公开(公告)号：US07648927B2

公开(公告)日：2010-01-19

申请号：US11425344

申请日：2006-06-20

申请人： Kaushal K. Singh ,  Joseph M. Ranish

发明人： Kaushal K. Singh ,  Joseph M. Ranish

IPC分类号： H01L21/31

CPC分类号： C23C16/308 ,  C23C16/0227 ,  C23C16/345 ,  C23C16/45519 ,  C23C16/45591 ,  C23C16/482 ,  C23C16/488 ,  C23C16/52 ,  C30B25/02 ,  C30B29/06 ,  H01L21/02126 ,  H01L21/0214 ,  H01L21/02164 ,  H01L21/0217 ,  H01L21/02219 ,  H01L21/02277 ,  H01L21/02301 ,  H01L21/0231 ,  H01L21/02348 ,  H01L21/02529 ,  H01L21/02532 ,  H01L21/02576 ,  H01L21/02579 ,  H01L21/0262 ,  H01L21/02636 ,  H01L21/3121 ,  H01L21/3143 ,  H01L21/31612 ,  H01L21/3185

摘要： Embodiments of the invention generally provide a method for depositing films or layers using a UV source during a photoexcitation process. The films are deposited on a substrate and usually contain a material, such as silicon (e.g., epitaxy, crystalline, microcrystalline, polysilicon, or amorphous), silicon oxide, silicon nitride, silicon oxynitride, or other silicon-containing materials. The photoexcitation process may expose the substrate and/or gases to an energy beam or flux prior to, during, or subsequent a deposition process. Therefore, the photoexcitation process may be used to pre-treat or post-treat the substrate or material, to deposit the silicon-containing material, and to enhance chamber cleaning processes. Attributes of the method that are enhanced by the UV photoexcitation process include removing native oxides prior to deposition, removing volatiles from deposited films, increasing surface energy of the deposited films, increasing the excitation energy of precursors, reducing deposition time, and reducing deposition temperature.

摘要翻译： 本发明的实施方案通常提供一种在光激发过程中使用UV源沉积膜或层的方法。 膜沉积在基底上，通常包含诸如硅（例如外延，晶体，微晶，多晶硅或非晶），氧化硅，氮化硅，氮氧化硅或其它含硅材料的材料。 光致激化过程可以在沉积过程之前，期间或之后使衬底和/或气体暴露于能量束或通量。 因此，光激发过程可以用于预处理或后处理衬底或材料，沉积含硅材料，并且增强室清洁过程。 通过UV光激发过程增强的方法的特征包括在沉积之前去除原生氧化物，从沉积膜去除挥发物，增加沉积膜的表面能，增加前体的激发能，减少沉积时间和降低沉积温度。

公开(公告)号：US07509035B2

公开(公告)日：2009-03-24

申请号：US11195395

申请日：2005-08-02

申请人： Joseph M. Ranish ,  Corina E. Tanasa ,  Sundar Ramamurthy ,  Claudia Lai ,  Ravi Jallepally ,  Ramachandran Balasubramanian ,  Aaron M. Hunter ,  Agus Tjandra ,  Norman Tam

发明人： Joseph M. Ranish ,  Corina E. Tanasa ,  Sundar Ramamurthy ,  Claudia Lai ,  Ravi Jallepally ,  Ramachandran Balasubramanian ,  Aaron M. Hunter ,  Agus Tjandra ,  Norman Tam

IPC分类号： F26B19/00 ,  F27B5/14

CPC分类号： H01L21/67115 ,  H05B3/0047

摘要： A thermal processing chamber includes a substrate support rotating about a center axis and a lamphead of plural lamps in an array having a predetermined difference in radiance pattern between them. The radiance pattern includes a variation in diffuseness or collimation. In one embodiment, the center lines of all of the lamps are disposed away from the center axis. The array can be an hexagonal array, in which the center axis is located at a predetermined position between neighboring lamps.

摘要翻译： 热处理室包括以中心轴为中心旋转的基板支撑体和具有预定的它们之间的辐射图形差异的阵列中的多个灯的灯头。 辐射图包括扩散或准直的变化。 在一个实施例中，所有灯的中心线远离中心轴设置。 阵列可以是六边形阵列，其中中心轴位于相邻灯之间的预定位置。

公开(公告)号：US20080199162A1

公开(公告)日：2008-08-21

申请号：US11675145

申请日：2007-02-15

申请人： Joseph M. Ranish ,  Khurshed Sorabji

发明人： Joseph M. Ranish ,  Khurshed Sorabji

IPC分类号： H05B3/00

CPC分类号： H01K1/58 ,  H01K1/46 ,  H01L21/67115

摘要： A lamp assembly adapted for use in a substrate thermal processing chamber to heat the substrate to temperatures up to at least about 1100° C. is disclosed. In one embodiment, the lamp assembly comprises a bulb enclosing at least one radiation generating filament attached to a pair of leads, a lamp base configured to receive the pair of leads, a sleeve having a wall thickness of at least about 0.013 inches and a potting compound having a thermal conductivity greater than about 100 W/(K-m).

摘要翻译： 公开了适用于基板热处理室以将基板加热至高达至少约1100℃的温度的灯组件。 在一个实施例中，灯组件包括封闭连接到一对引线的至少一个辐射生成细丝的灯泡，被配置为容纳一对引线的灯座，具有至少约0.013英寸的壁厚的套管和一个灌封 具有大于约100W /（Km）的热导率的化合物。

公开(公告)号：US07147359B2

公开(公告)日：2006-12-12

申请号：US10877246

申请日：2004-06-25

申请人： Joseph M. Ranish ,  Abhijit Desai ,  Apollo Havelind

发明人： Joseph M. Ranish ,  Abhijit Desai ,  Apollo Havelind

IPC分类号： H01R33/975

CPC分类号： H01L21/67115 ,  F27B17/0025 ,  F27D99/0006 ,  F27D2099/0026

摘要： A lamp assembly for a substrate processing chamber is described. The lamp assembly comprises a tubular body having first and second ends, a lamp element at least partially seated in the first end having a filament and first electrical connectors, transmission wires attached to the first electrical connectors, and a rigid plug flexibly positioned relative to the second end of the tubular body having second electrical connectors attached to the transmission wires. The flexibly positioned rigid plug is generally capable of a range movement in directions both perpendicular and parallel to a longitudinal axis of the tubular body. In one version, the rigid plug comprises first and second plug elements.

摘要翻译： 描述了用于基板处理室的灯组件。 灯组件包括具有第一和第二端的管状主体，至少部分地位于第一端中的灯元件具有灯丝和第一电连接器，连接到第一电连接器的传输线以及相对于第一端柔性定位的刚性插头 管体的第二端具有连接到传输线的第二电连接器。 柔性定位的刚性塞通常能够在垂直于和平行于管状体的纵向轴线的方向上的范围移动。 在一个版本中，刚性插头包括第一和第二插头元件。

公开(公告)号：US07129440B2

公开(公告)日：2006-10-31

申请号：US11185649

申请日：2005-07-20

申请人： Bruce E. Adams ,  Dean Jennings ,  Abhilash J. Mayur ,  Vijay Parihar ,  Joseph M. Ranish

发明人： Bruce E. Adams ,  Dean Jennings ,  Abhilash J. Mayur ,  Vijay Parihar ,  Joseph M. Ranish

IPC分类号： B23K26/06 ,  G02B6/10

CPC分类号： G02B6/003 ,  G02B6/0046 ,  G02B6/0056 ,  G02B6/0068

摘要： Apparatus for thermally processing a semiconductor wafer includes an array of semiconductor laser emitters arranged in plural parallel rows extending along a slow axis, plural respective cylindrical lenses overlying respective ones of the rows of laser emitters for collimating light from the respective rows along a fast axis generally perpendicular to the slow axis, a homogenizing light pipe having an input face at a first end for receiving light from the plural cylindrical lenses and an output face at an opposite end, the light pipe comprising a pair of reflective walls extending between the input and output faces and separated from one another along the direction of the slow axis, and scanning apparatus for scanning light emitted from the homogenizing light pipe across the wafer in a scanning direction parallel to the fast axis.

摘要翻译： 用于热处理半导体晶片的装置包括布置成沿着慢轴延伸的多个平行列的半导体激光发射器的阵列，多个相应的柱形透镜，覆盖相应行的激光发射器，用于沿着快轴准直来自相应行的光 垂直于慢轴的均质化光管，其具有在第一端处的输入面用于接收来自多个柱面透镜的光和相对端的输出面，所述光管包括在输入和输出之间延伸的一对反射壁 并且沿着慢轴的方向彼此分离;以及扫描装置，用于在平行于快轴的扫描方向上扫描从均匀化光管发射的光，跨过晶片。

公开(公告)号：US06888104B1

公开(公告)日：2005-05-03

申请号：US10773650

申请日：2004-02-05

申请人： Joseph M. Ranish ,  Aaron Muir Hunter ,  Balasubramanian Ramachandran ,  Jallepally Ravi ,  Sundar Ramamurthy ,  Vedapuram S. Achutharaman ,  Khurshed Sorabji

发明人： Joseph M. Ranish ,  Aaron Muir Hunter ,  Balasubramanian Ramachandran ,  Jallepally Ravi ,  Sundar Ramamurthy ,  Vedapuram S. Achutharaman ,  Khurshed Sorabji

IPC分类号： F27B5/14 ,  F27B17/00 ,  F27D5/00 ,  F27D19/00 ,  F27D21/00 ,  H01L21/687

CPC分类号： H01L21/68735 ,  F27B17/0025 ,  F27D5/0037 ,  F27D19/00 ,  F27D21/00 ,  H01L21/68757

摘要： A substrate support ring has a band having an inner perimeter that at least partially surrounds a periphery of the substrate. The band has a radiation absorption surface. A lip extends radially inwardly from the inner perimeter of the band to support the substrate. The band and lip can be formed from silicon carbide, and the radiation absorption surface can be an oxidized layer of silicon carbide. In one version, the band and lip have a combined thermal mass Tm, and the radiation absorption surface has an absorptivity A and a surface area Sa, such that the ratio (A×Sa)/Tm is from about 4×10−5 m2K/J to about 9×10−4 m2K/J.

摘要翻译： 衬底支撑环具有带子，该带具有至少部分地围绕衬底周边的内周边。 带具有辐射吸收表面。 唇缘从带的内周向径向向内延伸以支撑基底。 带和唇缘可以由碳化硅形成，并且辐射吸收表面可以是碳化硅的氧化层。 在一个版本中，带和唇具有组合的热质量T m，并且辐射吸收表面具有吸收率A和表面积S SUB，使得比率 （AxS a）/ T m是约4×10 -5 / 2K / J至约9×10 9 / SUP> -4 / 2K / J。

公开(公告)号：US06376804B1

公开(公告)日：2002-04-23

申请号：US09595758

申请日：2000-06-16

申请人： Joseph M. Ranish ,  Andreas G. Hegedus

发明人： Joseph M. Ranish ,  Andreas G. Hegedus

IPC分类号： F27D1100

CPC分类号： H01L21/67115

摘要： A semiconductor processing system includes a process chamber and an assembly of radiant energy sources. The radiant energy assembly is filled with a thermally conductive gas to cool the radiant energy sources.

摘要翻译： 半导体处理系统包括处理室和辐射能源的组件。 辐射能组件填充有导热气体以冷却辐射能量源。

公开(公告)号：US06232707B1

公开(公告)日：2001-05-15

申请号：US09207893

申请日：1998-11-16

申请人： Joseph M. Ranish ,  Frederick Hetzel ,  Robert S. McFeely

发明人： Joseph M. Ranish ,  Frederick Hetzel ,  Robert S. McFeely

IPC分类号： F21V1900

CPC分类号： F21V19/0005 ,  H01J61/368 ,  H01K9/08 ,  H01R33/09

摘要： A molded lamp base receives a press seal of a lamp. Internal walls of the base define a cavity open at one end to receive the press seal portion of the lamp. The side walls have a thickness dimension and a width dimension substantially conforming to the peripheral dimensions of the press seal portion. At least one raised bead extends inwardly from the cavity side wall and is dimensioned for a friction fit with the periphery of the lamp to hold the lamp securely in base. In one embodiment, the beads are located in semi-circular recesses disposed about the exhaust tube portion of the lamp while in another embodiment, the beads are spaced outwardly therefrom.

摘要翻译： 模制的灯座接收灯的压力密封。 底座的内壁限定了在一端敞开的空腔，以容纳灯的压力密封部分。 侧壁具有基本上符合压力密封部分的周边尺寸的厚度尺寸和宽度尺寸。 至少一个凸起的凸缘从空腔侧壁向内延伸并且被设计成与灯的周边摩擦配合以将灯牢固地保持在基座中。 在一个实施例中，珠子位于围绕灯的排气管部分设置的半圆形凹槽中，而在另一个实施例中，珠子与其间隔开。

公开(公告)号：US5754005A

公开(公告)日：1998-05-19

申请号：US145269

申请日：1993-10-29

申请人： George E. Sakoske ,  Wayne A. Lasch ,  Joseph M. Ranish ,  Milan R. Vukcevich ,  Thomas H. Yu ,  Bernard W. Rachel ,  Richard G. Lynce ,  Istvan Meszaros ,  Gyorgy Nagy ,  Tamas Gal

发明人： George E. Sakoske ,  Wayne A. Lasch ,  Joseph M. Ranish ,  Milan R. Vukcevich ,  Thomas H. Yu ,  Bernard W. Rachel ,  Richard G. Lynce ,  Istvan Meszaros ,  Gyorgy Nagy ,  Tamas Gal

IPC分类号： H01J61/30 ,  H01J61/36 ,  H01K1/40 ,  H01K9/00 ,  H01J17/18

CPC分类号： H01K9/00 ,  H01J61/36 ,  H01K1/40

摘要： An inlead for an electric lamp formed of an alloy of tungsten and molybdenum. The inlead has a rate of thermal expansion or contraction approximating that of the glass forming the bulb. This minimizes the expansion/contraction mis-match stress between the two materials. In addition, the alloy composition functions to reduce oxidation and degradation of the lead.

摘要翻译： 用于由钨和钼的合金形成的电灯。 该线圈的热膨胀或收缩率接近形成灯泡的玻璃的热膨胀或收缩率。 这使两种材料之间的膨胀/收缩失配应力最小化。 此外，合金组成起到减少铅的氧化和降解的作用。