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公开(公告)号:USD1047998S1
公开(公告)日:2024-10-22
申请号:US29845962
申请日:2022-07-12
Applicant: Intel Corporation
Designer: Mikko Makinen , Gustavo Fricke
Abstract: FIG. 1 is a front, right perspective view of a laptop.
FIG. 2 is a front view of the laptop of FIG. 1.
FIG. 3 is a rear view of the laptop of FIG. 1.
FIG. 4 is a right side view of the laptop of FIG. 1.
FIG. 5 is a left side view of the laptop of FIG. 1.
FIG. 6 is a top view of the laptop pf FIG. 1; and,
FIG. 7 is a bottom view of the laptop of FIG. 1.-
公开(公告)号:US11870088B2
公开(公告)日:2024-01-09
申请号:US16844668
申请日:2020-04-09
Applicant: Intel Corporation
Inventor: Juha Paavola , Naoki Matsumura , Mikko Makinen
IPC: H01M50/24 , H01M10/0525 , H01M50/169 , H01M50/284 , H01M50/209
CPC classification number: H01M50/24 , H01M10/0525 , H01M50/169 , H01M50/209 , H01M50/284
Abstract: The present disclosure is directed to systems and methods for improving the rigidity or stiffness of an electronic device chassis or housing using a structural secondary battery. The structural secondary battery includes a compression skin disposed about one or more secondary storage cells. The compression skin exerts a compressive force of at least 0.5 atmospheres on the one or more secondary storage cells. A structural member is bonded to the compression skin. The structural member includes a relatively thin (e.g. 0.1 mm or less), rigid (e.g., Young's Modulus of at least 300 GPa), member, such as a sapphire crystal. The structural member may then be bonded or otherwise detachably or non-detachably affixed to an aperture formed in the electronic device chassis or housing. The bonding of the structural member to the electronic device chassis or housing beneficially improves the stiffness of the chassis or housing.
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公开(公告)号:US20220095468A1
公开(公告)日:2022-03-24
申请号:US17543690
申请日:2021-12-06
Applicant: Intel Corporation
Inventor: Jeff Ku , Juha Paavola , Mark Carbone , Shantanu Kulkarni , Mikko Makinen , Gustavo Fricke
Abstract: Personal computing device covers having stands are disclosed. A disclosed example apparatus includes a protective cover to at least partially cover a personal computing device. The cover includes a fixed panel to be thermally coupled to a chassis of the personal computing device to define a heatsink of the personal computing device, and a foldable panel to be rotatably coupled to the fixed panel via a hinge to support the personal computing device to stand at an angle from a surface.
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公开(公告)号:US20210043964A1
公开(公告)日:2021-02-11
申请号:US16943982
申请日:2020-07-30
Applicant: Intel Corporation
Inventor: Naoki Matsumura , Juha Paavola , Mikko Makinen , Vivek Paranjape , Andy Keates
IPC: H01M10/058 , H01M10/0525
Abstract: Li-metal battery with a pressure chamber to allow uniform pressure on a battery. The pressure chamber is supported by metal plates (such as pressure equalization plate) used to give uniform pressure to the battery. The pressure chamber may include pressured gas, elastic material, spring plate, etc. The outer skin of the pressure chamber is free to bow, restrained at its edges by (metal) skin, but still exerts a uniform pressure on the plate that is compressing the battery cell. The pressure chamber gives uniform pressure to battery, which is used to enable high-energy density battery with, for example, 20% more battery life.
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公开(公告)号:USD1033433S1
公开(公告)日:2024-07-02
申请号:US29771488
申请日:2021-02-23
Applicant: Intel Corporation
Designer: Aleksander Magi , Duck Young Kong , Mikko Makinen , Stan C. Woody
Abstract: FIG. 1 is a right, front perspective view of a computing device with touchpad display screen, showing our new design;
FIG. 2 is a front view thereof;
FIG. 3 is another right, front perspective view thereof, showing the touchpad display screen in an alternate display mode state with environmental graphics; and,
FIG. 4 is a front view thereof.
The broken lines showing the environmental graphical features of the display modes on the touchpad display screen for the computing device from no part of the claimed, while all other broken lines depict portions of the computing device with touchpad display screen that form no part of the claimed design.-
公开(公告)号:USD1001797S1
公开(公告)日:2023-10-17
申请号:US29724751
申请日:2020-02-19
Applicant: Intel Corporation
Designer: Jeff Ku , Juha Paavola , Mark Carbone , Shantanu Kulkarni , Mikko Makinen , Gustavo Fricke
Abstract: FIG. 1 is a bottom, front, right, perspective view of a computer;
FIG. 2 is a bottom, front, right, perspective view thereof in a first alternate configuration of use; and,
FIG. 3 is a bottom, right, front perspective view thereof in a second alternate configuration of use.
The even dashed broken lines in the drawings represent portions of the computer that form no part of the claimed design. The dot-dash broken lines represent boundaries that separate the unclaimed center portion of the screen from the rest of the computer. The keyboard shown in even dash broken lines in FIGS. 1-2 represents environment. None of the broken lines form part of the claimed design.-
公开(公告)号:USD964984S1
公开(公告)日:2022-09-27
申请号:US29801976
申请日:2021-08-02
Applicant: Intel Corporation
Designer: Mikko Makinen , Gustavo Fricke
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公开(公告)号:USD914021S1
公开(公告)日:2021-03-23
申请号:US29673785
申请日:2018-12-18
Applicant: Intel Corporation
Designer: Aleksander Magi , Duck Young Kong , Mikko Makinen , Stan C. Woody
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公开(公告)号:US20200303699A1
公开(公告)日:2020-09-24
申请号:US16844668
申请日:2020-04-09
Applicant: Intel Corporation
Inventor: Juha Paavola , Naoki Matsumura , Mikko Makinen
IPC: H01M2/10 , H01M10/0525 , H01M2/04
Abstract: The present disclosure is directed to systems and methods for improving the rigidity or stiffness of an electronic device chassis or housing using a structural secondary battery. The structural secondary battery includes a compression skin disposed about one or more secondary storage cells. The compression skin exerts a compressive force of at least 0.5 atmospheres on the one or more secondary storage cells. A structural member is bonded to the compression skin. The structural member includes a relatively thin (e.g. 0.1 mm or less), rigid (e.g., Young's Modulus of at least 300 GPa), member, such as a sapphire crystal. The structural member may then be bonded or otherwise detachably or non-detachably affixed to an aperture formed in the electronic device chassis or housing. The bonding of the structural member to the electronic device chassis or housing beneficially improves the stiffness of the chassis or housing.
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公开(公告)号:US12284793B2
公开(公告)日:2025-04-22
申请号:US17754429
申请日:2020-12-23
Applicant: Intel Corporation
Inventor: Ritu Bawa , Ruander Cardenas , Kathiravan D , Jia Yan Go , Chin Kung Goh , Jeff Ku , Prakash Kurma Raju , Baomin Liu , Twan Sing Loo , Mikko Makinen , Columbia Mishra , Juha Paavola , Prasanna Pichumani , Daniel Ragland , Kannan Raja , Khal Ern See , Javed Shaikh , Gokul Subramaniam , George Baoci Sun , Xiyong Tian , Hua Yang , Mark Carbone , Vivek Paranjape , Nehakausar Pinjari , Hari Shanker Thakur , Christopher Moore , Gustavo Fricke , Justin Huttula , Gavin Sung , Sammi Wy Liu , Arnab Sen , Chun-Ting Liu , Jason Y. Jiang , Gerry Juan , Shih Wei Nien , Lance Lin , Evan Kuklinski
Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
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