Abstract:
There is disclosed a microwave absorbing structure which comprises a non-conductive matrix within which are embedded a plurality of spatially-separated ferro- or ferri-magnetic particles, each of which particles has a largest dimension no greater than 100 nm, said particles having been prepared by a process which includes a step in which the particles are formed within an organic macromolecular shell.
Abstract:
A magnetically influenced current or voltage regulator includes a body of an anisotropic magnetisable material that provides a closed magnetic circuit. A first electrical conductor is wound around the body along at least a part of the close circuit for at least one turn which forms a first main winding. At least one second electrical conductor is wound around the body along at least a part of the closed circuit for at least one turn which forms a control winding. The winding axis for the main winding is at right angles to the winding axis for the control winding. Orthogonal magnetic fields are generated in the body when the first main winding and the control winding are excited. A characteristic of the anisotropic magnetisable material relative to a field in the main winding is controlled by means of a field in the control winding.
Abstract:
DRAM trench capacitors formed by, inter alia, deposition of conductive material into a trench or doping the semiconductor region in which the trench is defined.
Abstract:
Printing plates are mounted onto a cylinder by first establishing a temperature difference between the plate and the cylinder; in particular, the temperature of the plate exceeds the temperature of the cylinder. The plate is then wrapped around the plate cylinder, and the temperature difference causes the plate to shrink against the cylinder.
Abstract:
Systems and methods for calculating a modification of a geometrical shape by applying an inverse modification function to an array representing the shape. An array representing the geometrical shape is defined on a multi-dimensional space. A modification function is used to modify the geometrical shape. A user or a programmed computer can select the modification function. The computer applies an inverse of the modification function to the array. The computer deduces a change in the geometrical shape from the modified array. An advantage of the system and method is the ability to compute shape changes in certain situations where a direct computation is cumbersome or otherwise inconvenient.
Abstract:
The invention features a reflective display device and a method of making a reflective display device that has reduced light loss and/or pixel cross talk due to internal reflection. The device includes a window layer, a plurality of reflective particles, a material portion disposed between the window layer and the plurality of reflective particles, and a refractive layer disposed between the window and the material portion. The plurality of reflective particles scatters light received from the ambient environment. The window layer has an index of refraction that is greater than an index of refraction of the ambient environment. The refractive layer has an index of refraction that is less than the index of refraction of the window layer and less than an index of refraction of the material portion.
Abstract:
The present invention provides a method and apparatus for compensating for polarization mode dispersion in an optical transmission system without perturbing the laser source. The present invention compensates for PMD by transferring a sufficient fraction of the light signal in an optical transmission system substantially into a single PSP of the system. As a result, each light pulse in a data stream is not substantially mixed with temporally adjacent light pulses or bit periods.
Abstract:
A ureteral stent for assisting movement of urine along a patient's ureter and into the patient's bladder. The stent includes an elongated tubular segment extending toward the bladder from a kidney end region for placement in the renal cavity to a bladder end region. A central lumen connects at least one opening at the first end region to at least one opening in the bladder end region. Thin flexible tail(s) are attached to the bladder end region of the tubular segment at a point outside the bladder so as to receive urine from the opening in the bladder end region of the tubular segment and to transport urine from there across the ureter/bladder junction and into the bladder. The tails include an elongated external urine-transport surface sized and configured to transport urine along the ureter. The urine transporting surface(s) are sized and configured to extend along at least part of the ureter, across the ureter/bladder junction, and from there into the bladder.
Abstract:
Antibiotics RK-1061s having a novel chemical structure and a method of production thereof.They have a structural formula represented by general formula(I) wherein A represents R1 or R1CH(OR2)CH2. R2 represents 3-methylglutaric acid residue and R3 represents a sulfate group or a hydrogen atom. The process comprises culturing a ray fungus belonging to the genus Streptomyces and isolating RK-1061s from the culture. Streptomyces sp. SN-1061Ms (FERM BP-5800) is capable of stably producing RK-1061 at a high productivity.
Abstract:
Semiconductor-based devices, and methods for making the devices, involve a first device that includes a buried channel layer, a dielectric layer, and a compositionally graded spacer layer. The spacer layer includes a first material and a second material, and is located between the buried channel layer and the dielectric layer. A second device includes a buried channel layer, a relaxed surface layer, and a spacer layer located between the buried channel layer and the relaxed surface layer. The spacer layer has a composition that is different from a composition of the relaxed layer. The spacer layer and the relaxed surface layer each have bandgap offsets relative to the buried channel layer to reduce a parasitic channel conduction. A substrate for fabrication of devices, and methods for making the substrate, involves a substrate that includes a first layer, such as a silicon wafer, a substantially uniform second layer, and a graded-composition third layer.