摘要:
Embodiments relate to a nonvolatile memory (“NVM”) bitcell with a replacement metal control gate and an additional floating gate. The bitcell may be created using a standard complementary metal-oxide-semiconductor manufacturing processes (“CMOS processes”) without any additional process steps, thereby reducing the cost and time associated with fabricating a semiconductor device incorporating the NVM bitcell.
摘要:
A Non-Volatile Memory (NVM) cell and programming method in which the cell can denote at least two logic levels (e.g., 0 and 1) and includes a read-transistor with a floating gate and a Band-To-Band-Tunneling device (BTBT device) sharing the floating gate with the read transistor.The BTBT device is configured as an injection device for injecting a first charge onto the floating gate when the BTBT device is biased so that it is in accumulation, to set at least one of the logic levels.
摘要:
Electronic circuitry is described having a first transistor having a first gate dielectric located between an electrically floating gate and a semiconductor substrate. The first injection current flows through the first gate dielectric to establish a first amount of electrical charge on the gate electrode. The electronic circuitry also includes a second transistor having a second gate dielectric located between the gate electrode and the semiconductor substrate. A band-to-band tunneling current flows between valence and conduction bands of the second transistor to create a second injection current that flows through the second gate dielectric to establish the first amount of electrical charge on the gate electrode. Non-volatile memory cell circuits having the above described circuitry are also described.
摘要:
A semiconductor device may comprise a plurality of memory cells. A memory cell may comprise a thyristor, at least a portion of which is formed in a pillar of semiconductor material. The pillar may comprise sidewalls defining a cylindrical circumference of a first diameter. In a particular embodiment, the pillars associated with the plurality of memory cells may define rows and columns of an array. In a further embodiment, a pillar may be spaced by a first distance of magnitude up to the first diameter relative to a neighboring pillar within its row. In an additional further embodiment, the pillar may be spaced by a second distance of a magnitude up to twice the first diameter, relative to a neighboring pillar within its column.
摘要:
Wirelessly testing an RFID tag before it is packaged or otherwise entered into a process reserved for “working” RFID tags is described. Various processes that employ such wireless testing as well as various “on-die” RFID tag antenna designs for facilitating the wireless testing are also described.
摘要:
A thyristor memory device may comprise a capacitor electrode formed over a base region of the thyristor using a replacement gate process. During formation of the thyristor, a base-emitter boundary may be aligned relative to a shoulder of the capacitor electrode. In a particular embodiment, the replacement gate process may comprise defining a trench in a layer of dielectric over semiconductor material. Conductive material for the electrode may be formed over the dielectric and in the trench. It may further be patterned to form a shoulder for the electrode that extends over regions of the dielectric over a base region for the thyristor. The extent of the shoulder may be used to pattern the dielectric and/or to assist alignment of implants for the base and emitter regions of the thyristor.
摘要:
An asymmetric non-volatile memory bitcell is described. The bitcell comprises source and drain regions comprising carriers of the same conductivity type. A floating gate rests on top of the well, and extends over a channel region, and at least a portion of the source and drain regions. The drain region comprises additional carriers of a second conductivity type, allowing band to band tunneling. The source region comprises additional carriers of a first conductivity type, thereby increasing source-gate capacitance. Thus, the bitcell incorporates a select device, thereby decreasing the overall size of the bitcell. The bitcell may be created without any additional CMOS process steps, or through the addition of a single extra mask step.
摘要:
An example of a method of fabricating a gate oxide of a floating gate transistor includes forming a plurality of shallow trench isolation (STI) regions in a silicon wafer. The method also includes selectively filling the STI regions with oxide. Further, the method includes forming sacrificial oxide regions on the silicon wafer. Furthermore, the method includes forming implant regions in the silicon wafer. In addition, the method includes selectively removing the sacrificial oxide regions. The method further includes forming the gate oxide.
摘要:
A nonvolatile memory (“NVM”) bitcell with one or more active regions capacitively coupled to the floating gate but that are separated from both the source and the drain. The inclusion of capacitors separated from the source and drain allows for improved control over the voltage of the floating gate. This in turn allows CHEI (or IHEI) to be performed with much higher efficiency than in existing bitcells, thereby the need for a charge pump to provide current to the bitcell, ultimately decreasing the total size of the bitcell. The bitcells may be constructed in pairs, further reducing the space requirements of the each bitcell, thereby mitigating the space requirements of the separate capacitor/s. The bitcell may also be operated by CHEI (or IHEI) and separately by BTBT depending upon the voltages applied at the source, drain, and capacitor/s.
摘要:
An asymmetric non-volatile memory bitcell is described. The bitcell comprises source and drain regions comprising carriers of the same conductivity type. A floating gate rests on top of the well, and extends over a channel region, and at least a portion of the source and drain regions. The drain region comprises additional carriers of a second conductivity type, allowing band to band tunneling. The source region comprises additional carriers of a first conductivity type, thereby increasing source-gate capacitance. Thus, the bitcell incorporates a select device, thereby decreasing the overall size of the bitcell. The bitcell may be created without any additional CMOS process steps, or through the addition of a single extra mask step.