公开(公告)号：US20060245584A1

公开(公告)日：2006-11-02

申请号：US11475628

申请日：2006-06-27

申请人： Takeshi Otani ,  Masakiyo Tanaka ,  Masanao Suzuki

发明人： Takeshi Otani ,  Masakiyo Tanaka ,  Masanao Suzuki

IPC分类号： H04M9/08

CPC分类号： H04M9/082 ,  H04M1/60

摘要： In a voice communication device in which a control means controls a recording volume adjustment amount for a recording volume adjusting means which adjusts a recording volume of a recording means based on a reproduction volume adjustment amount for a reproduction volume adjusting means which adjusts a reproduction volume of a reproducing means, each adjustment amount is an adjustment absolute amount or an adjustment change amount, and the control means controls the recording volume adjustment amount based on an absolute value or a change amount of the reproduction volume adjustment amount. Also, the control means determines the reproduction volume adjustment amount based on a set reproduction volume.

摘要翻译： 在一种语音通信装置中，其中控制装置控制记录音量调节装置的记录音量调节量，该记录音量调节装置基于用于调节再现音量的再现音量调节装置的再现音量调节装置来调节记录装置的记录音量 再现装置，每个调节量是调整绝对量或调节变化量，并且控制装置根据再现音量调节量的绝对值或变化量来控制记录音量调节量。 此外，控制装置基于设定的再现音量来确定再现音量调节量。

公开(公告)号：US07039903B2

公开(公告)日：2006-05-02

申请号：US09983370

申请日：2001-10-24

申请人： Takeshi Otani ,  Yasushi Yamazaki ,  Hitoshi Sasaki

发明人： Takeshi Otani ,  Yasushi Yamazaki ,  Hitoshi Sasaki

IPC分类号： G06F9/44

CPC分类号： G06N99/005

摘要： The collating device includes the Formant estimation section that estimates feature amount data that represents a time-based change in frequencies of first and second Formants from voice data input through the microphone. The difference computing section calculates a difference between some reference feature amount data and the feature amount data as the feature-amount difference data. This feature-amount difference data is stored in a database. The feature-amount difference data corresponding to voice data input upon collation is collated with the feature-amount difference data registered in the database, and the result is output.

摘要翻译： 对照装置包括共振峰估计部分，其从通过麦克风输入的语音数据估计表示第一和第二共振峰的频率基于时间的变化的特征量数据。 差分计算部分计算一些参考特征量数据和特征量数据之间的差作为特征量差异数据。 该特征量差异数据存储在数据库中。 对应于在核对中输入的语音数据的特征量差分数据与登记在数据库中的特征量差异数据进行对照，并输出结果。

公开(公告)号：US20050218498A1

公开(公告)日：2005-10-06

申请号：US11041437

申请日：2005-01-25

申请人： Toshiyuki Hata ,  Takeshi Otani ,  Ichio Shimizu

发明人： Toshiyuki Hata ,  Takeshi Otani ,  Ichio Shimizu

IPC分类号： H01L23/29 ,  H01L23/495

CPC分类号： H01L24/33 ,  H01L23/49562 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2924/00012

摘要： A semiconductor device superior in heat dissipating performance and permitting reduction of the packaging cost is provided. The semiconductor device comprises a sealing body formed of an insulating resin, a semiconductor chip positioned within the sealing body, the semiconductor chip having a gate electrode and a source electrode on a first main surface thereof and having a back electrode (drain electrode) on a second main surface thereof, a drain electrode plate projecting in a gull wing shape on one end side of the sealing body, an upper surface of a portion of the drain electrode plate which portion is positioned in the sealing body being exposed from the sealing body and a lower surface thereof being connected to the back electrode through an adhesive, a gate electrode plate projecting in a gull wing shape on an opposite end side of the sealing body and being connected to the gate electrode within the sealing body, a source electrode plate projecting in a gull wing shape on the opposite end side of the sealing body and being connected to the source electrode within the sealing body, a depression formed in the surface of the drain electrode plate within the sealing body and filled with the resin which forms the sealing body, and a projecting portion formed on the surface of the drain electrode plate within the sealing body and engaged with the sealing body. The drain electrode plate and the source electrode plate branch into plural branch pieces (leads) serving as gull wing-shaped surface mounting terminals.

摘要翻译： 提供了散热性能优异且能够降低包装成本的半导体装置。 半导体器件包括由绝缘树脂形成的密封体，位于密封体内的半导体芯片，半导体芯片在其第一主表面上具有栅电极和源极，并且在其上具有背电极（漏极） 第二主表面是在密封体的一端侧以鸥翼形突出的漏电极板，漏电极板的位于密封体中的部分的上表面露出密封体， 其下表面通过粘合剂连接到背电极，在密封体的相对端侧以鸥翼形突出并连接到密封体内的栅电极的栅电极板，突出 在密封体的相对端侧具有鸥翼形状，并且与密封体内的源电极连接，形成凹部 在密封体内的漏电极板的表面中填充有形成密封体的树脂，以及形成在密封体内的漏电极板的表面上并与密封体接合的突出部。 漏电极板和源电极板分支成用作鸥翅形表面安装端子的多个分支片（引线）。

公开(公告)号：US20050218494A1

公开(公告)日：2005-10-06

申请号：US11131367

申请日：2005-05-18

申请人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

发明人： Yukihiro Satou ,  Takeshi Otani ,  Hiroyuki Takahashi ,  Toshiyuki Hata ,  Ichio Shimizu

IPC分类号： H01L23/12 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  H01L23/495 ,  H01L23/02

CPC分类号： H01L24/97 ,  H01L23/3107 ,  H01L23/49548 ,  H01L23/49562 ,  H01L24/40 ,  H01L24/41 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16245 ,  H01L2224/32245 ,  H01L2224/40137 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73221 ,  H01L2224/73253 ,  H01L2224/73255 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/84801 ,  H01L2224/8485 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2224/83 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/37099

摘要： A novel semiconductor device high in both heat dissipating property and connection reliability in mounting is to be provided. The semiconductor device comprises a semiconductor chip, a resin sealing member for sealing the semiconductor chip, a first conductive member connected to a first electrode formed on a first main surface of the semiconductor chip, and a second conductive member connected to a second electrode formed on a second main surface opposite to the first main surface of the semiconductor chip, the first conductive member being exposed from a first main surface of the resin sealing member, and the second conductive member being exposed from a second main surface opposite to the first main surface of the resin sealing member and also from side faces of the resin sealing member.

摘要翻译： 提供一种具有高散热性和安装连接可靠性的新型半导体器件。 半导体器件包括半导体芯片，用于密封半导体芯片的树脂密封构件，连接到形成在半导体芯片的第一主表面上的第一电极的第一导电构件和连接到形成在半导体芯片上的第二电极的第二导电构件 与半导体芯片的第一主表面相对的第二主表面，第一导电构件从树脂密封构件的第一主表面露出，并且第二导电构件从与第一主表面相对的第二主表面露出 树脂密封构件的侧面和树脂密封构件的侧面。