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公开(公告)号:US11235328B2
公开(公告)日:2022-02-01
申请号:US16494827
申请日:2017-04-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , Viktor Shkolnikov , Chien-Hua Chen
IPC: B01L3/00
Abstract: An apparatus includes a polymer base layer having a surface. A die that includes a fluid manipulation surface that is substantially coplanar with the surface of the polymer base layer. The die includes a control electrode to generate an electric field to perform microfluidic manipulation of fluid across the fluid manipulation surface of the die.
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公开(公告)号:US11225074B2
公开(公告)日:2022-01-18
申请号:US16500431
申请日:2017-09-11
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Chien-Hua Chen
Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber, an opening, and a fluid actuator disposed within the ejection chamber. Each nozzle also includes an inlet passage to deliver fluid into the ejection chamber and an outlet passage to deliver fluid out of the ejection chamber. The fluidic ejection die also includes an array of channels divided into inlet channels and outlet channels. Each inlet channel is fluidly connected to a respective plurality of inlet passages and each outlet channel is fluidly connected to a respective plurality of outlet passages.
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公开(公告)号:US20210354457A1
公开(公告)日:2021-11-18
申请号:US16956353
申请日:2019-02-06
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Michael W. Cumbie , James Michael Gardner , Scott A. Linn , George H. Corrigan, III
Abstract: A print component integrated circuitry package includes a number of temperature sensors where each of the plurality of the temperature sensors is disposed in a corresponding temperature region of an integrated circuitry. In an example, an analog sense bus conductively connects to all of the plurality of temperature sensors and an external sensor pad that is to connect to a corresponding print controller contact.
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公开(公告)号:US20210323312A1
公开(公告)日:2021-10-21
申请号:US17251263
申请日:2018-11-14
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie
Abstract: In one example in accordance with the present disclosure, a fluidic die assembly is described. The fluidic die assembly includes a rigid substrate having a bend therein. A fluidic die is disposed on the rigid substrate. The fluidic die is to eject fluid from a reservoir fluidly coupled to the fluidic die. The fluidic die includes an array of ejection subassemblies. Each ejection subassembly includes an ejection chamber to hold a volume of fluid, an opening, and a fluid actuator to eject a portion of the volume of fluid through the opening. The fluidic die assembly also includes an electrical interface disposed on the rigid substrate to establish an electrical connection between the fluidic die and a controller. The fluidic die and the electrical interface are disposed on a same surface on opposite sides of the bend.
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公开(公告)号:US20210316553A1
公开(公告)日:2021-10-14
申请号:US17273333
申请日:2018-11-21
Applicant: Hewlett-Packard Development Company, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie
Abstract: A fluid ejection module may include a plurality of fluid ejection dies coupled to a thermoset material and singulated, and a thermoplastic material coupled to the singulated, fluid ejection dies. The thermoplastic material may be bent to form a curvature in the fluid ejection module.
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公开(公告)号:US20210291547A1
公开(公告)日:2021-09-23
申请号:US17340570
申请日:2021-06-07
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Si-Iam Choy , Michael W. Cumbie , Chien-Hua Chen , Jeffrey R. Pollard
IPC: B41J2/18
Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.
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公开(公告)号:US11009383B2
公开(公告)日:2021-05-18
申请号:US16092572
申请日:2016-04-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Michael W. Cumbie , Chien-Hua Chen , Greg Scott Long
Abstract: In one example in accordance with the present disclosure a fluid property sensing device is described. The fluid property sensing device includes a substrate having a trench formed therein. The trench includes a bottom surface and opposite side surfaces. A first electrode is disposed on a first side surface of the trench and a second electrode is disposed on a second side surface of the trench. The first electrode and second electrode form a capacitor to measure a complex impedance of a fluid that fills a space between the first electrode and the second electrode. This complex impedance indicates a property of the fluid. A fluid level sensing die, having a number of fluid level sensing components disposed thereon, may be attached to the substrate, preferably in such a way that the fluid level sensing die is surrounded by the trench. In this way the surface area of the electrodes provided in the trench can be increased. The number of level sensing components may be thermal sensing components.
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公开(公告)号:US11009382B2
公开(公告)日:2021-05-18
申请号:US16092531
申请日:2016-07-21
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Robert N. K. Browning
Abstract: In one example a liquid level sensor is described. The sensor includes a carrier and a liquid level sensing interface disposed on the carrier. The liquid level sensing interface includes a number of liquid level sensing devices disposed on an elongated strip. The number of liquid level sensing devices detect a liquid level in a liquid container. The liquid level sensing interface also includes a number of thermal isolation components formed on the elongated strip to thermally isolate adjacent liquid level sensing devices.
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公开(公告)号:US10994541B2
公开(公告)日:2021-05-04
申请号:US16050912
申请日:2018-07-31
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Arun K. Agarwal
Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding. A fluid feed hole is formed through the micro device, and a saw defined fluid channel is cut through the molding to fluidically couple the fluid feed hole with the channel.
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公开(公告)号:US10946658B2
公开(公告)日:2021-03-16
申请号:US16737279
申请日:2020-01-08
Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
Inventor: Chien-Hua Chen , Michael W. Cumbie , Zhuqing Zhang
Abstract: Encapsulating a bonded wire with low profile encapsulation includes applying encapsulation over a bonded wire that is connected to a die on a first end and to a circuit component on a second end and truncating a shape of the encapsulation to form a truncated shape.
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