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公开(公告)号：US09200968B2
公开(公告)日：2015-12-01
申请号：US13561711
申请日：2012-07-30
Applicant: Michael Coln , Alain Valentin Guery , Lejun Hu
Inventor： Michael Coln , Alain Valentin Guery , Lejun Hu
CPC classification number: G01K7/186 , G01K15/005 , G01K2217/00 , G01K2219/00
Abstract: An accurate, cost-efficient temperature sensor may be integrated into an integrated circuit (IC) using common materials as the IC's interconnect metallization. The temperature sensor may include an impedance element having a length of metal made of the interconnect metal, a current source connected between a first set of contacts at opposite ends of the impedance element, and an analog-to-digital converter connected between a second set of contacts at opposite ends of the impedance element. The temperature sensor may exploits the proportional relationship between the metal's resistance and temperature to measure ambient temperature. Alternatively, such a temperature sensor may be used on disposable chemical sensors where the impedance element is made of a common metal as conductors that connect a sensor reactant to sensor contacts. In either case, because the impedance element is formed of a common metal as other interconnect, it is expected to incur low manufacturing costs.
Abstract translation: 使用普通材料作为IC的互连金属化，可将精确的，具有成本效益的温度传感器集成到集成电路（IC）中。 温度传感器可以包括具有由互连金属制成的金属长度的阻抗元件，连接在阻抗元件的相对端处的第一组触点之间的电流源和连接在第二组之间的模数转换器 的阻抗元件的相对端处的触点。 温度传感器可以利用金属电阻和温度之间的比例关系来测量环境温度。 或者，这种温度传感器可以用在一次性化学传感器上，其中阻抗元件由公共金属制成，作为将传感器反应物连接到传感器触点的导体。 在任一种情况下，由于阻抗元件由作为其他互连的公共金属形成，所以预期会导致低的制造成本。
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公开(公告)号：US20120200350A1
公开(公告)日：2012-08-09
申请号：US13023751
申请日：2011-02-09
Applicant: Cathal MURPHY , Michael COLN , Gary CARREAU , Alain Valentin GUERY , Bruce AMAZEEN
Inventor： Cathal MURPHY , Michael COLN , Gary CARREAU , Alain Valentin GUERY , Bruce AMAZEEN
CPC classification number: H03F1/34 , H03F3/45475 , H03F3/68 , H03F2203/45514
Abstract: An amplifier system can include a feedback amplifier circuit having an amplifier, a feedback capacitor connected between an input terminal and an output terminal of the amplifier by at least one first switch, and a reset capacitor connected across the feedback capacitor by at least one second switch and between a pair of reference voltages by at least one third switch. During an input-signal processing phase of operation, a control circuit may close the at least one first switch and open the at least one second switch to electrically connect the feedback capacitor between the input and output terminals to engage feedback processing by the feedback amplifier circuit, and close the third switch to electrically connect the reset capacitor between the first and second voltages to charge the reset capacitor to a selectable voltage difference. During a reset phase of operation, the control circuit may open the at least one third switch, close the at least one second switch and open the at least one first switch to electrically connect the reset capacitor across the feedback capacitor to reset the feedback capacitor using the reset capacitor. The amplifier system can optionally include a plurality of the feedback amplifier circuits.
Abstract translation: 放大器系统可以包括具有放大器的反馈放大器电路，通过至少一个第一开关连接在放大器的输入端子和输出端子之间的反馈电容器以及通过至少一个第二开关连接在反馈电容器上的复位电容器 以及通过至少一个第三开关在一对参考电压之间。 在操作的输入信号处理阶段期间，控制电路可以关闭所述至少一个第一开关并且打开所述至少一个第二开关以将所述反馈电容器电连接在所述输入和输出端子之间，以接收所述反馈放大器电路的反馈处理 并且关闭第三开关以在第一和第二电压之间电连接复位电容器，以将复位电容器充电至可选择的电压差。 在操作的复位阶段期间，控制电路可以打开至少一个第三开关，闭合至少一个第二开关并且打开至少一个第一开关，以使反馈电容器上的复位电容器电连接以使反馈电容器复位以使用 复位电容。 放大器系统可以可选地包括多个反馈放大器电路。
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公开(公告)号：US20120069956A1
公开(公告)日：2012-03-22
申请号：US12885192
申请日：2010-09-17
Applicant: Alain Valentin GUERY , Camille HUIN , Dipak SENGUPTA
Inventor： Alain Valentin GUERY , Camille HUIN , Dipak SENGUPTA
IPC: A61B6/03
CPC classification number: G01N23/046 , A61B6/032 , A61B6/107 , A61B6/42
Abstract: A computed tomography detector module can include a detector element, a frame, and a converter element. The detector element can be configured to detect electromagnetic radiation at a detection plane and output one or more analog detection signals. The frame can connect to the detector element and include a shield portion, parallel to the detection plane, configured to at least partially block X-rays. The converter element can include a substrate having connector and component substrate portions, the connector substrate portion thicker in a direction perpendicular to the detection plane than the component substrate portion and configured to extend through an aperture of the frame, the component substrate portion having at least one substrate surface parallel to the detection plane with one or more electrical components attached thereto. The detector module can optionally include a heat sink, which can have a top surface separated from the component substrate portion and components attached thereto by a separation gap. A computed tomography scanner can include the detector module.
Abstract translation: 计算机断层摄影检测器模块可以包括检测器元件，框架和转换器元件。 检测器元件可被配置为检测检测平面处的电磁辐射并输出一个或多个模拟检测信号。 框架可以连接到检测器元件并且包括平行于检测平面的屏蔽部分，被配置为至少部分地阻挡X射线。 转换器元件可以包括具有连接器和部件基板部分的基板，连接器基板部分在垂直于检测平面的方向上比部件基板部分更厚，并且被配置为延伸穿过框架的孔，该部件基板部分至少具有 平行于检测平面的一个基板表面，其中附接有一个或多个电气部件。 检测器模块可以可选地包括散热器，其可以具有通过分隔间隙与顶部表面与部件基板部分分离的部件和与其连接的部件。 计算机断层扫描仪可以包括检测器模块。
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公开(公告)号：US07737409B2
公开(公告)日：2010-06-15
申请号：US12138078
申请日：2008-06-12
Applicant: Shrenik A. Deliwala , Michael C Coln , Alain Valentin Guery
Inventor： Shrenik A. Deliwala , Michael C Coln , Alain Valentin Guery
IPC: G01T1/24
CPC classification number: H01L27/1446
Abstract: Described is a die having photodetectors provided on a first surface thereof. The die includes an insulative shell member, a conductive shell member and a photodetector conductor. The insulative shell member extends around a periphery of the photodetector receptors and extending through a depth of the semiconductor die. The conductive shell member bridges the insulative shell member and extends through the depth of the semiconductor die. The photodetector conductors are provided on the first surface of the semiconductor die and electrically couple respective photodetectors with a corresponding conductive shell member. Also described is a process for making a semiconductor die and an integrated circuit structure.
Abstract translation: 描述了在其第一表面上设置有光电检测器的管芯。 模具包括绝缘外壳构件，导电壳构件和光电检测器导体。 绝缘壳构件围绕光电检测器接收器的周边延伸并延伸穿过半导体管芯的深度。 导电外壳构件将绝缘壳构件桥接并延伸穿过半导体管芯的深度。 光电检测器导体设置在半导体管芯的第一表面上，并将相应的光电检测器与相应的导电外壳构件电耦合。 还描述了制造半导体管芯和集成电路结构的工艺。
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公开(公告)号：US20140056452A1
公开(公告)日：2014-02-27
申请号：US13590448
申请日：2012-08-21
Applicant: Brian Moss , Howard R. Samuels , Joseph Wayne Palmer , Alain Valentin Guery , James M. Lee
Inventor： Brian Moss , Howard R. Samuels , Joseph Wayne Palmer , Alain Valentin Guery , James M. Lee
IPC: H04R25/00
CPC classification number: H04R25/30 , H04R2225/021 , H04R2225/023 , H04R2225/025 , H04R2225/61 , H04R2460/03
Abstract: A wearable device has a motion detector configured to detect motion of the device and produce a motion signal relating to motion of the device, a contact sensor configured to detect if the device is in contact with an object and produce a contact signal relating to whether the device is in contact with an object, and a controller operatively coupled with the motion detector and the contact sensor. The controller is configured to switch between on and off-states as a function of at least one of the motion signal and contact signal. The device also has a sound transducer or other transducer operatively coupled with the controller. The controller is configured to change the state of the sound transducer between on and off-states in response to receipt of the motion signal, and the contact signal.
Abstract translation: 可佩戴装置具有运动检测器，其被配置为检测装置的运动并产生与装置的运动有关的运动信号，接触传感器被配置为检测装置是否与物体接触并产生与是否 设备与物体接触，以及与运动检测器和接触传感器可操作地耦合的控制器。 控制器被配置为作为运动信号和接触信号中的至少一个的功能，在接通和断开状态之间切换。 该装置还具有与控制器可操作地耦合的声换能器或其它换能器。 控制器被配置为响应于接收到运动信号和接触信号而改变声换能器在接通和断开状态之间的状态。
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Patent Agency Ranking
公开(公告)号：US08553834B2
公开(公告)日：2013-10-08
申请号：US12885192
申请日：2010-09-17
Applicant: Alain Valentin Guery , Camille Huin , Dipak Sengupta
Inventor： Alain Valentin Guery , Camille Huin , Dipak Sengupta
IPC: A61B6/03
CPC classification number: G01N23/046 , A61B6/032 , A61B6/107 , A61B6/42
Abstract: A computed tomography detector module can include a detector element, a frame, and a converter element. The detector element can be configured to detect electromagnetic radiation at a detection plane and output one or more analog detection signals. The frame can connect to the detector element and include a shield portion, parallel to the detection plane, configured to at least partially block X-rays. The converter element can include a substrate having connector and component substrate portions, the connector substrate portion thicker in a direction perpendicular to the detection plane than the component substrate portion and configured to extend through an aperture of the frame, the component substrate portion having at least one substrate surface parallel to the detection plane with one or more electrical components attached thereto. The detector module can optionally include a heat sink, which can have a top surface separated from the component substrate portion and components attached thereto by a separation gap. A computed tomography scanner can include the detector module.
Abstract translation: 计算机断层摄影检测器模块可以包括检测器元件，框架和转换器元件。 检测器元件可被配置为检测检测平面处的电磁辐射并输出一个或多个模拟检测信号。 框架可以连接到检测器元件并且包括平行于检测平面的屏蔽部分，被配置为至少部分地阻挡X射线。 转换器元件可以包括具有连接器和部件基板部分的基板，连接器基板部分在垂直于检测平面的方向上比部件基板部分更厚，并且被配置为延伸穿过框架的孔，该部件基板部分至少具有 平行于检测平面的一个基板表面，其中附接有一个或多个电气部件。 检测器模块可以可选地包括散热器，其可以具有通过分隔间隙与顶部表面与部件基板部分分离的部件和与其连接的部件。 计算机断层扫描仪可以包括检测器模块。
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公开(公告)号：US08514014B2
公开(公告)日：2013-08-20
申请号：US13023751
申请日：2011-02-09
Applicant: Cathal Murphy , Michael Coln , Gary Carreau , Alain Valentin Guery , Bruce Amazeen
Inventor： Cathal Murphy , Michael Coln , Gary Carreau , Alain Valentin Guery , Bruce Amazeen
IPC: H03F1/02
CPC classification number: H03F1/34 , H03F3/45475 , H03F3/68 , H03F2203/45514
Abstract: An amplifier system can include a feedback amplifier circuit having an amplifier, a feedback capacitor connected between an input terminal and an output terminal of the amplifier by at least one first switch, and a reset capacitor connected across the feedback capacitor by at least one second switch and between a pair of reference voltages by at least one third switch. During an input-signal processing phase of operation, a control circuit may close the at least one first switch and open the at least one second switch to electrically connect the feedback capacitor between the input and output terminals to engage feedback processing by the feedback amplifier circuit, and close the third switch to electrically connect the reset capacitor between the first and second voltages to charge the reset capacitor to a selectable voltage difference. During a reset phase of operation, the control circuit may open the at least one third switch, close the at least one second switch and open the at least one first switch to electrically connect the reset capacitor across the feedback capacitor to reset the feedback capacitor using the reset capacitor. The amplifier system can optionally include a plurality of the feedback amplifier circuits.
Abstract translation: 放大器系统可以包括具有放大器的反馈放大器电路，通过至少一个第一开关连接在放大器的输入端子和输出端子之间的反馈电容器以及通过至少一个第二开关连接在反馈电容器上的复位电容器 以及通过至少一个第三开关在一对参考电压之间。 在操作的输入信号处理阶段期间，控制电路可以关闭所述至少一个第一开关并且打开所述至少一个第二开关以将所述反馈电容器电连接在所述输入和输出端子之间，以接收所述反馈放大器电路的反馈处理 并且关闭第三开关以在第一和第二电压之间电连接复位电容器，以将复位电容器充电至可选择的电压差。 在复位操作阶段期间，控制电路可以打开至少一个第三开关，闭合至少一个第二开关并且打开至少一个第一开关，以使反复电容器上的复位电容器电连接以使反馈电容器复位，以使用 复位电容。 放大器系统可以可选地包括多个反馈放大器电路。
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公开(公告)号：US20130070805A1
公开(公告)日：2013-03-21
申请号：US13561711
申请日：2012-07-30
Applicant: Michael COLN , Alain Valentin GUERY , Lejun HU
Inventor： Michael COLN , Alain Valentin GUERY , Lejun HU
CPC classification number: G01K7/186 , G01K15/005 , G01K2217/00 , G01K2219/00
Abstract: An accurate, cost-efficient temperature sensor may be integrated into an integrated circuit (IC) using common materials as the IC's interconnect metallization. The temperature sensor may include an impedance element having a length of metal made of the interconnect metal, a current source connected between a first set of contacts at opposite ends of the impedance element, and an analog-to-digital converter connected between a second set of contacts at opposite ends of the impedance element. The temperature sensor may exploits the proportional relationship between the metal's resistance and temperature to measure ambient temperature. Alternatively, such a temperature sensor may be used on disposable chemical sensors where the impedance element is made of a common metal as conductors that connect a sensor reactant to sensor contacts. In either case, because the impedance element is formed of a common metal as other interconnect, it is expected to incur low manufacturing costs.
Abstract translation: 使用普通材料作为IC的互连金属化，可将精确的，具有成本效益的温度传感器集成到集成电路（IC）中。 温度传感器可以包括具有由互连金属制成的金属长度的阻抗元件，连接在阻抗元件的相对端处的第一组触点之间的电流源和连接在第二组之间的模数转换器 的阻抗元件的相对端处的触点。 温度传感器可以利用金属电阻和温度之间的比例关系来测量环境温度。 或者，这种温度传感器可以用在一次性化学传感器上，其中阻抗元件由公共金属制成，作为将传感器反应物连接到传感器触点的导体。 在任一种情况下，由于阻抗元件由作为其他互连的公共金属形成，所以预期会导致低的制造成本。
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公开(公告)号：US20140016739A1
公开(公告)日：2014-01-16
申请号：US14028177
申请日：2013-09-16
Applicant: Alain Valentin GUERY , Camille HUIN , Dipak SENGUPTA
Inventor： Alain Valentin GUERY , Camille HUIN , Dipak SENGUPTA
IPC: G01N23/04
CPC classification number: G01N23/046 , A61B6/032 , A61B6/107 , A61B6/42
Abstract: A computed tomography detector module can include a detector element, a frame, and a converter element. The detector element can be configured to detect electromagnetic radiation at a detection plane and output one or more analog detection signals. The frame can connect to the detector element and include a shield portion, parallel to the detection plane, configured to at least partially block X-rays. The converter element can include a substrate having connector and component substrate portions, the connector substrate portion thicker in a direction perpendicular to the detection plane than the component substrate portion and configured to extend through an aperture of the frame, the component substrate portion having at least one substrate surface parallel to the detection plane with one or more electrical components attached thereto. The detector module can optionally include a heat sink, which can have a top surface separated from the component substrate portion and components attached thereto by a separation gap. A computed tomography scanner can include the detector module.
Abstract translation: 计算机断层摄影检测器模块可以包括检测器元件，框架和转换器元件。 检测器元件可被配置为检测检测平面处的电磁辐射并输出一个或多个模拟检测信号。 框架可以连接到检测器元件并且包括平行于检测平面的屏蔽部分，被配置为至少部分地阻挡X射线。 转换器元件可以包括具有连接器和部件基板部分的基板，连接器基板部分在垂直于检测平面的方向上比部件基板部分更厚，并且被配置为延伸穿过框架的孔，该部件基板部分至少具有 平行于检测平面的一个基板表面，其中附接有一个或多个电气部件。 检测器模块可以可选地包括散热器，其可以具有通过分隔间隙与顶部表面与部件基板部分分离的部件和与其连接的部件。 计算机断层扫描仪可以包括检测器模块。
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公开(公告)号：US20090309036A1
公开(公告)日：2009-12-17
申请号：US12138078
申请日：2008-06-12
Applicant: Shrenik DELIWALA , Michael C. COLN , Alain Valentin GUERY
Inventor： Shrenik DELIWALA , Michael C. COLN , Alain Valentin GUERY
IPC: G01T1/24 , H01L31/18 , H01L31/103
CPC classification number: H01L27/1446
Abstract: Disclosed is a die having photodetectors provided on a first surface thereof. The die includes an insulative shell member, a conductive shell member and a photodetector conductor. The insulative shell member extends around a periphery of the photodetector receptors and extending through a depth of the semiconductor die. The conductive shell member bridges the insulative shell member and extends through the depth of the semiconductor die. The photodetector conductors are provided on the first surface of the semiconductor die and electrically couple respective photodetectors with a corresponding conductive shell member. Also disclosed is a process for making a semiconductor die and an integrated circuit structure.
Abstract translation: 公开了一种具有设置在其第一表面上的光电检测器的管芯。 模具包括绝缘外壳构件，导电壳构件和光电检测器导体。 绝缘壳构件围绕光电检测器接收器的周边延伸并延伸穿过半导体管芯的深度。 导电外壳构件将绝缘壳构件桥接并延伸穿过半导体管芯的深度。 光电检测器导体设置在半导体管芯的第一表面上，并将相应的光电检测器与相应的导电外壳构件电耦合。 还公开了制造半导体管芯和集成电路结构的工艺。
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