摘要:
A dynode (8) constituting an electron multiplier or a photomultiplier is provided with eight rows of channels (15) each defined by an outer frame (16) and a partitioning part (17) of the dynode (8). In each channel (15), a plurality of electron multiplying holes (14) are arranged. In specified positions of the outer frame (16) and the partitioning part (17) of the dynode (8), glass receiving parts (21) wider than the outer frame (16) and the partitioning part (17) are provided integrally with the dynode (8). Glass parts (22) are bonded to all the glass receiving parts (21). The glass parts (22) are bonded by applying glass to the glass receiving parts (21) and hardening the glass and each have a generally dome-like convex shape. Each dynode (8) is formed after the dome-like glass part (22) is bonded to the glass receiving part (21).
摘要:
An actuator device includes: a support portion; a movable portion; a first connection portion connecting the movable portion to the support portion on a first axis so that the movable portion is swingable around the first axis; and a first wiring provided on the first connection portion. The first wiring includes a first main body formed of a metal material having a Vickers hardness of 50 HV or more. The first main body includes a first surface facing the first connection portion and a second surface other than the first surface. The second surface has a shape in which a curvature is continuous over the entire second surface in a cross-section perpendicular to an extension direction of the first wiring.
摘要:
A laser processing method which can reduce the chipping generated when a plate-like object to be processed formed with a modified region is turned into small pieces in steps other than its dividing step. In a part extending along a line to cut in an object to be processed, laser light is oscillated in a pulsing fashion in an intermediate portion including an effective part, and is continuously oscillated in one end portion and the other end portion on both sides of the intermediate portion. Since the laser light intensity becomes lower in continuous oscillation than in pulse oscillation, modified regions can be formed in the intermediate portion but not in one end portion and the other end portion. This keeps the modified regions from reaching the outer face of the substrate, thus making it possible to prevent particles from occurring when forming the modified regions.
摘要:
A nitride semiconductor substrate is featured in comprising: a GaN semiconductor layer grown on a base layer, which has a substantially triangular cross-section along the thickness direction thereof, a periodic stripe shapes, and uneven surfaces arranged on the stripes inclined surfaces; and an overgrown layer composed of AlGaN or InAlGaN on the GaN semiconductor layer.
摘要:
The present invention relates to a phase modulating apparatus capable of highly accurately and easily correcting the phase modulation characteristic of a reflective electric address spatial light modulator even when a condition of input light is changed. In the LCOS phase modulating apparatus, an input unit inputs the condition of the input light, and a processing unit sets an input value for each pixel. A correction value deriving unit determines a correction condition according to the condition of the input light. A control input value converting unit converts the input value set for each pixel into a corrected input value based on the correction condition. An LUT processing unit converts the corrected input value into a voltage value, and drives each pixel by using a drive voltage equivalent to the converted voltage value.
摘要:
A semiconductor photodetector 10 has a first semiconductor substrate 1 that is of a first conductive type and a low resistivity and has a (111) front surface, and a second semiconductor substrate 2 that is of the first conductive type and a high resistivity, has a (100) front surface, and is adhered onto first semiconductor substrate 1. A semiconductor region 3 of a second conductive type is formed on the front surface side of second semiconductor substrate 2. A region of a periphery of semiconductor region 3 is etched until first semiconductor substrate 1 is exposed. A first electrode 1e and a second electrode 2e are electrically connected to the exposed front surface of first semiconductor substrate 1 and to semiconductor region 3, respectively.