Electrical Assembly Structure and Motors with Electrical Assembly Structure

    公开(公告)号:US20240364170A1

    公开(公告)日:2024-10-31

    申请号:US18522785

    申请日:2023-11-29

    发明人: En-Cheng Chang

    摘要: An electrical assembly structure includes electric circuitry, a first waterproof layer, and a second waterproof layer. The electric circuitry includes an electric unit and a lead wire electrically connected to the electric unit. The lead wire includes an inner section, an outer section, and an intermediate section between the inner section and the outer section. The inner section is connected to the electric unit. The first waterproof layer covers the electric unit and the inner section. The second waterproof layer covers the intermediate section and is connected to the first waterproof layer. The second waterproof layer is located between the outer section and the first waterproof layer. The outer section is exposed outside the second waterproof layer. A material of the second waterproof layer is softer than a material of the first waterproof layer. Motors including the electrical assembly structure are also disclosed.

    Liquid cooling module and electronic device including the same

    公开(公告)号:US12048116B2

    公开(公告)日:2024-07-23

    申请号:US17510456

    申请日:2021-10-26

    IPC分类号: H05K7/20 F04D13/06 G06F1/20

    摘要: A liquid cooling module includes a housing having first and second chambers filled with a working fluid and intercommunicating with each other via an intercommunicating port and a backflow port. A pump is received in the housing and is aligned with the intercommunicating port. The pump includes a stator driving an impeller to rotate, driving the working fluid to flow from the first chamber through the intercommunicating port, the stator, and the impeller. The working fluid flows through the second chamber back into the first chamber via the backflow port. An electronic device includes a casing, an electric module received in the casing and including a heat generating area, and the liquid cooling module. The liquid cooling module is disposed in the casing and is in thermal connection with the heat generating area via a heat absorbing zone of the housing aligned with the first chamber or the second chamber.

    Immersion cooling system
    3.
    发明授权

    公开(公告)号:US11800683B2

    公开(公告)日:2023-10-24

    申请号:US17536267

    申请日:2021-11-29

    IPC分类号: H05K7/20

    摘要: An immersion cooling system includes a sealed tank having a chamber. A circulating layer and a working layer are respectively formed by first and second working liquids filled in the chamber and are contiguous to each other. The boiling point of the second working liquid is higher than that of the first working liquid. The density of the second working liquid is lower than that of the first working liquid. The first and second working liquids do not dissolve in each other. A circulating cooling module includes a circulating pipeline having first and second ports located in the chamber. The circulating pipeline also has a heat absorbing section and a condensation section located between the first and second ports. The heat absorbing section is located in the working layer. The first working liquid flows into the circulating pipeline from the first port and circulates in the circulating pipeline.

    Cooling fan
    4.
    发明授权

    公开(公告)号:US11767857B2

    公开(公告)日:2023-09-26

    申请号:US17839801

    申请日:2022-06-14

    IPC分类号: F04D29/42 F04D17/16

    CPC分类号: F04D29/4226 F04D17/16

    摘要: A cooling fan includes a fan frame and an impeller. The fan frame includes a substrate, a sidewall connected to the substrate, and a lid connected to the sidewall and opposite to the substrate. An air inlet is formed in the lid. The substrate, the sidewall, and the lid together define at least one air outlet. The impeller is rotatably mounted in the fan frame. A plurality of bulges protrudes from an inner face of the sidewall and/or an inner face of the lid.

    CHIP DEVICE
    5.
    发明公开
    CHIP DEVICE 审中-公开

    公开(公告)号:US20230197562A1

    公开(公告)日:2023-06-22

    申请号:US18068003

    申请日:2022-12-19

    摘要: A chip device is provided. The chip device includes a substrate, at least one chip, a sealing component, a heat-conducting medium, a barrier, and a heat dissipation device. The at least one chip is disposed over a first surface of the substrate and has a heat transfer surface. The sealing component covers the at least one chip and has a heat transfer area thermal contacting the heat transfer surface of the at least one chip. The heat-conducting medium is disposed over the heat transfer area of the sealing component. The barrier is disposed around and blocks the heat-conducting medium. The heat dissipation device is disposed over the heat transfer area of the sealing component and on the heat-conducting medium. The chip device can block the heat-conducting medium through the barrier to prevent the heat-conducting medium from overflowing or losing between the sealing component and the heat dissipation device.

    IMMERSION COOLING SYSTEM
    6.
    发明申请

    公开(公告)号:US20220264768A1

    公开(公告)日:2022-08-18

    申请号:US17536267

    申请日:2021-11-29

    IPC分类号: H05K7/20

    摘要: An immersion cooling system includes a sealed tank having a chamber. A circulating layer and a working layer are respectively formed by first and second working liquids filled in the chamber and are contiguous to each other. The boiling point of the second working liquid is higher than that of the first working liquid. The density of the second working liquid is lower than that of the first working liquid. The first and second working liquids do not dissolve in each other. A circulating cooling module includes a circulating pipeline having first and second ports located in the chamber. The circulating pipeline also has a heat absorbing section and a condensation section located between the first and second ports. The heat absorbing section is located in the working layer. The first working liquid flows into the circulating pipeline from the first port and circulates in the circulating pipeline.

    Slim Pump
    7.
    发明申请

    公开(公告)号:US20210301826A1

    公开(公告)日:2021-09-30

    申请号:US17071158

    申请日:2020-10-15

    IPC分类号: F04D13/06 F04D29/42

    摘要: A slim pump according to the present invention includes a frame, a shaft-coupling portion, a stator, and an impeller. The frame includes an interior separated by a partitioning board into a first chamber and a second chamber. A flow inlet intercommunicates with the first chamber and a flow outlet intercommunicates with the second chamber. The first chamber is intercommunicated with the second chamber via a communication hole of the partitioning board. The shaft-coupling portion is located in the frame. The stator is disposed around the shaft-coupling portion and is located within an axial extent of the first chamber. The stator is axially aligned with the communication hole. The impeller includes a plurality of blades and an inlet opening located in the second chamber. The inlet opening faces and axially aligns with the communication hole.

    Inner-rotor motor and stator thereof

    公开(公告)号:US11081926B2

    公开(公告)日:2021-08-03

    申请号:US16712343

    申请日:2019-12-12

    摘要: An inner-rotor motor including a housing, a stator and a rotor avoids damage to the coil unit which often occurs during assembly of the conventional inner-rotor motor. The housing has an inner periphery provided with a plurality of protrusions. The iron core has an outer periphery provided with a plurality of notches. The insulating sleeve includes a plurality of positioning members. In radial directions perpendicular to the shaft, each of the plurality of notches is spaced from a center of a shaft at a minimal distance, and each of the plurality of positioning members is spaced from the center of the shaft at a maximal distance. The maximal distance is smaller than the minimal distance.

    BEARING SYSTEM
    9.
    发明申请

    公开(公告)号:US20210062865A1

    公开(公告)日:2021-03-04

    申请号:US16983723

    申请日:2020-08-03

    IPC分类号: F16C33/10 F16C17/02

    摘要: A bearing system includes a first bearing, a second bearing, and a rotating member. The first bearing is hollow and has a first inner face. The second bearing is located in the first bearing. The second bearing includes a second inner face axially aligned with the first inner face. A partitioning space is formed between the first inner face and the second inner face. The rotating member has a shaft and a protruding portion coupled to the shaft. The protruding portion is located in the partitioning space. A dynamic pressure gap is formed between the protruding portion and the first inner face during rotation. Another dynamic pressure gap is formed between the protruding portion and the second inner face during rotation.

    Handheld electronic device
    10.
    发明授权

    公开(公告)号:US10785890B2

    公开(公告)日:2020-09-22

    申请号:US16261818

    申请日:2019-01-30

    摘要: A handheld electronic device includes a case, an electronic unit and a cooling fan. The case includes at least one rib, an air inlet and a heat outlet. The at least one rib delimits a heat chamber. The air inlet and the heat outlet intercommunicate with an outside of the case. The electronic unit includes a heat source located in the heat chamber. The cooling fan is located in the heat chamber and includes an air entrance and an air exit. The air entrance intercommunicates with the air inlet of the case, and the air exit intercommunicates with the heat outlet of the case.