公开(公告)号：US10825851B2

公开(公告)日：2020-11-03

申请号：US16390280

申请日：2019-04-22

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Sheng Yang ,  Li-Chun Hung ,  Hsiu-Wen Tu ,  Jo-Wei Yang ,  Chien-Chen Lee ,  Jian-Ru Chen

IPC: H01L23/498 ,  H01L27/146 ,  H01L23/00 ,  H01L23/31 ,  H01L23/04

Abstract: A sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of metal wires electrically connecting the substrate and the sensor chip, a glass cover disposed on the sensor chip, and an adhesive layer connecting the glass cover to the substrate. The substrate is made of a material having a coefficient of thermal expansion (CTE) that is less than 10 ppm/° C. The glass cover includes a board body and an annular supporting body connected to the board body. The annular supporting body of the glass cover is fixed onto the substrate through the adhesive layer, so that the glass cover and the substrate jointly surround an enclosed accommodating space. The sensor chip and the metal wires are arranged in the accommodating space, and the sensing region of the sensor chip faces the light-permeable portion of the board body.

公开(公告)号：US12224299B2

公开(公告)日：2025-02-11

申请号：US17720398

申请日：2022-04-14

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Li-Chun Hung ,  Chien-Yuan Wang

IPC: H01L27/146

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip, a ring-shaped wall, and a light-permeable layer. The substrate has a first surface and a second surface that is opposite to the first surface. The first surface of the substrate has a chip-bonding region and a connection region that surrounds the chip-bonding region, and the substrate has a plurality of protrusions arranged in the connection region. The sensor chip is disposed on the chip-bonding region of the substrate and is electrically coupled to the substrate. The ring-shaped wall is formed on the connection region of the substrate, and the protrusions of the substrate are embedded in and gaplessly connected to the ring-shaped wall. The light-permeable layer is disposed on the ring-shaped wall, and the light-permeable layer, the ring-shaped wall, and the substrate jointly define an enclosed space therein.

公开(公告)号：US12119363B2

公开(公告)日：2024-10-15

申请号：US17749077

申请日：2022-05-19

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14625 ,  H01L27/14618 ,  H01L24/05 ,  H01L24/06 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05553 ,  H01L2224/05573 ,  H01L2224/06135 ,  H01L2224/32225 ,  H01L2224/48106 ,  H01L2224/48228 ,  H01L2224/49175 ,  H01L2224/73265

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip, a ring-shaped supporting layer, and a light-permeable sheet. The sensor chip is disposed on and electrically coupled to the substrate. The ring-shaped supporting layer is disposed on the sensor chip and surrounds a sensing region of the sensor chip. The light-permeable sheet has a ring-shaped notch recessed in a peripheral edge of an inner surface of the light-permeable sheet, and a depth of the ring-shaped notch with respect to the inner surface is at least 10 μm. The light-permeable sheet is disposed on the ring-shaped supporting layer through the ring-shaped notch, and the inner surface is not in contact with the ring-shaped supporting layer, so that the inner surface of the light-permeable sheet, an inner side of the ring-shaped supporting layer, and the top surface of the sensor chip jointly define an enclosed space.

公开(公告)号：US11776975B2

公开(公告)日：2023-10-03

申请号：US17468824

申请日：2021-09-08

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Jui-Hung Hsu ,  Ya-Han Chang

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/14625 ,  H01L27/14636

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupled to the substrate and the sensor chip, a light-permeable layer, and a colloid formed on the substrate to fix the light-permeable layer. The colloid covers the wires, a peripheral portion of the sensor chip, and lateral surfaces of the light-permeable layer. A top curved surface of the colloid is partially arranged beside the lateral surfaces. In a cross section of the sensor package structure, the top curved surface has a reference point spaced apart from one of the lateral surfaces adjacent thereto by 100 μm, a top edge of the top curved surface and the reference point define a connection line, and the connection line and the one of the lateral surfaces have an acute angle within a range from 25 degrees to 36 degrees.

公开(公告)号：US12113082B2

公开(公告)日：2024-10-08

申请号：US17717223

申请日：2022-04-11

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Ya-Han Chang ,  Li-Chun Hung ,  Chien-Chen Lee

IPC: H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14621 ,  H01L24/05 ,  H01L24/48 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2224/05026 ,  H01L2224/48228

Abstract: A sensor package structure is provided and includes a substrate, a sensor chip disposed on and electrically coupled to the substrate, a ring-shaped support disposed on the sensor chip, and a light-permeable layer disposed on the ring-shaped support. A top portion of the sensor chip defines a sensing region and a carrying region that surrounds the sensing region and that carries the ring-shaped support. The top portion of the sensor chip includes a passivation layer arranged in the sensing region and the carrying region, a color filter arranged in the sensing region and the carrying region, a pixel layer arranged in the sensing region and formed on the central segment, and a micro-lens layer that is formed on the pixel layer. A part of the color filter layer in the carrying region has a roughened surface and at least partially embedded in the ring-shaped support.

公开(公告)号：US12108517B2

公开(公告)日：2024-10-01

申请号：US17580577

申请日：2022-01-20

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chia-Shuai Chang ,  Chien-Chen Lee ,  Li-Chun Hung ,  Ya-Han Chang

IPC: H05K1/02 ,  H01L23/00 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0274 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H05K1/11 ,  H05K1/181 ,  H01L2224/32225 ,  H01L2224/48228 ,  H01L2224/73215 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A sensor lens assembly having a non-soldering configuration is provided. The sensor lens assembly includes a circuit board, an optical module fixed to the circuit board, a sensor chip and an extending wall both assembled to the circuit board, a plurality of wires electrically coupling the sensor chip and the circuit board, a supporting adhesive layer, and a light-permeable sheet. The extending wall surrounds the sensor chip and has an extending top surface that is substantially flush with a top surface of the sensor chip. The supporting adhesive layer is in a ringed shape and is disposed on the extending top surface of the extending wall and the top surface of the sensor chip. The light-permeable sheet is disposed on the supporting adhesive layer, so that the light-permeable sheet, the supporting adhesive layer, and the top surface of the sensor chip jointly define an enclosed space.

公开(公告)号：US12080659B2

公开(公告)日：2024-09-03

申请号：US17715924

申请日：2022-04-07

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Chien-Chen Lee ,  Li-Chun Hung

IPC: H01L23/60 ,  H01L23/492 ,  H01L23/552

CPC classification number: H01L23/60 ,  H01L23/492 ,  H01L23/552

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a light-curing layer disposed on the substrate and surrounding the sensor chip, a light-permeable layer disposed on the light-curing layer, and a shielding layer that is ring-shaped and that is disposed on the light-permeable layer. And inner surface of the light-permeable layer, the light-curing layer, and the substrate jointly define an enclosed space that accommodates the sensor chip. A first projection area defined by orthogonally projecting the shielding layer onto the inner surface does not overlap the assembling region. A second projection area defined by orthogonally projecting the sensing region onto the inner surface along the predetermined direction does not overlap the first projection area and is located inside of the first projection area.

公开(公告)号：US12027545B2

公开(公告)日：2024-07-02

申请号：US17560176

申请日：2021-12-22

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Jui-Hung Hsu ,  Chien-Chen Lee

IPC: H01L27/146 ,  H01L23/00 ,  H01L23/29 ,  H01L23/31

CPC classification number: H01L27/14618 ,  H01L23/29 ,  H01L23/3128 ,  H01L23/315 ,  H01L23/3157 ,  H01L23/3171 ,  H01L24/48 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48101 ,  H01L2224/48105 ,  H01L2224/48158 ,  H01L2224/48228 ,  H01L2924/18165

Abstract: A sensor package structure is provided. The sensor package structure includes a substrate, a sensor chip disposed on the substrate, a plurality of wires electrically coupling the sensor chip to the substrate, a supporting colloid layer disposed on the substrate, and a light-permeable sheet that is disposed on the supporting colloid layer. The substrate has a first board surface and a second board surface that is opposite to the first board surface. The substrate has a chip-accommodating slot recessed in the first board surface. The sensor chip is disposed in the chip-accommodating slot, and a gap distance between a top surface of the sensor chip and the first board surface is less than or equal to 10 μm. The supporting colloid layer is ring-shaped and is disposed on the first board surface, and each of the wires is at least partially embedded in the supporting colloid layer.

公开(公告)号：US11227885B2

公开(公告)日：2022-01-18

申请号：US16571764

申请日：2019-09-16

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Li-Chun Hung ,  Chien-Chen Lee

IPC: H01L27/146

Abstract: An image sensor package includes a substrate, a sensor chip, a light-permeable cover, and a particle blocking dam. The substrate has a chip accommodating space, and the sensor chip is disposed in the chip accommodating space and electrically connected to the substrate. The light-permeable cover is disposed on the substrate and disposed above the sensor chip. The particle blocking dam is disposed above the sensor chip and extends from the light-permeable cover toward the sensor chip so as to be in contact with or close to the sensor chip.

公开(公告)号：US10964615B2

公开(公告)日：2021-03-30

申请号：US16454143

申请日：2019-06-27

Applicant: KINGPAK TECHNOLOGY INC.

Inventor： Li-Chun Hung ,  Chien-Chen Lee ,  Hsiu-Wen Tu

IPC: H01L23/31 ,  H01L31/02 ,  H01L31/0203

Abstract: A chip-scale sensor package structure includes a sensor chip, a ring-shaped support disposed on a top surface of the sensor chip, a light permeable member disposed on the ring-shaped support, a package body, and a redistribution layer (RDL). The package body surrounds outer lateral sides of the sensor chip, the ring-shaped support and the light permeable member. A bottom surface of the sensor chip and a surface of the light permeable member are exposed from the package body. The RDL is directly formed on the bottom surface of the sensor chip and a bottom side of the package body. The RDL includes a plurality of external contacts arranged on a bottom surface thereof and electrically coupled to the sensor chip. A portion of the external contacts are arranged outside of a projection region defined by orthogonally projecting the sensor chip onto the bottom surface of the RDL.