公开(公告)号：US07531059B2

公开(公告)日：2009-05-12

申请号：US10798816

申请日：2004-03-10

申请人： Nicole S Carpenter ,  Joseph R Drennan ,  Alison K Easton ,  Casey J Grant ,  Andrew S Hoadley ,  Kenneth F McAvey, Jr. ,  Joel M Sharrow ,  William A Syverson ,  Kenneth H Yao

发明人： Nicole S Carpenter ,  Joseph R Drennan ,  Alison K Easton ,  Casey J Grant ,  Andrew S Hoadley ,  Kenneth F McAvey, Jr. ,  Joel M Sharrow ,  William A Syverson ,  Kenneth H Yao

IPC分类号： H01L21/00 ,  C23C16/00 ,  C23C14/00

CPC分类号： B08B7/0014

摘要： An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

摘要翻译： 提供了用于从诸如半导体晶片的衬底表面去除污染颗粒物质的装置和方法。 该方法和装置使用材料，优选液体可固化聚合物，其作为牺牲涂层施加到其上含有污染颗粒物质的基材的表面上。 使用能量源将污染颗粒物质从晶片的表面移走到牺牲涂层中，使得颗粒被部分或完全包封并悬浮在牺牲涂层中。 然后去除牺牲涂层。 涂层优选形成薄膜以通过拉（剥离）提供更清洁的基底表面的薄膜来去除涂层。

公开(公告)号：US06776171B2

公开(公告)日：2004-08-17

申请号：US09892954

申请日：2001-06-27

申请人： Nicole S. Carpenter ,  Joseph R. Drennan ,  Alison K. Easton ,  Casey J. Grant ,  Andrew S. Hoadley ,  Kenneth F. McAvey, Jr. ,  Joel M. Sharrow ,  William A. Syverson ,  Kenneth H. Yao

发明人： Nicole S. Carpenter ,  Joseph R. Drennan ,  Alison K. Easton ,  Casey J. Grant ,  Andrew S. Hoadley ,  Kenneth F. McAvey, Jr. ,  Joel M. Sharrow ,  William A. Syverson ,  Kenneth H. Yao

IPC分类号： B08B700

CPC分类号： B08B7/0014

摘要： An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.