公开(公告)号：US20070110558A1

公开(公告)日：2007-05-17

申请号：US11591475

申请日：2006-11-02

申请人： Chien-Hua Chen ,  Chia-Pin Wei ,  Wen-Shi Huang

发明人： Chien-Hua Chen ,  Chia-Pin Wei ,  Wen-Shi Huang

IPC分类号： F04D15/00 ,  F04D29/56

CPC分类号： F04D25/166 ,  F04D27/00

摘要： A fan system, which receives an input voltage from exterior, includes a first fan module, a second fan module, a first starting module, a second starting module, a temperature-sensing element and a first controlling module. The first starting module receives the input voltage and starts the first fan module. The second starting module, which is electrically connected to the second fan module, receives the input voltage. The temperature-sensing element produces a sensing signal in accordance with an ambient temperature. The first controlling module controls the second starting module in accordance with the sensing signal so as to start the second fan module.

摘要翻译： 从外部接收输入电压的风扇系统包括第一风扇模块，第二风扇模块，第一启动模块，第二启动模块，温度感测元件和第一控制模块。 第一个启动模块接收输入电压并启动第一个风扇模块。 电连接到第二风扇模块的第二启动模块接收输入电压。 温度感测元件根据环境温度产生感测信号。 第一控制模块根据感测信号控制第二启动模块，以启动第二风扇模块。

公开(公告)号：US20070090479A1

公开(公告)日：2007-04-26

申请号：US11254875

申请日：2005-10-20

申请人： Chien-Hua Chen ,  Kirby Sand ,  Bradley John

发明人： Chien-Hua Chen ,  Kirby Sand ,  Bradley John

IPC分类号： H01L31/0203 ,  H01L21/77

CPC分类号： B81C1/00269 ,  H01L21/67092 ,  H01L2224/75305 ,  H01L2924/1461 ,  H01L2924/00

摘要： A system for controlling bond front propagation in wafer-scale packaging includes a first substrate, a second substrate, and a bonder pressure plate having protruded structures thereon to selectively establish at least one point of contact between the first and second substrates to initiate a bond front therebetween. The protruded structures are selectively configured to control the propagation of the bond front.

摘要翻译： 用于控制晶片级封装中的键前传播的系统包括第一衬底，第二衬底和其上具有突出结构的接合器压板，用于选择性地建立第一和第二衬底之间的至少一个接触点，以启动键合前端 之间。 突出的结构被选择性地配置成控制接合面的传播。

公开(公告)号：US20070068620A1

公开(公告)日：2007-03-29

申请号：US11604474

申请日：2006-11-27

申请人： Chien-Hua Chen ,  James McKinnell

发明人： Chien-Hua Chen ,  James McKinnell

IPC分类号： B44C1/17 ,  B44C1/165 ,  B32B37/00 ,  B32B38/18

CPC分类号： B81C1/00285 ,  H01L21/2007

摘要： A structured material is transferred to a substrate. A release film is applied to a carrier. A material is deposited on a surface of the release film. The material is processed to form the structured material. The structured material is coupled to the substrate. The release film is exposed to reduce adhesion strength between the release film and the carrier, and the carrier and the release film are removed from the structured material.

摘要翻译： 将结构化材料转移到基底。 将剥离膜应用于载体。 材料沉积在脱模膜的表面上。 处理该材料以形成结构化材料。 结构材料耦合到基底。 暴露脱模膜以降低剥离膜和载体之间的粘合强度，并且将载体和脱模膜从结构化材料中除去。

公开(公告)号：US07187124B2

公开(公告)日：2007-03-06

申请号：US10781212

申请日：2004-02-17

申请人： Timothy F. Myers ,  John Chen ,  Chien-Hua Chen

发明人： Timothy F. Myers ,  John Chen ,  Chien-Hua Chen

IPC分类号： H01J1/62 ,  H01J63/04

CPC分类号： H01J1/312 ,  B82Y10/00 ,  H01J9/022 ,  H01J31/123

摘要： A photonic assisted emitter including an at least partially transparent electron source layer, a thin metal layer; and a tunneling layer disposed between said at least partially transparent electron source layer and said thin metal layer.

摘要翻译： 一种光子辅助发射器，包括至少部分透明的电子源层，薄金属层; 以及设置在所述至少部分透明的电子源层和所述薄金属层之间的隧道层。

公开(公告)号：US20070023850A1

公开(公告)日：2007-02-01

申请号：US11194036

申请日：2005-07-30

申请人： Chien-Hua Chen ,  Charles Haluzak ,  Tracy Forrest

发明人： Chien-Hua Chen ,  Charles Haluzak ,  Tracy Forrest

IPC分类号： H01L31/00 ,  H01L21/46

CPC分类号： H01L21/187

摘要： A first surface is bonded to a second surface. The first surface and the second surface are plasma treated. Only the first surface is wet treated. The first surface and the second surface are joined together to bond the first surface to the second surface.

摘要翻译： 第一表面结合到第二表面。 第一表面和第二表面是等离子体处理的。 只有第一个表面被湿处理。 第一表面和第二表面连接在一起以将第一表面粘合到第二表面。

公开(公告)号：US20070015353A1

公开(公告)日：2007-01-18

申请号：US11181479

申请日：2005-07-14

申请人： David Craig ,  Chien-Hua Chen

发明人： David Craig ,  Chien-Hua Chen

IPC分类号： H01L21/44

CPC分类号： H01L24/85 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/78 ,  H01L24/80 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4809 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2224/48471 ,  H01L2224/48475 ,  H01L2224/48599 ,  H01L2224/49171 ,  H01L2224/78301 ,  H01L2224/85045 ,  H01L2224/85051 ,  H01L2224/8518 ,  H01L2224/85186 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01054 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10161 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/4554 ,  H01L2224/85399 ,  H01L2224/05599

摘要： A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the wire and a bonding pad of the electrical device.

摘要翻译： 基板与安装在基板上的电气装置电连接。 在导线的第一端和基板的焊盘之间形成球接合。 线内形成反向运动回路。 在电线的第二端和电气装置的接合焊盘之间形成接合。

公开(公告)号：USD526282S1

公开(公告)日：2006-08-08

申请号：US29221826

申请日：2005-01-20

申请人： Chien-Hua Chen

设计人： Chien-Hua Chen

公开(公告)号：US07087134B2

公开(公告)日：2006-08-08

申请号：US10816509

申请日：2004-03-31

申请人： Chien-Hua Chen ,  Charles C. Haluzak

发明人： Chien-Hua Chen ,  Charles C. Haluzak

IPC分类号： B32B37/00

CPC分类号： B81B7/0067 ,  B81C2203/036

摘要： A method of bonding substrates and devices having bonded substrates are disclosed. The method of bonding substrates includes depositing a layer of bonding substrate material onto a bonding surface of a first substrate. A bonding site density of at least one of the layer of bonding substrate material or a bonding surface of a second substrate is increased, and the bonding surface of the first substrate having the layer of bonding substrate material is bonded to the bonding surface of the second substrate.

摘要翻译： 公开了一种接合具有接合基片的基片和器件的方法。 接合基板的方法包括将接合基板材料层沉积到第一基板的接合表面上。 粘接基板材料层或第二基板的接合面中的至少一方的接合位置密度增加，具有接合基板材料层的第一基板的接合面与第二基板材料的接合面接合 基质。

公开(公告)号：US07026189B2

公开(公告)日：2006-04-11

申请号：US10776084

申请日：2004-02-11

申请人： Chien-Hua Chen ,  Bradley C. John ,  Charlotte R. Lanig ,  Melissa A. Workman

发明人： Chien-Hua Chen ,  Bradley C. John ,  Charlotte R. Lanig ,  Melissa A. Workman

IPC分类号： H01L21/44

CPC分类号： B81B7/0077 ,  B81C1/00873 ,  B81C2203/0118

摘要： A method for packaging and singulating a wafer having a plurality of micro devices includes providing a multi-lid substrate having a trench having intersection portions and non-intersection portions formed on a first side of the multi-lid substrate. The multi-lid substrate is coupled to the wafer such that the intersection portions of the trench pattern extend adjacent to at least three micro devices. Portions of the multi-lid substrate between a second side of the multi-lid substrate and the trench pattern are removed while the multi-lid substrate is coupled to the wafer.

摘要翻译： 一种用于封装和分离具有多个微器件的晶片的方法包括提供具有沟槽的多盖基板，所述沟槽具有形成在所述多盖基板的第一侧上的交叉部分和非交叉部分。 多盖基板耦合到晶片，使得沟槽图案的相交部分相邻于至少三个微器件延伸。 在多盖基板与晶片连接的同时，多盖基板的多盖基板的第二面与沟槽图案之间的部分被去除。

公开(公告)号：US06981759B2

公开(公告)日：2006-01-03

申请号：US10135236

申请日：2002-04-30

申请人： Chien-Hua Chen ,  Donald W. Schulte ,  Terry E. McMahon

发明人： Chien-Hua Chen ,  Donald W. Schulte ,  Terry E. McMahon

IPC分类号： B41J2/05

CPC分类号： B41J2/1603 ,  B41J2/14145 ,  B41J2/1607 ,  B41J2/1628 ,  B41J2/1631 ,  B41J2202/15 ,  G11B5/3103 ,  G11B5/313 ,  G11B5/3163

摘要： A method of forming an opening through a substrate having a first side and a second side opposite the first side includes forming spaced etch stops in the first side of the substrate, etching into the substrate from the second side toward the first side to the spaced etch stops, and etching into the substrate between the spaced etch stops from the second side. Etching into the substrate to the spaced etch stops includes forming a first portion of the opening and etching into the substrate between the spaced etch stops includes forming a second portion of the opening.