摘要:
In this semiconductor memory device, a potential clamping region having no insulation layer formed therein is provided in an insulation layer. More specifically, the potential clamping region is formed under a body portion at a position near a first impurity region, and extends to a first semiconductor layer. A body fixing portion is formed in a boundary region between the body portion and the potential clamping region. This structure enables improvement in operation performance without increasing the layout area in the case where a DRAM cell is formed in a SOI (Silicon On Insulator) structure.
摘要:
By activating a word line and a bit line in parallel with a storage transistor set to OFF, the potential conditions of the charge line, and the word line, and the bit line are controlled so that the potential of a body region is increased by a leak current flowing from a connecting node to the body region in a period until the storage transistor is turned ON.
摘要:
The present invention aims at providing a semiconductor memory device that can be manufactured by a MOS process and can realize a stable operation. A storage transistor has impurity diffusion regions, a channel formation region, a charge accumulation node, a gate oxide film, and a gate electrode. The gate electrode is connected to a gate line and the impurity diffusion region is connected to a source line. The storage transistor creates a state where holes are accumulated in the charge accumulation node and a state where the holes are not accumulated in the charge accumulation node to thereby store data “1” and data “0”, respectively. An access transistor has impurity diffusion regions, a channel formation region, a gate oxide film, and a gate electrode. The impurity diffusion region is connected to a bit line.
摘要:
In this semiconductor memory device, a potential clamping region having no insulation layer formed therein is provided in an insulation layer. More specifically, the potential clamping region is formed under a body portion at a position near a first impurity region, and extends to a first semiconductor layer. A body fixing portion is formed in a boundary region between the body portion and the potential clamping region. This structure enables improvement in operation performance without increasing the layout area in the case where a DRAM cell is formed in a SOI (Silicon On Insulator) structure.
摘要:
There is provided a technique which is capable of detecting a temperature of a semiconductor device with high precision. A temperature detection circuit detecting a temperature of a semiconductor device includes a first short-cycle oscillator generating a first clock signal having positive temperature characteristics with respect to a frequency, a second short-cycle oscillator generating a second clock signal having negative temperature characteristics with respect to the frequency, and a temperature signal generation unit generating a temperature signal which is varied according to the temperature of the semiconductor device based on the first and second clock signals.
摘要:
An internal power supply voltage generation circuit includes a main amplifier that supplies a current from an external power supply node to an internal power supply line in accordance with the difference between a reference voltage from a reference voltage generation circuit and an internal power supply voltage on the internal power supply line. The current supply amount by the main amplifier is adjusted by a level adjust circuit, according to the difference between the external power supply voltage and the reference voltage. The internal power supply voltage generation circuit can suppress reduction in the internal power supply voltage in the vicinity of the lower limit area of the differential power supply voltage.
摘要:
An internal power supply voltage generation circuit includes a main amplifier that supplies a current from an external power supply node to an internal power supply line in accordance with the difference between a reference voltage from a reference voltage generation circuit and an internal power supply voltage on the internal power supply line. The current supply amount by the main amplifier is adjusted by a level adjust circuit, according to the difference between the external power supply voltage and the reference voltage. The internal power supply voltage generation circuit can suppress reduction in the internal power supply voltage in the vicinity of the lower limit area of the differential power supply voltage.
摘要:
A semiconductor memory device includes an isolation unit isolating a bit line in a first region including a memory cell formed of a thick film transistor and a second region including a sense amplifier formed of a thin film transistor. Voltage supply lines are provided corresponding to respective regions. In a test mode, the isolation unit isolates the two regions. A voltage for testing is supplied from the voltage supply line. Thus, a voltage for testing corresponding to a thick film transistor and a thin film transistor can be supplied to allow efficient execution of a burn-in test.
摘要:
A voltage down converter includes a first voltage down converting circuit and a second voltage down converting circuit. The first voltage down converting circuit supplies an internal power supply voltage VCCS1 to an internal circuit only during a period T when the internal power supply voltage VCCS1 falls below a predetermined voltage according to a signal DCE. In the first voltage down converting circuit, P channel MOS transistors are selectively activated according to the levels of the plurality of voltages, and a voltage down converting partial circuit supplies a current of an amount corresponding to the level of the external power supply voltage VCC to a power supply node. As a result, even during the period T, the internal power supply voltage can be maintained at a level of the reference voltage.
摘要:
When a tuning mode signal VTUNE is activated, control clock signal TCLK is output, and counter counts up tuning signals TSIG1 to TSIG4. Tuning circuits render conductive the terminals of respective transistors, and reference potential Vref lowers in accordance with the reduction in the resistance value. When reference potential Vref attains equal to the external reference potential Ext.Vref, differential amplifier circuit stops output of the control clock signal TCLK In accordance with the plurality of the determined tuning signals TSIG1 to TSIG4, fuse elements inside the tuning circuits are programmed.