摘要:
An apparatus for inspecting an SMT printed circuit board includes an inspection head mounted to an X-Y table, for directed movement above the SMT printed circuit board which is to be inspected. The inspection head is caused to proceed to successive viewing fields along the surface of the SMT printed circuit board, for inspection by a series of cameras disposed within the inspection head together with appropriate lighting which is selected according to the inspection which is to be performed. Prior to soldering, it is determined whether each of the series of components to be placed on the printed circuit board were deposited as scheduled, and whether the deposited components were correctly positioned. Following the soldering procedure, it is again determined whether each component remains present on the board, and in its correct position, and steps are taken to inspect the solder fillets, and to inspect for any solder bridges.
摘要:
This application describes a novel method and its implementation for testing unpopulated and populated electronic printed circuit boards (PCBs). This method can be used to develop a new contactless test system (CTS). While eliminating drawbacks of existing test systems, this method measures electromagnetic near field distribution in the vicinity of a PCB, contactlessly, by using suitable sensors (possibly printed near field planar antennas) and sensitive measuring and processing devices. The electromagnetic fields (EMF) are generated by the distribution of charges and currents on paths and elements of the board under test (BUT). Therefore, accurate and repeatable measurements of these fields produce a specific pattern for the BUT. Such a pattern is then compared to a known pattern for the same type of board to determine whether the BUT is faulty or nonfaulty.
摘要:
An objective printed circuit board to be inspected has a printed conductive pattern (550) thereon. The image of the objective printed board is read with an image reader to obtain an image signal. Prior to the image reading of the objective printed board, a reference printed board of the same type as the objective printed board is prepared, and the image thereof is read with the image reader. An edge image of a conductive pattern on the reference printed board is extracted and enlarged to generate an enlarged edge image (SEI). In inspection of the objective printed board, only areas belonging to the enlarged edge image are actually inspected and other areas are not subjected to the inspection.
摘要:
In each configuration, at least one TDI sensor is used to image substrate portions of interest, with those portions illuminated with substantially uniform illumination. In one configuration, a substrate is compared to prestored expected characteristic features. In a second configuration, first and second patterns in a region of the surface of at least one substrate are inspected by comparing one pattern against the other and noting whether they agree with each other. This is accomplished by illuminating the two patterns, imaging the first pattern and storing its characteristics in a temporary memory, then imaging the second pattern and comparing it to the stored characteristics from the temporary memory. Then the comparisons continue sequentially with the second pattern becoming the first pattern in the next imaging/comparison sequence against a new second pattern. Each time the comparison is performed, it is noted whether or not there has been agreement between the two patterns and which two patterns where compared. This inspection technique is useful for doing die-to-die inspections. A variation of the second configuration uses two TDI sensors to simultaneously image the first and second patterns, thus eliminating the need for temporary memory. In this configuration, the two patterns are simultaneously imaged and compared, then additional patterns are compared sequentially, in the same manner with the results of the comparisons and the pattern locations stored to determine which patterns are bad when the inspection of all patterns is completed.
摘要:
A test cell for non-contact testing a circuit board for shorts and opens includes a hermetically sealable container for that circuit board, at least one wall of the container providing access to permit a circuit board to be positioned at an imaging plane inside the container. A pair of planar electrodes positioned inside the container are spaced on opposite sides of and parallel to the imaging plane and these electrodes are connected to contacts on the exterior of the container so that the electrodes can be releasably connected to an external voltage source to provide an electric field inside the container which extends perpendicular to the imaging plane. One of these electrodes and the container wall adjacent thereto are transparent to light from a pulsed laser positioned outside the container which is arranged to image a selected spot on a conductor of a circuit positioned at the imaging plane. One or more valved gas fittings are mounted to the outside of the container so that the container can be releasably connected to external gas conduits to fill the container with an inert gas. Also a sensor may be provided inside the container to sense the gas pressure in the container.
摘要:
The location of an aperture surrounded by a region of different brightness on a plane surface is achieved by line scanning the surface with an optical scanner while shifting the line position stepwise in an orthogonal direction. A change in brightness as the scanner passes between the region and aperture creates in the scanning signals, a pulse indication of the aperture position. Signals for a progressively changing group of successive scanning lines large enough in number to span a given aperture on either side in the orthogonal direction and include a signal for at least one line intersecting the aperture; i.e., three or more consecutive lines, are synchronously compared by time delaying the earlier signals to coincide with the real time signal. The coincidence of one or more line signals indicative of an aperture directly preceded and followed by a line signal free of an aperture indication signifies the presence of an aperture. The aperture indication can be timed to give the X-axis and X-axis coordinates therefor. The aperture indication signal is checked for abnormalities before being accepted.
摘要:
An empty location identification of component parts is provided which detects the presence, absence, orientation or polarity of components located on a printed circuit board or other type of component assembly. The identification is accomplished by utilizing a pattern of marks which are located in such a manner so as to be either partially or totally obscured when a component is placed in its correct location.
摘要:
An apparatus which is used for non-contact electrical measurement and physical alteration of certain characteristics and properties of electronic conductor devices. The apparatus includes a focused source of ultraviolet light which is capable of micron and sub-micron resolution.In the measurement mode the apparatus measures the energy of electrons ejected from a measurement site by the UV beam. This measurement is accomplished at a nulling/repelling device. In the alteration mode, the focused UV light beam interacts with various compounds, for example chemical gases, to create a selective reaction at specific locations at the surface of the device being operated upon.The measurement function can be related to voltage, current, temperature or the like and may be either qualitative or quantitative while being made in a non-contact basis.
摘要:
Empty component locations are detected on an assembled circuit board where the component locations are marked with spots of a fluorescent substance before assembly. The circuit board is exposed to stimulating radiation by a radiation source causing luminescence from the spots of fluorescent substance on which the stimulating radiation is impinged. The circuit board is then examined for the luminescence to determine whether the components are between the spots and the radiation source.
摘要:
A selection device for reliable selection of a plurality of lines or of a plurality of contact locations. In order to select at least two of a plurality of lines, at least two selection lines are connected to every line via a photoresistor, whereby every photoresistor is preferably controllably chargeable with light via a deflectable beam. The selection occurs when selected photoresistors are changed to a low resistance state by light impingement. For selecting at least two of a plurality of contact locations arranged in a grid pattern, the contact locations are connected to the lines via photoresistors. The device of the present invention is preferably utilized for the electrical function testing of printed circuit boards.