公开(公告)号：US20220095468A1

公开(公告)日：2022-03-24

申请号：US17543690

申请日：2021-12-06

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Juha Paavola ,  Mark Carbone ,  Shantanu Kulkarni ,  Mikko Makinen ,  Gustavo Fricke

IPC: H05K5/03 ,  H05K5/02 ,  G06F1/16 ,  H05K7/20

Abstract: Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.

公开(公告)号：US11237643B2

公开(公告)日：2022-02-01

申请号：US16713605

申请日：2019-12-13

Applicant: Intel Corporation

Inventor： Shantanu D. Kulkarni ,  Jeff Ku ,  James Okuley

IPC: G06F3/02 ,  G06F1/16

Abstract: Apparatus, devices, systems, methods, and articles of manufacture are disclosed for physical keyboards with multi-display computing devices. An example computing device includes a support plate, a first display hingedly coupled to the support plate, and a physical keyboard hingedly coupled to the support plate.

公开(公告)号：US11209861B2

公开(公告)日：2021-12-28

申请号：US16083796

申请日：2016-04-01

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Christopher J. Hamlin ,  Ivan By Wang ,  Simon Tsai

IPC: G06F1/16 ,  H02J7/02 ,  G06F3/02 ,  G06F1/26

Abstract: Methods and apparatus relating to a dual side dockable keyboard base with bidirectional wireless charging function for 2 in 1 devices are described. In an embodiment, a 2 in 1 device base provides data input functionality to a tablet portion of the 2 in 1 device and/or wireless charging functionality. Other embodiments are also disclosed and claimed.

公开(公告)号：US20210329816A1

公开(公告)日：2021-10-21

申请号：US17358271

申请日：2021-06-25

Applicant: Intel Corporation

Inventor： Gaurav Patankar ,  Ruander Cardenas ,  Mark Angus MacDonald ,  Jeff Ku

IPC: H05K7/20

Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a heat pipe with a liquid reservoir. The heat pipe with a liquid reservoir can include a main heat transfer portion that includes wick material and a vapor channel and a reservoir portion that includes the wick material where the wick material in the reservoir portion occupies at least about fifteen percent more of a volume of the reservoir portion than a percentage of a volume that the wick material occupies in the main heat transfer portion. In an example, the reservoir portion holds surplus liquid that is used when the main heat transfer portion starts to experience dryout.

公开(公告)号：US11153990B2

公开(公告)日：2021-10-19

申请号：US16231169

申请日：2018-12-21

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Tim Liu ,  Gerry Juan ,  Jason Y. Jiang

IPC: H05K7/20 ,  G06F1/20 ,  G06F1/08 ,  H05K1/02

Abstract: In one aspect, an apparatus comprises a housing, a heat-generating component, a heat spreader, and a heat-transfer pipe. The housing forms a cavity in which the heat-generating component is located. The heat spreader is operable to distribute heat over a portion of the housing. The heat-transfer pipe is pivotally coupled to the heat-generating component and the heat spreader. The heat-transfer pipe operable to transfer heat from the heat-generating component to the heat spreader. The heat-transfer pipe and the heat spreader are movable between a first configuration and a second configuration. In the first configuration, a gap separates the heat spreader and the portion of the housing based on the heat-transfer pipe being at a first orientation. In the second configuration, the heat spreader closes the gap and is thermally coupled to the portion of the housing based on the heat-transfer pipe being at a second orientation.

公开(公告)号：USD933060S1

公开(公告)日：2021-10-12

申请号：US29664571

申请日：2018-09-26

Applicant: Intel Corporation

Designer： Shantanu Kulkarni ,  Jeff Ku

公开(公告)号：US20210173447A1

公开(公告)日：2021-06-10

申请号：US17173485

申请日：2021-02-11

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tim Liu ,  Yihua Lai ,  Lance Lin ,  Gavin Sung

IPC: G06F1/16 ,  G06F3/02 ,  G06F3/0354

Abstract: Apparatus, systems, articles of manufacture, and methods are disclosed for physical keyboards with multi-display computing devices. An example keyboard includes a plurality of keys and a translucent backplate having a first side and a second side. The example keyboard also includes a coating between the first side of the backplate and the plurality of keys, the coating to pass light to illuminate the plurality of keys, and the coating to obscure the plurality keys when viewed from the second side of the backplate.

公开(公告)号：US20210144310A1

公开(公告)日：2021-05-13

申请号：US17150723

申请日：2021-01-15

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Tom Chen ,  Vincent Hung

IPC: H04N5/232 ,  H04N5/225

Abstract: System and method for enabling capturing of multiple images from a display device in which one or more image capturing devices disposed, at least partially, in the display device are controllably oriented to capture one or more views of a subject for combining (e.g., via optical tiling of captured image data) into a composite view.

公开(公告)号：US20210112685A1

公开(公告)日：2021-04-15

申请号：US17131137

申请日：2020-12-22

Applicant: Intel Corporation

Inventor： Aleksander Magi ,  Jeff Ku ,  Juha Paavola ,  Prakash Kurma Raju

IPC: H05K7/20 ,  F16F7/12

Abstract: Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.

公开(公告)号：US10901224B2

公开(公告)日：2021-01-26

申请号：US15582000

申请日：2017-04-28

Applicant: Intel Corporation

Inventor： Jeff Ku ,  Gavin Sung ,  Simon S. Yuan ,  Lance Lin ,  Jason Y Jiang

IPC: G02B27/01

Abstract: A wearable computing device having a main computing element having a center portion and at least two arms and a display element operably connected to arms to enclose a region within which a body part may be inserted. Each arm may include a docking element connectable to the display element and may be configured to slide within the arm to move the display element relative to the center portion of the main computing element. A pivot arm may pivotably connect the display element to the slider arm to permit pivoting of the display element relative to the plane of the main computing element.