Apparatus for inspecting printed circuit boards with surface mounted
components
    81.
    发明授权
    Apparatus for inspecting printed circuit boards with surface mounted components 失效
    用表面安装组件检查印刷电路板的装置

    公开(公告)号:US5245421A

    公开(公告)日:1993-09-14

    申请号:US587169

    申请日:1990-09-19

    IPC分类号: G01R31/309 H04N7/18

    CPC分类号: H04N7/181 H04N7/18 G01R31/309

    摘要: An apparatus for inspecting an SMT printed circuit board includes an inspection head mounted to an X-Y table, for directed movement above the SMT printed circuit board which is to be inspected. The inspection head is caused to proceed to successive viewing fields along the surface of the SMT printed circuit board, for inspection by a series of cameras disposed within the inspection head together with appropriate lighting which is selected according to the inspection which is to be performed. Prior to soldering, it is determined whether each of the series of components to be placed on the printed circuit board were deposited as scheduled, and whether the deposited components were correctly positioned. Following the soldering procedure, it is again determined whether each component remains present on the board, and in its correct position, and steps are taken to inspect the solder fillets, and to inspect for any solder bridges.

    摘要翻译: 一种用于检查SMT印刷电路板的装置包括安装到X-Y台的检查头,用于在待检查的SMT印刷电路板上方的定向移动。 使检查头沿着SMT印刷电路板的表面进行到连续的观察区域,并且由配置在检查头内的一系列照相机以及根据要执行的检查选择的合适的照明进行检查。 在焊接之前,确定要放置在印刷电路板上的一系列组件中的每一个是否按计划沉积,以及沉积的部件是否被正确定位。 在焊接过程之后,再次确定每个部件是否保持在板上,并处于其正确的位置,并采取步骤检查焊脚,并检查任何焊接桥。

    Contactless test method for testing printed circuit boards
    82.
    发明授权
    Contactless test method for testing printed circuit boards 失效
    用于测试印刷电路板的非接触式测试方法

    公开(公告)号:US5218294A

    公开(公告)日:1993-06-08

    申请号:US860069

    申请日:1992-03-30

    申请人: Jacob Soiferman

    发明人: Jacob Soiferman

    CPC分类号: G01R31/309 G01R31/315

    摘要: This application describes a novel method and its implementation for testing unpopulated and populated electronic printed circuit boards (PCBs). This method can be used to develop a new contactless test system (CTS). While eliminating drawbacks of existing test systems, this method measures electromagnetic near field distribution in the vicinity of a PCB, contactlessly, by using suitable sensors (possibly printed near field planar antennas) and sensitive measuring and processing devices. The electromagnetic fields (EMF) are generated by the distribution of charges and currents on paths and elements of the board under test (BUT). Therefore, accurate and repeatable measurements of these fields produce a specific pattern for the BUT. Such a pattern is then compared to a known pattern for the same type of board to determine whether the BUT is faulty or nonfaulty.

    摘要翻译: 该应用描述了一种用于测试未填充和填充的电子印刷电路板(PCB)的新颖方法及其实现。 该方法可用于开发新的非接触式测试系统(CTS)。 在消除现有测试系统的缺点的同时,该方法通过使用合适的传感器(可能打印在近场平面天线)和敏感的测量和处理设备来非接触地测量PCB附近的电磁近场分布。 电磁场(EMF)是由被测试板(BUT)的路径和元件上的电荷和电流的分布产生的。 因此,这些领域的准确和可重复的测量产生了BUT的特定模式。 然后将这种模式与用于相同类型的板的已知模式进行比较,以确定BUT是错误还是非故障。

    Method of and device for inspecting pattern of printed circuit board
    83.
    发明授权
    Method of and device for inspecting pattern of printed circuit board 失效
    用于检查印刷电路板图案的方法和装置

    公开(公告)号:US5150423A

    公开(公告)日:1992-09-22

    申请号:US727826

    申请日:1991-07-09

    申请人: Tetsuo Hoki

    发明人: Tetsuo Hoki

    摘要: An objective printed circuit board to be inspected has a printed conductive pattern (550) thereon. The image of the objective printed board is read with an image reader to obtain an image signal. Prior to the image reading of the objective printed board, a reference printed board of the same type as the objective printed board is prepared, and the image thereof is read with the image reader. An edge image of a conductive pattern on the reference printed board is extracted and enlarged to generate an enlarged edge image (SEI). In inspection of the objective printed board, only areas belonging to the enlarged edge image are actually inspected and other areas are not subjected to the inspection.

    摘要翻译: 要检查的目标印刷电路板在其上具有印刷导电图案(550)。 用图像读取器读取目标印刷电路板的图像以获得图像信号。 在目标印刷电路板的图像读取之前,准备与目标印刷电路板相同类型的参考印刷电路板,并且用图像读取器读取其图像。 提取并放大参考印刷电路板上的导电图案的边缘图像以产生放大的边缘图像(SEI)。 在对目标印刷电路板进行检查时,仅对属于放大边缘图像的区域进行实际检查,其他区域不进行检查。

    Automatic high speed optical inspection system
    84.
    发明授权
    Automatic high speed optical inspection system 失效
    自动高速光学检测系统

    公开(公告)号:US5131755A

    公开(公告)日:1992-07-21

    申请号:US429859

    申请日:1989-10-31

    摘要: In each configuration, at least one TDI sensor is used to image substrate portions of interest, with those portions illuminated with substantially uniform illumination. In one configuration, a substrate is compared to prestored expected characteristic features. In a second configuration, first and second patterns in a region of the surface of at least one substrate are inspected by comparing one pattern against the other and noting whether they agree with each other. This is accomplished by illuminating the two patterns, imaging the first pattern and storing its characteristics in a temporary memory, then imaging the second pattern and comparing it to the stored characteristics from the temporary memory. Then the comparisons continue sequentially with the second pattern becoming the first pattern in the next imaging/comparison sequence against a new second pattern. Each time the comparison is performed, it is noted whether or not there has been agreement between the two patterns and which two patterns where compared. This inspection technique is useful for doing die-to-die inspections. A variation of the second configuration uses two TDI sensors to simultaneously image the first and second patterns, thus eliminating the need for temporary memory. In this configuration, the two patterns are simultaneously imaged and compared, then additional patterns are compared sequentially, in the same manner with the results of the comparisons and the pattern locations stored to determine which patterns are bad when the inspection of all patterns is completed.

    摘要翻译: 在每个配置中,使用至少一个TDI传感器来对感兴趣的衬底部分进行成像,其中那些部分用基本上均匀的照明照亮。 在一种配置中,将基底与预先存储的预期特征特征进行比较。 在第二配置中,通过将一个图案与另一个图案相比较并注意它们是否彼此一致来检查至少一个基板的表面区域中的第一和第二图案。 这是通过照亮两个图案,对第一图案进行成像并将其特征存储在临时存储器中,然后对第二图案进行成像并将其与来自临时存储器的存储特性进行比较来实现的。 然后,相对于新的第二图案,比较继续顺序地与第二图案成为下次成像/比较序列中的第一图案。 每次进行比较时,都注意到两种模式之间是否有一致,哪两种模式相比较。 这种检查技术对于进行模 - 模检查是有用的。 第二配置的变型使用两个TDI传感器来同时对第一和第二图案进行成像,从而消除对临时存储器的需要。 在该配置中,两个图案被同时成像和比较,然后以与比较的结果相同的方式对附加图案进行比较,并且存储的图案位置以确定当所有图案的检查完成时哪些图案是不良的。

    Test cell for non-contact opens/shorts testing of electrical circuits
    85.
    发明授权
    Test cell for non-contact opens/shorts testing of electrical circuits 失效
    测试电池用于电路的非接触开路/短路测试

    公开(公告)号:US5032788A

    公开(公告)日:1991-07-16

    申请号:US371704

    申请日:1989-06-26

    IPC分类号: G01R31/02 G01R31/309

    CPC分类号: G01R31/024 G01R31/309

    摘要: A test cell for non-contact testing a circuit board for shorts and opens includes a hermetically sealable container for that circuit board, at least one wall of the container providing access to permit a circuit board to be positioned at an imaging plane inside the container. A pair of planar electrodes positioned inside the container are spaced on opposite sides of and parallel to the imaging plane and these electrodes are connected to contacts on the exterior of the container so that the electrodes can be releasably connected to an external voltage source to provide an electric field inside the container which extends perpendicular to the imaging plane. One of these electrodes and the container wall adjacent thereto are transparent to light from a pulsed laser positioned outside the container which is arranged to image a selected spot on a conductor of a circuit positioned at the imaging plane. One or more valved gas fittings are mounted to the outside of the container so that the container can be releasably connected to external gas conduits to fill the container with an inert gas. Also a sensor may be provided inside the container to sense the gas pressure in the container.

    Device for determining location of apertures
    86.
    发明授权
    Device for determining location of apertures 失效
    用于确定孔位置的装置

    公开(公告)号:US4980570A

    公开(公告)日:1990-12-25

    申请号:US483631

    申请日:1990-02-23

    CPC分类号: G01R31/309 H05K13/08

    摘要: The location of an aperture surrounded by a region of different brightness on a plane surface is achieved by line scanning the surface with an optical scanner while shifting the line position stepwise in an orthogonal direction. A change in brightness as the scanner passes between the region and aperture creates in the scanning signals, a pulse indication of the aperture position. Signals for a progressively changing group of successive scanning lines large enough in number to span a given aperture on either side in the orthogonal direction and include a signal for at least one line intersecting the aperture; i.e., three or more consecutive lines, are synchronously compared by time delaying the earlier signals to coincide with the real time signal. The coincidence of one or more line signals indicative of an aperture directly preceded and followed by a line signal free of an aperture indication signifies the presence of an aperture. The aperture indication can be timed to give the X-axis and X-axis coordinates therefor. The aperture indication signal is checked for abnormalities before being accepted.

    摘要翻译: 在平面上由不同亮度的区域包围的孔的位置通过使用光学扫描仪线扫描表面来实现,同时沿正交方向逐步地移动线位置。 当扫描仪在区域和孔之间通过时,在扫描信号中产生亮度的变化,即孔径位置的脉冲指示。 用于逐渐变化的连续扫描线组的信号,其数量足够大以跨越正交方向上的任一侧上的给定孔径,并且包括用于与孔相交的至少一条线的信号; 即通过时间延迟较早的信号与实时信号一致地同步地比较三个或更多个连续的行。 一个或多个指示孔径的线信号的一致直接在没有孔径指示的线路信号之前和之后,表示存在孔径。 光圈指示可以定时,以给出X轴和X轴坐标。 在接受光圈指示信号之前检查异常。

    Apparatus including a focused UV light source for non-contact
measurement and alteration of electrical properties of conductors
    88.
    发明授权
    Apparatus including a focused UV light source for non-contact measurement and alteration of electrical properties of conductors 失效
    装置包括用于非接触式测量和改变导体电性能的聚焦UV光源

    公开(公告)号:US4967152A

    公开(公告)日:1990-10-30

    申请号:US261687

    申请日:1988-10-24

    IPC分类号: G01R31/27 G01R31/309

    CPC分类号: G01R31/309 G01R31/275

    摘要: An apparatus which is used for non-contact electrical measurement and physical alteration of certain characteristics and properties of electronic conductor devices. The apparatus includes a focused source of ultraviolet light which is capable of micron and sub-micron resolution.In the measurement mode the apparatus measures the energy of electrons ejected from a measurement site by the UV beam. This measurement is accomplished at a nulling/repelling device. In the alteration mode, the focused UV light beam interacts with various compounds, for example chemical gases, to create a selective reaction at specific locations at the surface of the device being operated upon.The measurement function can be related to voltage, current, temperature or the like and may be either qualitative or quantitative while being made in a non-contact basis.

    摘要翻译: 用于非接触电测量和电子导体器件的某些特性和性质的物理改变的装置。 该设备包括能够微米和亚微米分辨率的聚焦紫外光源。 在测量模式下,该装置测量通过UV光束从测量部位喷出的电子的能量。 该测量是在归零/排斥装置下实现的。 在改变模式中,聚焦的UV光束与各种化合物(例如化学气体)相互作用,以在被操作的装置的表面上的特定位置产生选择性反应。 测量功能可以与电压,电流,温度等相关,并且可以在非接触的基础上进行定性或定量。

    Method for detecting missing circuit board components
    89.
    发明授权
    Method for detecting missing circuit board components 失效
    检测缺少电路板部件的方法

    公开(公告)号:US4963752A

    公开(公告)日:1990-10-16

    申请号:US292487

    申请日:1988-12-30

    IPC分类号: G01R31/309 H05K1/02 H05K3/30

    摘要: Empty component locations are detected on an assembled circuit board where the component locations are marked with spots of a fluorescent substance before assembly. The circuit board is exposed to stimulating radiation by a radiation source causing luminescence from the spots of fluorescent substance on which the stimulating radiation is impinged. The circuit board is then examined for the luminescence to determine whether the components are between the spots and the radiation source.

    摘要翻译: 在组装电路板上检测到空的部件位置,其中组件位置在组装之前用荧光物质的点标记。 电路板通过辐射源暴露于刺激性辐射,引起来自激发辐射的荧光物质的斑点的发光。 然后检查电路板的发光以确定组件是否在点和辐射源之间。

    Selection device
    90.
    发明授权
    Selection device 失效
    选择装置

    公开(公告)号:US4904067A

    公开(公告)日:1990-02-27

    申请号:US168986

    申请日:1988-03-16

    申请人: Guenter Doemens

    发明人: Guenter Doemens

    摘要: A selection device for reliable selection of a plurality of lines or of a plurality of contact locations. In order to select at least two of a plurality of lines, at least two selection lines are connected to every line via a photoresistor, whereby every photoresistor is preferably controllably chargeable with light via a deflectable beam. The selection occurs when selected photoresistors are changed to a low resistance state by light impingement. For selecting at least two of a plurality of contact locations arranged in a grid pattern, the contact locations are connected to the lines via photoresistors. The device of the present invention is preferably utilized for the electrical function testing of printed circuit boards.

    摘要翻译: 一种用于可靠地选择多条线或多个接触位置的选择装置。 为了选择多条线中的至少两条线,至少两条选择线经由光电晶体管连接到每条线上,由此每个光电晶体优选地通过可偏转光束可控地对光进行充电。 当选择的光敏电阻通过光照而变为低电阻状态时,进行选择。 为了选择以网格图案布置的多个接触位置中的至少两个,接触位置通过光敏电阻连接到线路。 本发明的装置优选用于印刷电路板的电功能测试。