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    PROBE HEAD AND PROBE CARD HAVING SAME
    81.
    发明申请
    PROBE HEAD AND PROBE CARD HAVING SAME 有权

    公开(公告)号：US20210302472A1

    公开(公告)日：2021-09-30

    申请号：US17214785

    申请日：2021-03-26

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

    IPC: G01R1/073

    Abstract: Proposed is a probe head having a probe card for performing a circuit inspection of a wafer. More particularly, proposed are a probe head and a probe card having the probe head, the probe head having a guide plate. The guide plate has a guide hole and a shield portion composed of a metal material positioned at the periphery of the guide hole, thereby blocking signal interference that may be occurred between adjacent probes.

    PROBE HEAD AND PROBE CARD HAVING SAME
    82.
    发明申请
    PROBE HEAD AND PROBE CARD HAVING SAME 有权

    公开(公告)号：US20210302471A1

    公开(公告)日：2021-09-30

    申请号：US17211812

    申请日：2021-03-24

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

    IPC: G01R1/067 ,  G01R1/073

    Abstract: Proposed are a probe head and a probe card having the same. The probe head includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; an intermediate guide plate having an intermediate guide hole, and provided between the upper guide plate and the lower guide plate; and a guide member provided at a side of the intermediate guide plate, wherein the intermediate guide plate is limited in movement by the guide member.

    PROBE HEAD AND PROBE CARD HAVING SAME
    83.
    发明申请
    PROBE HEAD AND PROBE CARD HAVING SAME 有权

    公开(公告)号：US20210239735A1

    公开(公告)日：2021-08-05

    申请号：US17161460

    申请日：2021-01-28

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

    IPC: G01R1/073

    Abstract: Proposed are a probe head and a probe card having the same. According to the present disclosure, the probe head of the probe card includes: an upper guide plate having an upper guide hole; a lower guide plate having a lower guide hole; and an intermediate guide plate having an intermediate guide hole and provided between the upper guide plate and the lower guide plate, wherein each of a plurality of probes sequentially passes through the upper guide hole, the intermediate guide hole, and the lower guide hole, and the intermediate guide plate is made of an anodic oxide film.

    Micro LED structure and method of manufacturing same
    86.
    发明授权
    Micro LED structure and method of manufacturing same 有权

    公开(公告)号：US10964871B2

    公开(公告)日：2021-03-30

    申请号：US16904102

    申请日：2020-06-17

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

    Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

    MICRO LED TRANSFER HEAD
    87.
    发明申请
    MICRO LED TRANSFER HEAD 有权

    公开(公告)号：US20210050236A1

    公开(公告)日：2021-02-18

    申请号：US16989431

    申请日：2020-08-10

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

    IPC: H01L21/67 ,  H01L21/683 ,  B65G47/91

    Abstract: A micro LED transfer head is proposed. The micro LED transfer head includes: a holding member including a holding region that holds a micro LED by means of vacuum holding force and a non-holding region that does not hold the micro LED; and a porous member provided on top of the holding member and having arbitrary pores, wherein the holding region includes: a first holding region; and a second holding region provided above the first holding region, formed to have a larger opening area than the first holding region, and communicating with the first holding region and the porous member, whereby the micro LED transfer head selectively transfers the micro LED.

    Micro LED structure and method of manufacturing same
    88.
    发明授权
    Micro LED structure and method of manufacturing same 有权

    公开(公告)号：US10886446B2

    公开(公告)日：2021-01-05

    申请号：US16526702

    申请日：2019-07-30

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Sung Hyun Byun

    IPC: H01L33/62

    Abstract: The present invention relates generally to a micro LED structure and a method of manufacturing the same, and more particularly to a micro LED structure having an anisotropic conductive film between a micro LED and a target substrate to which the micro LED is bonded for electrically connect the micro LED and the target substrate together, and a method of manufacturing the same.

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