摘要:
A method of fabricating a semiconductor device including depositing a hardmask layer on a layer of the semiconductor device, selectively etching a pattern of continuous lines in the hardmask layer, depositing an antireflective coating over remaining portions of the hardmask layer, depositing a photoresist layer on the antireflective coating, patterning the photoresist layer with a plurality of isolation trenches via a lithography process, each of the isolation trenches extending perpendicular to and crossing portions of at least one of the continuous lines of the underlying hardmask layer, and with each isolation trench having an initial width. The method further includes reducing the width of each of the isolation trenches from the initial width to desired width via a shrinking process, etching the antireflective coating underlying the isolation trenches to expose intersecting portions of the underlying continuous lines, and etching the exposed intersecting portions of the underlying continuous lines of the hardmask layer to form a pattern of line segments having line ends separated by the desired width.
摘要:
Some embodiments discussed herein include a semiconductor having a source region, a drain region and an array of fins operatively coupled to a gate region controlling current flow through the fins between the source region and the drain region. The semiconductor also has at least one cooling element formed at least in part of a material having a heat capacity equal to or larger than the heat capacity of the material of the source region, drain region and array of fins, the cooling elements being in close vicinity to fins of the array of fins electrically isolated from the fins of the array, the source region and the drain region. Other embodiments are also disclosed
摘要:
Semiconductor devices with transistors having different gate dielectric materials and methods of manufacture thereof are disclosed. One embodiment includes a semiconductor device including a workpiece, the workpiece including a first region and a second region proximate the first region. A first transistor is disposed in the first region of the workpiece, the first transistor having at least two first gate electrodes. A first gate dielectric is disposed proximate each of the at least two first gate electrodes, the first gate dielectric comprising a first material. A second transistor is disposed in the second region of the workpiece, the second transistor having at least two second gate electrodes. A second gate dielectric is disposed proximate each of the at least two second gate electrodes, the second gate dielectric comprising a second material. The second material is different than the first material.
摘要:
A field effect transistor with a fin structure having a first and a second source/drain region; a body region formed within the fin structure and between the first and the second source/drain region; a metallically conductive region formed within a part of the first source/drain region, the metallically conductive region being adjacent to the body region or to a lightly doped region disposed between the body region and the first source/drain region; and a current ballasting region formed within a part of the second source/drain region.
摘要:
A method of forming interconnects includes etching a first set of openings in a hard mask using a first photo resist layer with a first pattern of openings as a first etch mask, and etching a second set of openings in the hard mask using a second photo resist layer with a second pattern of openings as a second etch mask. The method includes shrinking the openings in at least one of the first pattern and the second pattern prior to etching the openings in the hard mask.
摘要:
A semiconductor device includes a source region, a drain region, and a fin that connects the source region to the drain region. A gate electrode having a substantially planar surface overlies the fin and is positioned between the drain region and the source region. A first set of spacers is positioned between a first sidewall of the gate electrode and the source region and between a second sidewall of the gate electrode and the drain region. A second set of spacers is positioned on at least a portion of a top surface of the source region and the drain region and alongside at least a portion of the first set of spacers. At least a portion of sidewalls of the second set of spacers contacts a portion of the first or second sidewall of the gate electrode.
摘要:
A first SOI field effect transistor with predetermined transistor properties, comprising: a laterally delimited layer sequence with a gate-insulating layer and a gate region on an undoped substrate; a spacer layer having a predetermined thickness on at least a portion of the sidewalls of the laterally delimited layer sequence; and two source/drain regions in two surface regions of the substrate which are adjoined by the spacer layer, with a predetermined dopant concentration profile, the layer sequence and the spacer layer forming a shading structure that prevents dopant from being introduced into a surface region of the substrate between the two source/drain regions during the production of the first SOI field effect transistor, wherein the predetermined transistor properties of the first SOI field effect transistor are set by setting the thickness of the spacer layer and by the dopant concentration profile.
摘要:
A fin field effect transistor having a substrate, a fin structure above the substrate, as well as a drain region and a source region outside the fin structure above the substrate. The fin structure serves as a channel between the source region and the drain region. The source and drain regions are formed once the gate has been produced.
摘要:
A durable single-ply uncreped paper towel having an increased level of geometric mean total energy absorbed (GMTEA) per geometric mean tensile (GMT) and an increased level of cross-machine direction total energy absorbed (CDTEA) per cross-machine direction tensile strength is disclosed. A method of making such a paper towel is also disclosed.
摘要:
Semiconductor devices and methods of manufacture thereof are disclosed. A complimentary metal oxide semiconductor (CMOS) device includes a PMOS transistor having at least two first gate electrodes comprising a first parameter, and an NMOS transistor having at least two second gate electrodes comprising a second parameter, wherein the second parameter is different than the first parameter. The first parameter and the second parameter may comprise the thickness or the dopant profile of the gate electrode materials of the PMOS and NMOS transistors. The first and second parameter of the at least two first gate electrodes and the at least two second gate electrodes establish the work function of the PMOS and NMOS transistors, respectively.