after the load. In addition, a global timestamp (GTS) is utilized to track a latest committed transaction. Each transaction is associated with a local timestamp (LTS) initialized to the GTS value at the start of a transaction. As a transaction commits it updates the GTS to a new value and sets versions of modified locations to the new value. Pending transactions compare versions determined in read barriers to their LTS. If the version is greater than their LTS indicating another transaction has committed after the pending transaction started and initialized the LTS, then the pending transaction validates its read set to maintain efficient and consistent transactional execution.

    摘要翻译: 这里描述了用于在软件事务存储器(STM)系统中有效且一致的验证/冲突检测的方法和装置。 在加载之后插入版本检查障碍,以便在加载之前和之后比较加载值的版本。 此外,使用全局时间戳(GTS)来跟踪最近提交的事务。 每个事务与在事务开始时初始化为GTS值的本地时间戳(LTS)相关联。 作为事务提交,将GTS更新为新值,并将修改的位置的版本设置为新值。 待处理的交易将比较其在LTS阅读障碍中确定的版本。 如果版本大于其LTS,指示在挂起事务启动并初始化LTS之后另一个事务已经提交,则挂起的事务会验证其读取集合以保持有效且一致的事务执行。

    Multiband Mobile Communication Device and Antenna Thereof
    84.
    发明申请
    Multiband Mobile Communication Device and Antenna Thereof 有权
    多频段移动通信设备及其天线

    公开(公告)号:US20110095949A1

    公开(公告)日:2011-04-28

    申请号:US12648341

    申请日:2009-12-29

    IPC分类号: H01Q1/24

    摘要: The present invention is related to a multiband mobile communication device. The mobile communication device has a ground plane and an antenna. The antenna is disposed on a dielectric substrate. The antenna comprises a monopole, a shorted radiating portion, a first radiating branch, and a second radiating branch. The monopole comprises a feeding end, and the feeding end is the feeding point of the antenna. The shorted radiating portion has a shorting end electrically connected to the ground plane, and its other end is left open. The shorted radiating portion is extended along the monopole and has a coupling gap to the monopole. The first radiating branch has an end electrically connected to the shorted radiating portion, and its other end is left open. The first radiating branch is extended toward the shorting end of the shorted radiating portion and located on the opposite side of the monopole. The second radiating branch has an end electrically connected to the shorted radiating portion, and its other end is left open. The second radiating branch is extended along the first radiating branch, with the first radiating branch located between the second radiating branch and the shorted radiating portion.

    摘要翻译: 本发明涉及一种多频带移动通信设备。 移动通信设备具有接地平面和天线。 天线设置在电介质基板上。 天线包括单极子,短路辐射部分,第一辐射支路和第二辐射支路。 单极子包括馈电端,馈电端是天线的馈电点。 短路辐射部分具有电气连接到接地平面的短路端,并且其另一端保持断开。 短路辐射部分沿着单极子延伸并且具有与单极子的耦合间隙。 第一辐射支路具有电连接到短路辐射部分的端部,并且其另一端保持打开。 第一辐射支路延伸到短路辐射部分的短路端并且位于单极子的相反侧。 第二辐射支路具有电连接到短路辐射部分的端部,并且其另一端保持打开。 第二辐射支路沿着第一辐射支路延伸,第一辐射支路位于第二辐射支路和短路辐射部分之间。

    Reducing the Bandwidth of Sampler Loads in Shaders
    85.
    发明申请
    Reducing the Bandwidth of Sampler Loads in Shaders 有权
    降低着色器中采样器负载的带宽

    公开(公告)号:US20110037769A1

    公开(公告)日:2011-02-17

    申请号:US12540424

    申请日:2009-08-13

    IPC分类号: G06T15/00

    CPC分类号: G06T15/005

    摘要: Bandwidth may be conserved in messages transferred between a shader and a sampler by converting loads in array of structures format to structure of arrays format. More particularly, four four channel loads in array of structures format may be combined into a single eight channel message in structure of arrays format. Then, the eight channel message in structure of arrays format may be converted back to array of structures format.

    摘要翻译: 通过将结构数组中的负载转换为数组格式的结构,可以在着色器和采样器之间传输的消息中节省带宽。 更具体地,结构格式阵列中的四个四通道负载可以组合成阵列格式结构的单个八通道消息。 然后,数组格式结构中的八通道消息可以转换回结构格式的数组。

    Method of fabricating silicon carbide (SiC) layer
    86.
    发明授权
    Method of fabricating silicon carbide (SiC) layer 有权
    制造碳化硅(SiC)层的方法

    公开(公告)号:US07763529B2

    公开(公告)日:2010-07-27

    申请号:US12585811

    申请日:2009-09-25

    摘要: A method of fabricating a silicon carbide (SiC) layer is disclosed, which comprises steps: (S1) heating a silicon-based substrate at a temperature of X ° C.; (S2) carburizating the silicon-based substrate with a first hydrocarbon-containing gas at a temperature of Y ° C. to form a carbide layer on the silicon-based substrate; (S3) annealing the silicon-based substrate with the carbide layer thereon at a temperature of Z ° C.; and (S4) forming a silicon carbide layer on the carbide layer with a second hydrocarbon-containing gas and a silicon-containing gas at a temperature of W ° C.; wherein, X is 800 to 1200; Y is 1100 to 1400; Z is 1200 to 1500; W is 1300 to 1550; and X

    摘要翻译: 公开了一种制造碳化硅(SiC)层的方法,其包括步骤:(S1)在X℃的温度下加热硅基衬底; (S2)在温度为Y℃的情况下用第一含烃气体对硅系基板进行渗碳,在硅系基板上形成碳化物层; (S3)在Z℃的温度下使其碳化物层退火硅基基板。 和(S4)在温度为W℃的第二含烃气体和含硅气体的碳化物层上形成碳化硅层; 其中,X为800〜1200; Y为1100〜1400; Z为1200〜1500; W为1300〜1550; 和X

    Dustproof cover and electronic apparatus
    87.
    发明授权
    Dustproof cover and electronic apparatus 失效
    防尘盖和电子设备

    公开(公告)号:US07572993B2

    公开(公告)日:2009-08-11

    申请号:US11649851

    申请日:2007-01-05

    IPC分类号: H01R13/44

    CPC分类号: H01R13/5213 H01R13/447

    摘要: A dustproof cover is used in conjunction with a casing, which at least has a first opening, a second opening, a first engaging part and a first connecting part. The dustproof cover includes a first dustproof part, a second dustproof part, a second engaging part and a second connecting part. The first dustproof part corresponds to the first opening of the casing. The second dustproof part corresponds to the second opening of the casing. The second engaging part corresponds to the first engaging part of the casing. The second engaging part is located between the first dustproof part and the second dustproof part. The second connecting part is connected with the first connecting part of the casing. The first dustproof part is located between the second engaging part and the second connecting part. In addition, an electronic apparatus including the dustproof cover is also provided.

    摘要翻译: 防尘罩与壳体一起使用,该壳体至少具有第一开口,第二开口,第一接合部分和第一连接部分。 防尘盖包括第一防尘部,第二防尘部,第二接合部和第二连接部。 第一防尘部对应于壳体的第一开口。 第二防尘部对应于壳体的第二开口。 第二接合部对应于壳体的第一接合部。 第二接合部位于第一防尘部和第二防尘部之间。 第二连接部与壳体的第一连接部连接。 第一防尘部位于第二接合部和第二连接部之间。 此外,还提供了包括防尘罩的电子设备。

    Technique for providing service processor access to control and status registers of a module
    88.
    发明申请
    Technique for providing service processor access to control and status registers of a module 有权
    提供服务处理器访问模块的控制和状态寄存器的技术

    公开(公告)号:US20070240007A1

    公开(公告)日:2007-10-11

    申请号:US11313437

    申请日:2005-12-20

    申请人: Han Kim Wei-Yu Chen

    发明人: Han Kim Wei-Yu Chen

    IPC分类号: G06F1/12

    CPC分类号: G06F1/12

    摘要: A technique for providing service processor (SP) access to registers, e.g., control and status registers (CSRs), located within hardware modules of a computer system, ensures access to the CSRs within a predetermine time period. The computer system includes a host module (HM) and a plurality of client modules (CMs). The CMs each include one or more associated registers, and each of the CMs is separately addressable. At least one of the CMs operates at a different clock frequency than the remaining CMs and includes a clock synchronizer, which provides a clock signal to facilitate reading of or writing to the associated registers of the CM by the HM.

    摘要翻译: 提供服务处理器(SP)访问位于计算机系统的硬件模块内的寄存器(例如控制和状态寄存器(CSR))的技术确保在预定时间段内访问CSR。 计算机系统包括主机模块(HM)和多个客户端模块(CM)。 CM各自包括一个或多个相关联的寄存器,并且每个CM是单独可寻址的。 CM中的至少一个以与剩余的CM不同的时钟频率工作,并且包括时钟同步器,该时钟同步器提供时钟信号以促进HM的相关寄存器的读取或写入。

    Wafer bonding method
    89.
    发明申请
    Wafer bonding method 有权
    晶圆接合法

    公开(公告)号:US20070148911A1

    公开(公告)日:2007-06-28

    申请号:US11432632

    申请日:2006-05-12

    IPC分类号: H01L21/30

    CPC分类号: H01L21/187 H01L33/0079

    摘要: A wafer bonding method, comprising steps of: coating a medium layer respectively on the surfaces of two wafers; removing impurities formed on the surface of each medium layer; laminating the two wafers while enabling the surface coated with the medium layer of one of the two wafers to face the surface coated with the medium layer of another wafer; and applying an ultra-sonic oscillation and a bonding pressure upon the laminated wafers for bonding the two wafers.

    摘要翻译: 一种晶片接合方法,包括以下步骤:分别在两个晶片的表面上涂覆介质层; 去除形成在每个介质层表面上的杂质; 层压两个晶片同时使得涂覆有两个晶片之一的介质层的表面面对涂覆有另一晶片的介质层的表面; 以及在层叠的晶片上施加超声波振荡和接合压力以接合两个晶片。