Abstract:
The stopping of a load suspended from a crane requires a swing control or, respectively, a swing damping. Upon employment of microwave measuring units, spacings between a carrying cable suspension and a load suspension point are determined on the basis of transit time measurements. The position of the load suspension point can be determined from the transit time measurements quickly and with high precision. Swinging motions are avoided by controlled opposing control of the carrying cable suspension.
Abstract:
A selection device for reliable selection of a plurality of lines or of a plurality of contact locations. In order to select at least two of a plurality of lines, at least two selection lines are connected to every line via a photoresistor, whereby every photoresistor is preferably controllably chargeable with light via a deflectable beam. The selection occurs when selected photoresistors are changed to a low resistance state by light impingement. For selecting at least two of a plurality of contact locations arranged in a grid pattern, the contact locations are connected to the lines via photoresistors. The device of the present invention is preferably utilized for the electrical function testing of printed circuit boards.
Abstract:
An automated opto-electronic test system for quality control of two-dimensional elements with high geometric figure density, such as printed circuits, intermediate printed circuit products, and printing tools has a semiconductor image sensor disposed above a compound table having a position sensor which moves the test specimen beneath a lens in a meandering path at a velocity which is known relative to the semiconductor image sensor. The signals from the image sensor are first analyzed in an analog signal pre-precessor to which are connected a number of error recognition circuits operating in parallel each of which produces an error report which is transmitted to an error coordinating circuit. The error reports are therein associated with position coordinates on the test specimen which are supplied by the position sensor of the compound table and stored until a complete scan of the test specimen has been undertaken and are subsequently employed to move the test specimen to the positions at which the errors occur for visual examination such as by magnification. If the test specimen is a printed circuit, tests which are undertaken are a minimum geometry test measuring respective track and insulation widths, a solder eye test and a special geometry test for open and short circuits.
Abstract:
The invention relates to a capacitive microsystem, which can be used to replace conventional strain gauges used currently. The microsystem has substantial advantages with regard to handling, overload stability and endurance. Capacitive microsystems of this type can be used to record deformations and to calculate forces, torque etc. They can be used in particular to determine the weight of vehicle seats, to provide for example deployment data for an airbag.
Abstract:
Surface shape determination and an exact speed measurement of a moving object is undertaken with an arrangement including semiconductor elements and having two spaced semiconductor sensor lines. Illumination of the moving object occurs via at least one laser diode that is arranged in the proximity of the semiconductor sensor lines. The semiconductor sensor lines are used to perform a registration of cross-sectional profiles by integrating a number of range vectors calculated from sensed reflected light pulses at times when the moving object is not present and present. Successively registered cross-sectional profiles of a vehicle are converted into cross-sectional areas and into longitudinal profiles. The speed can be identified on the basis of the time-offset between identical registration in the first and second semiconductor sensor lines. A categorization of different types of moving object is accomplished by comparing the calculated cross-sectional areas and longitudinal profiles with known object characteristics.
Abstract:
Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards. In the electrical function testing of wiring matrices, particularly of printed circuit boards, the number of required leads and switch elements can be drastically reduced. In the present apparatus, every measuring locations of the printed circuit board can be selected by an associated busbar and by an intermediate mask that prevents the contacting of non-selected measuring locations. The busbars preferably are orientated transversely relative to the principal direction of the wiring of the printed circuit board. The bus bar interconnecting a number of elements, each of the contact elements being a test probe.
Abstract:
Integral temperature measurement in electrical machines, transformers and energy conversion systems. An integral temperature measurement for electrical machines, transformers and energy conversion systems produces no additonal potential or voltage in the windings of such equipment. As a result, no conductive or semiconductive material can be used in a temperature sensor. The present invention utilizes the temperature dependency of the propagation conditions of sound or ultrasound in gases and also makes use of light waveguide technology. The sound or ultrasound is guided in a flexible capillary along a path along which an integral temperature measurement is to be taken.
Abstract:
The present invention is based on an use of the already existing actuator bottom as a deformation element for a direct measurement of braking force, and on its geometric configuration in order to measure a force in a way which is largely independent of temperature and free of hysteresis. Accordingly, a force sensor is integrated into an actuator for generally or transmitting a force in the force flux. The actuator bottom is transverse to the force flux.
Abstract:
A solder testing apparatus comprising image processing means for performing image processing on an image of an appearance of a soldered portion to identify shape characterizing amounts for the soldered portion; and defect determining means for performing good/bad determination on the soldered portion from data derived by the image processing means and data from test parameter storing means for storing shape characterizing amounts at design time, wherein tested-object standard shape estimating means is included for extracting shape characterizing amounts of a non-defective soldered portion by statistically processing shape characterizing amounts for soldered portions identified by the image processing means, and defect determining parameters stored in the test parameter storing means are updated based on standard shape values from the tested-object standard shape estimating means, so that a highly reliable test is realized by setting defect determining parameters based on actual shapes and dimensions of leads and pads of electronic components on a printed circuit board.
Abstract:
Apparatus for electrical function testing of wiring matrices, particularly of printed circuit boards. In the electrical function testing of wiring matrices, particularly of printed circuit boards, the number of required leads and switch elements can be drastically reduced. In the present apparatus, every measuring locations of the printed circuit board can be selected by an associated busbar and by an intermediate mask that prevents the contacting of non-selected measuring locations. The busbars preferably are orientated transversely relative to the principal direction of the wiring of the printed circuit board.