公开(公告)号：US12229941B2

公开(公告)日：2025-02-18

申请号：US17654533

申请日：2022-03-11

Applicant: AT&S (Chongqing) Company Limited

Inventor： Yong Wang ,  Xuebing Wan ,  Yanxu Chen ,  Yang Chen ,  Tao Lin

IPC: G06N20/00 ,  G01N21/95 ,  G01N35/00 ,  G06T7/00 ,  G06T11/00 ,  G06V10/764

Abstract: A method for manufacturing a component carrier. The method includes (a) supplying a semifinished or finished component carrier to an automatic or semi-automatic optical inspection device and (b) performing an automatic or semi-automatic optical inspection by capturing a first image with a first illumination; capturing a second image with a second illumination; comparing a data set indicative of the first image and/or the second image with a reference data set; and identifying potential defects; (c) performing a quality classification of the semifinished or finished component carrier by generating a virtual third image indicative of the component carrier under a virtual different third illumination having a third spectral composition different from both the first spectral composition and from the second spectral composition; processing the three images; classifying the potential defects in true defects and false defects; and (d) taking action based on the quality classification. Further described is a system architecture.

公开(公告)号：US12221025B2

公开(公告)日：2025-02-11

申请号：US18145298

申请日：2022-12-22

Applicant: Faurecia Autositze GmbH

Inventor： Jacek Lasak ,  Maciej Such ,  Michal Szott

IPC: B60N2/90

Abstract: A method for operating a motor vehicle seat system, having at least two first fluid-fillable bladders and at least one second fluid-fillable bladder connected via a supply line to a common line and to a pump via this line and are fillable with fluid via this line, each first bladder having its own discharge outlet, and the second bladder not having its own discharge outlet, and having a controller which controls the filling or emptying of the bladders, the controller being configured to empty the second bladder via a discharge outlet from one of the first bladders, the second bladder being evacuated by detecting which of the first bladders is empty or is currently not used, establishing a fluid connection between the second bladder to be evacuated and the empty first bladder, and opening the discharge outlet belonging to the empty first bladder.

公开(公告)号：US12192073B2

公开(公告)日：2025-01-07

申请号：US17746260

申请日：2022-05-17

Applicant: Movius Interactive Corporation

Inventor： Ananth Siva ,  Satish Medapati ,  Aravind Kumar Abbena ,  Saumya Tripathi ,  Naresh Vemula ,  Dipesh Gupta ,  Amit Modi

IPC: H04L41/50 ,  H04L41/16 ,  H04L41/5067

Abstract: Artificial intelligence is utilized in gathering, analyzing and processing of user feedback, specifically as pertaining to service quality in a telecommunications system. In response to collecting the feedback data, the system automatically generates reports and initiates remedial measures in response to such user feedback to enhance the performance of the service.

公开(公告)号：US12177386B2

公开(公告)日：2024-12-24

申请号：US17975549

申请日：2022-10-27

Applicant: Movius Interactive Corporation

Inventor： Philip Lowman ,  Michael Speanburg ,  George Backhaus ,  Amit Modi ,  Jon Plotky ,  Paul Rubenstein

IPC: H04M7/00 ,  G16Y10/75 ,  H04L65/1104 ,  H04L65/65 ,  H04L67/12 ,  H04M7/12

Abstract: Enablement of a voice channel being established between an IoT device and a controller through the use of a voice-line service system.

公开(公告)号：US12167543B2

公开(公告)日：2024-12-10

申请号：US17447518

申请日：2021-09-13

Applicant: AT&S (Chongqing) Company Limited

Inventor： Ismadi Bin Ismail ,  Fanyi Chiu

IPC: B32B27/02 ,  B23K1/00 ,  B23K3/08 ,  H05K1/02 ,  H05K3/34 ,  B23K101/42

Abstract: A component carrier system with a component carrier, a base solder mask layer formed on a surface of the component carrier, and a top solder mask layer formed on top of a predefined section of the base solder mask. The predefined section of the base solder mask covers a target section of the component carrier.

公开(公告)号：US12167529B2

公开(公告)日：2024-12-10

申请号：US17650405

申请日：2022-02-09

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Abderrazzaq Ifis

IPC: H05K1/02

Abstract: A component carrier including a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure. A component embedded in the stack, and a heat removal body configured for removing heat from the component is connected to the stack and preferably to the component. The heat removal body including a component-sided first heat removal structure thermally coupled with the component, and a second heat removal structure thermally coupled with the first heat removal structure and facing away from the component.

公开(公告)号：US12163203B2

公开(公告)日：2024-12-10

申请号：US17780620

申请日：2020-11-27

Applicant: BAOSHAN IRON & STEEL CO., LTD.

Inventor： Ning Tan ,  Junxiang Liu ,  Caigen Huang ,  Lei Jiang ,  Chao Wang

IPC: C21D9/52 ,  B21D22/02 ,  B32B15/01 ,  C21D6/00 ,  C21D8/02 ,  C22C21/02 ,  C22C38/00 ,  C22C38/02 ,  C22C38/06 ,  C22C38/24 ,  C22C38/26 ,  C22C38/28 ,  C22C38/32 ,  C22C38/38 ,  C23C2/12 ,  C23C2/26 ,  C23C2/28 ,  C23C2/40

Abstract: A high-performance thermoformed component provided with a coating, and a manufacturing method therefor. The thermoformed component comprises a substrate and a coating thereon. The substrate comprises the following ingredients in percentage by weight: 0.01-0.8% of C, 0.05-1.0% of Si, 0.1-5% of Mn, 0.001-0.3% of P, 0.001-0.1% of S, 0.001-0.3% of Al, 0.001-0.5% of Ti, 0.0005-0.1% of B, 0.001-0.5% of Nb, 0.001-0.5% of V, and the remainder being Fe and other unavoidable impurities. The appearance of the thermoformed component has no color difference and no mottling. The surface oxygen content of the thermoformed component is 0.1-20 wt. %, and the ratio of the standard deviation to the average value of the surface oxygen content satisfies: 0

公开(公告)号：US12136580B2

公开(公告)日：2024-11-05

申请号：US17657541

申请日：2022-03-31

Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Jeesoo Mok ,  Artan Baftiri

IPC: H01L23/31 ,  H01L21/48 ,  H01L23/00 ,  H01L23/538 ,  H05K1/18 ,  H05K3/34

Abstract: A method of manufacturing a component carrier includes: (i) embedding a poorly adhesive structure in a stack, wherein the stack comprises at least one electrically conductive layer structure and/or at least one electrically insulating layer structure; (ii) forming a cavity in the stack by removing a stack piece, wherein the stack piece is in part delimited by the poorly adhesive structure; and (iii) selectively exposing a bottom of the cavity by partially removing the poorly adhesive structure. A corresponding component carrier includes analogous features.

公开(公告)号：US12124700B2

公开(公告)日：2024-10-22

申请号：US17952029

申请日：2022-09-23

Applicant: QUALCOMM INCORPORATED

Inventor： Anushka Mihir Nabar ,  Arun Gothekar ,  Kishore Batta ,  Romil Jain

IPC: G06F12/00 ,  G06F3/06 ,  G06F13/00

CPC classification number: G06F3/061 ,  G06F3/0659 ,  G06F3/0679

Abstract: Data may be loaded in a computing device from a non-volatile storage medium using files having a nested structure. An outer file metadata portion may be read from an outer file on the storage medium into RAM. The outer file may include the outer file metadata portion and an outer file data portion. The outer file data portion may then be read from the outer file on the storage medium into the RAM based on the outer file metadata portion. The outer file data portion may be an inner file. The inner file may include an inner file metadata portion and an inner file data portion. Then, the inner file metadata portion may be read from the inner file in the RAM. The inner file data portion may be read from the inner file in the RAM based on the inner file metadata portion.

公开(公告)号：US12116647B2

公开(公告)日：2024-10-15

申请号：US16621495

申请日：2018-06-26

Applicant: BAOSHAN IRON & STEEL CO., LTD.

Inventor： Wei Li ,  Xiaodong Zhu ,  Peng Xue

IPC: C21D8/02 ,  C21D6/00 ,  C22C38/00 ,  C22C38/02 ,  C22C38/06 ,  C22C38/22 ,  C22C38/26 ,  C22C38/28 ,  C22C38/38

CPC classification number: C21D8/0263 ,  C21D6/002 ,  C21D6/005 ,  C21D6/008 ,  C21D8/0205 ,  C21D8/0226 ,  C21D8/0236 ,  C22C38/001 ,  C22C38/002 ,  C22C38/02 ,  C22C38/06 ,  C22C38/22 ,  C22C38/26 ,  C22C38/28 ,  C22C38/38 ,  C21D2211/005 ,  C21D2211/008

Abstract: A cold-rolled annealed dual-phase steel is provided, having a microstructure of ferrite and martensite, and comprising the following chemical elements in mass percentage: 0.08% to 0.1% of C, 1.95% to 2.2% of Mn, 0.1% to 0.6% of Si, 0.020% to 0.050% of Nb, 0.020% to 0.050% of Ti, 0.015% to 0.045% of Als, 0.40% to 0.60% of Cr, 0.2% to 0.4% of Mo, 0.001% to 0.005% of Ca, and the balance being Fe and other inevitable impurities. A method for manufacturing the cold-rolled annealed dual-phase steel is also provided, comprising the steps of: (1) smelting and casting; (2) hot rolling; (3) cold rolling; (4) annealing; and (5) temper rolling.