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    Method and system for packaging MEMS devices with incorporated getter
    81.
    发明申请
    Method and system for packaging MEMS devices with incorporated getter 审中-公开
    封装带有吸气剂的MEMS器件的方法和系统

    公开(公告)号：US20060076634A1

    公开(公告)日：2006-04-13

    申请号：US11102554

    申请日：2005-04-08

    Applicant: Lauren Palmateer ,  William Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    Inventor： Lauren Palmateer ,  William Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    IPC: H01L21/00 ,  H01L29/84

    CPC classification number: B81B7/0038 ,  B81C2203/019 ,  G02B26/001

    Abstract: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    Abstract translation: 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

    Hermetic seal and method to create the same
    83.
    发明授权
    Hermetic seal and method to create the same 有权
    密封和方法创造一样

    公开(公告)号：US06589625B1

    公开(公告)日：2003-07-08

    申请号：US09921196

    申请日：2001-08-01

    Applicant: Manish Kothari ,  Clarence Chui

    Inventor： Manish Kothari ,  Clarence Chui

    IPC: B32B310

    CPC classification number: B81B7/0041 ,  B81C2203/019 ,  Y10T428/162 ,  Y10T428/166 ,  Y10T428/239 ,  Y10T428/24777 ,  Y10T428/2852

    Abstract: An electronic display screen is created by processing a mirror on a substrate glass. A back plate glass is then placed on top of the substrate glass and sealed to the back plate glass. A hermetic seal that includes an adhesive mixed with zeolites is disclosed. The hermetic seal can seal the back plate glass with the substrate glass. The application of the hermetic seal is not limited to the electronic display screen. Rather, the hermetic seal can be used to seal a variety of surfaces including metals, polymers, plastics, alloys, ceramics and the like.

    Abstract translation: 通过在基板玻璃上处理反射镜来创建电子显示屏。 然后将背板玻璃放置在基板玻璃的顶部上并密封到背板玻璃上。 公开了一种包含与沸石混合的粘合剂的气密密封。 气密密封可用基板玻璃密封背板玻璃。 气密密封的应用不限于电子显示屏。 相反，气密密封可用于密封包括金属，聚合物，塑料，合金，陶瓷等的各种表面。

    Electromechanical devices having etch barrier layers
    84.
    发明授权
    Electromechanical devices having etch barrier layers 有权
    具有蚀刻阻挡层的机电装置

    公开(公告)号：US08368124B2

    公开(公告)日：2013-02-05

    申请号：US12489250

    申请日：2009-06-22

    Applicant: Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari

    Inventor： Mark W. Miles ,  John Batey ,  Clarence Chui ,  Manish Kothari

    IPC: H01L27/20 ,  H01L29/84

    CPC classification number: G02B26/001 ,  B81B3/0035

    Abstract: In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the micro electromechanical systems device.

    Abstract translation: 在一个实施例中，本发明提供一种用于制造微机电系统装置的方法。 该方法包括制造包括具有特征机电响应的膜的第一层和特征光学响应，其中特征光学响应是期望的，并且特征机电响应是不期望的; 以及通过在所述微机电系统装置的启动期间至少减少其上积累的电荷来修改所述第一层的特征机电响应。

    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER
    86.
    发明申请
    METHOD AND SYSTEM FOR PACKAGING MEMS DEVICES WITH INCORPORATED GETTER 审中-公开
    用于包装具有并发卡特的MEMS器件的方法和系统

    公开(公告)号：US20110290552A1

    公开(公告)日：2011-12-01

    申请号：US13208218

    申请日：2011-08-11

    Applicant: Lauren Palmateer ,  William J. Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    Inventor： Lauren Palmateer ,  William J. Cummings ,  Brian Gally ,  Clarence Chui ,  Manish Kothari

    IPC: H01L23/28 ,  B29C65/54

    CPC classification number: B81B7/0038 ,  B81C2203/019 ,  G02B26/001

    Abstract: Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.

    Abstract translation: 公开了用于封装诸如干涉式调制器阵列之类的MEMS装置的方法和系统。 MEMS器件封装结构的一个实施例包括具有化学反应物吸气剂的密封。 MEMS器件封装的另一实施例包括具有吸气剂的主密封件和靠近主密封件的外周边的次级密封件。 MEMS器件封装的另一个实施例包括位于MEMS器件封装内部并且靠近封装密封件的内周边的吸气剂。

    Methods of fabricating MEMS devices having overlying support structures
    88.
    发明授权
    Methods of fabricating MEMS devices having overlying support structures 有权
    制造具有上覆支撑结构的MEMS装置的方法

    公开(公告)号：US07875485B2

    公开(公告)日：2011-01-25

    申请号：US12510046

    申请日：2009-07-27

    Applicant: Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    Inventor： Teruo Sasagawa ,  SuryaPrakash Ganti ,  Mark W. Miles ,  Clarence Chui ,  Manish Kothari ,  Ming-Hau Tung

    IPC: H01L21/00

    CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

    Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.

    Abstract translation: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，铆钉结构的部分延伸穿过可移动层并接触下面的层。 在其他实施例中，用于形成刚性支撑结构的材料也可以用于钝化与MEMS装置电连接的其它暴露的电引线，保护电引线免受损坏或其他干扰。

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