公开(公告)号：US12224299B2

公开(公告)日：2025-02-11

申请号：US17720398

申请日：2022-04-14

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Li-Chun Hung ,  Chien-Yuan Wang

IPC: H01L27/146

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip, a ring-shaped wall, and a light-permeable layer. The substrate has a first surface and a second surface that is opposite to the first surface. The first surface of the substrate has a chip-bonding region and a connection region that surrounds the chip-bonding region, and the substrate has a plurality of protrusions arranged in the connection region. The sensor chip is disposed on the chip-bonding region of the substrate and is electrically coupled to the substrate. The ring-shaped wall is formed on the connection region of the substrate, and the protrusions of the substrate are embedded in and gaplessly connected to the ring-shaped wall. The light-permeable layer is disposed on the ring-shaped wall, and the light-permeable layer, the ring-shaped wall, and the substrate jointly define an enclosed space therein.

公开(公告)号：US20230215896A1

公开(公告)日：2023-07-06

申请号：US17720398

申请日：2022-04-14

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： CHIEN-CHEN LEE ,  LI-CHUN HUNG ,  CHIEN-YUAN WANG

IPC: H01L27/146

CPC classification number: H01L27/14636 ,  H01L27/14618

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip, a ring-shaped wall, and a light-permeable layer. The substrate has a first surface and a second surface that is opposite to the first surface. The first surface of the substrate has a chip-bonding region and a connection region that surrounds the chip-bonding region, and the substrate has a plurality of protrusions arranged in the connection region. The sensor chip is disposed on the chip-bonding region of the substrate and is electrically coupled to the substrate. The ring-shaped wall is formed on the connection region of the substrate, and the protrusions of the substrate are embedded in and gaplessly connected to the ring-shaped wall. The light-permeable layer is disposed on the ring-shaped wall, and the light-permeable layer, the ring-shaped wall, and the substrate jointly define an enclosed space therein.

公开(公告)号：US20230207590A1

公开(公告)日：2023-06-29

申请号：US17717223

申请日：2022-04-11

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： YA-HAN CHANG ,  LI-CHUN HUNG ,  CHIEN-CHEN LEE

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14621 ,  H01L27/14627 ,  H01L27/14618 ,  H01L24/05 ,  H01L24/48 ,  H01L2224/48228 ,  H01L2224/05026

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a ring-shaped support disposed on the sensor chip, and a light-permeable layer disposed on the ring-shaped support. A top portion of the sensor chip defines a sensing region and a carrying region that surrounds the sensing region and that carries the ring-shaped support. The top portion of the sensor chip includes a passivation layer arranged in the sensing region and the carrying region, a color filter arranged in the sensing region and the carrying region, a pixel layer arranged in the sensing region and formed on the central segment, and a micro-lens layer that is formed on the pixel layer. A part of the color filter layer in the carrying region has a roughened surface and at least partially embedded in the ring-shaped support.

公开(公告)号：US20220360692A1

公开(公告)日：2022-11-10

申请号：US17667625

申请日：2022-02-09

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： CHIA-SHUAI CHANG ,  CHIEN-CHEN LEE ,  JUI-HUNG HSU

IPC: H04N5/225

Abstract: A sensor lens assembly having a non-reflow configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to a surface of the circuit board, a sensor chip assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The circuit board has a chip-receiving slot recessed in the surface thereof The sensor chip is arranged in the chip-receiving slot, and a top surface of the sensor chip and the surface of the circuit board have a step difference therebetween that is less than or equal to 10 μm. The supporting adhesive layer is in a ringed shape and is disposed on the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer and faces the sensor chip.

公开(公告)号：US20210150689A1

公开(公告)日：2021-05-20

申请号：US16862731

申请日：2020-04-30

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： YI-CHENG JUAN ,  HAN-HSING CHEN

IPC: G06T7/00 ,  G06T7/30

Abstract: A defect inspection method for a sensor package structure includes: using an image capture device to separately focus on and take pictures of at least three to-be-inspected regions of the sensor package structure along a height direction, so as to respectively obtain a defect image from one of the to-be-inspected regions, wherein the defect images are aligned with each other along the height direction and have different grayscale values; determining the defect image having a maximum grayscale value as a reference defect image, and defining any of the remaining defect images as a to-be-confirmed defect image; multiplying the maximum grayscale value by a predetermined grayscale ratio to obtain a predicted grayscale value, and confirming whether a difference between the to-be-confirmed and predicted grayscale values falls within an error range.

公开(公告)号：US09184331B2

公开(公告)日：2015-11-10

申请号：US13766568

申请日：2013-02-13

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chun-Hua Chuang ,  Chien-Wei Chang ,  Chen-Pin Peng ,  Chung-Hsien Hsin ,  Chun-Lung Huang ,  Hsiu-Wen Tu ,  Cheng-Chang Wu ,  Chung-Yu Yang ,  Rong-Chang Wang ,  Jo-Wei Yang

IPC: H01L21/00 ,  H01L31/18 ,  H01L27/146

CPC classification number: H01L31/18 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14685 ,  H01L2224/48091 ,  H01L2224/48464 ,  H01L2224/49175 ,  H01L2924/0002 ,  H01L2924/16235 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A method for reducing the tilt of an optical unit during manufacture of an image sensor includes the steps of: providing a semimanufacture of the image sensor, carrying out a preheating process, carrying out an adhesive application process, carrying out an optical unit mounting process, and carrying out a packaging process. Due to the preheating process, the semimanufacture will be subjected to a stabilized process environment during the adhesive application process and the optical unit mounting process, so as for the optical unit to remain highly flat once attached to the semimanufacture. The method reduces the chances of tilt and crack of the optical unit and thereby contributes to a high yield rate.

Abstract translation: 一种用于在图像传感器制造期间减小光学单元的倾斜的方法包括以下步骤：提供图像传感器的半制造，进行预热处理，执行粘合剂施加过程，执行光学单元安装过程， 并进行包装过程。 由于预热过程，在粘合剂施加过程和光学单元安装过程中，半制造将经受稳定的工艺环境，以使光学单元在附接到半制造时保持高度平坦。 该方法降低了光学单元的倾斜和裂纹的机会，从而有助于高的屈服率。

公开(公告)号：US08847146B2

公开(公告)日：2014-09-30

申请号：US12579493

申请日：2009-10-15

Applicant: Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nan Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

Inventor： Hsiu-Wen Tu ,  Ren-Long Kuo ,  Young-Houng Shiao ,  Tsao-Pin Chen ,  Mon-Nan Ho ,  Chih-Cheng Hsu ,  Chin-Fu Lin ,  Chung-Hsien Hsin

IPC: H01J5/02 ,  H01L31/0203 ,  H01L27/146 ,  H01L23/10 ,  H01L23/04

CPC classification number: H01L27/14618 ,  H01L23/04 ,  H01L23/10 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.

Abstract translation: 本发明公开了一种图像传感器封装结构。 图像传感器封装结构包括基板，芯片，透明盖，第一壳体和封装材料。 透明盖子覆盖了芯片的敏化区域，并且还粘附在衬底上的芯片上。 附着在透明盖上的第一壳体形成开口，使得光线可以穿过开口和透明盖子进入致敏区域。 封装材料围绕芯片和透明盖子覆盖并填充在基板和第一壳体之间。 由于布置在第一壳体和透明盖之间以及透明盖和芯片之间的粘合剂层的布置，所以来自湿气的阻塞区域被拉长。 因此，可以提高图像传感器封装结构的可靠性。

公开(公告)号：US08828777B2

公开(公告)日：2014-09-09

申请号：US13012967

申请日：2011-01-25

Applicant: Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Han-Hsing Chen ,  Ming-Hui Chen ,  Ren-Long Kuo ,  Chih-Cheng Hsu ,  Young-Houng Shiao ,  Tsao-Pin Chen

Inventor： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Han-Hsing Chen ,  Ming-Hui Chen ,  Ren-Long Kuo ,  Chih-Cheng Hsu ,  Young-Houng Shiao ,  Tsao-Pin Chen

IPC: H01L21/52 ,  H01L21/56 ,  H01L27/146

CPC classification number: H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/13 ,  H01L2924/181 ,  H01L2924/00

Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.

Abstract translation: 本发明公开了一种晶片级图像传感器封装结构及其制造方法。 该制造方法包括以下步骤：提供硅晶片，切割硅晶片，提供多个透明盖，制造多个半成品，执行包装工艺，安装焊球，以及在半 -制成品。 本发明的制造方法具有直接，简单，节省成本的优点。 因此，晶片级图像传感器封装结构重量轻，薄且紧凑。 为了防止图像传感器芯片在处理过程中产生冲击时开裂，在包装过程中，密封剂将被布置在半成品的侧面。

公开(公告)号：US08314481B2

公开(公告)日：2012-11-20

申请号：US11131727

申请日：2005-05-18

Applicant: Chung Hsien Hsin ,  Yves Huang ,  Kevin Chang ,  Chief Lin

Inventor： Chung Hsien Hsin ,  Yves Huang ,  Kevin Chang ,  Chief Lin

IPC: H01L23/06

CPC classification number: H01L27/14618 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A substrate structure for an image sensor package includes a bottom base and a frame layer. The bottom base has an upper surface formed with a plurality of first electrodes, and a lower surface formed with a plurality of second electrodes. An insulation layer is coated between the first electrodes and in direct surface contact with the upper surface of the bottom base. A frame layer is arranged on and in direct surface contact with the first electrodes and the insulation layer to form a cavity together with the bottom base. The insulation layer is interposed between the bottom base and the frame layer.

Abstract translation: 用于图像传感器封装的衬底结构包括底部底座和框架层。 底部底部具有形成有多个第一电极的上表面和形成有多个第二电极的下表面。 绝缘层涂覆在第一电极之间并且直接与底部底部的上表面接触。 框架层布置成与第一电极和绝缘层直接表面接触以与底部底部一起形成空腔。 绝缘层位于底部底座和框架层之间。

公开(公告)号：US20110241147A1

公开(公告)日：2011-10-06

申请号：US13012967

申请日：2011-01-25

Applicant: Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Han-Hsing Chen ,  Ming-Hui Chen ,  Ren-Long Kuo ,  Chih-Cheng Hsu ,  Young-Houng Shiao ,  Tsao-Pin Chen

Inventor： Hsiu-Wen Tu ,  Chung-Hsien Hsin ,  Han-Hsing Chen ,  Ming-Hui Chen ,  Ren-Long Kuo ,  Chih-Cheng Hsu ,  Young-Houng Shiao ,  Tsao-Pin Chen

IPC: H01L31/0224 ,  H01L31/18 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L24/97 ,  H01L27/14683 ,  H01L27/14687 ,  H01L2224/13 ,  H01L2924/181 ,  H01L2924/00

Abstract: The present invention discloses a wafer level image sensor packaging structure and a manufacturing method of the same. The manufacturing method includes the following steps: providing a silicon wafer, dicing the silicon wafer, providing a plurality of transparent lids, fabricating a plurality of semi-finished products, performing a packaging process, mounting solder balls, and cutting an encapsulant between the semi-finished products. The manufacturing method of the invention has the advantage of being straightforward, uncomplicated, and cost-saving. Thus, the wafer level image sensor package structure is lightweight, thin, and compact. To prevent the image sensor chip from cracking on impact during handling, the encapsulant will be arranged on the lateral sides of the semi-finished products during the packaging process.

Abstract translation: 本发明公开了一种晶片级图像传感器封装结构及其制造方法。 该制造方法包括以下步骤：提供硅晶片，切割硅晶片，提供多个透明盖，制造多个半成品，执行包装工艺，安装焊球，以及在半 -制成品。 本发明的制造方法具有直接，简单，节省成本的优点。 因此，晶片级图像传感器封装结构重量轻，薄且紧凑。 为了防止图像传感器芯片在处理过程中产生冲击时开裂，在包装过程中，密封剂将被布置在半成品的侧面。