公开(公告)号：US07205216B2

公开(公告)日：2007-04-17

申请号：US10710700

申请日：2004-07-29

申请人： Casey J. Grant ,  Heidi L. Greer ,  Steven M. Shank ,  Michael C. Triplett

发明人： Casey J. Grant ,  Heidi L. Greer ,  Steven M. Shank ,  Michael C. Triplett

IPC分类号： H01L21/20 ,  H01L21/31

CPC分类号： H01L21/324 ,  H01L22/20

摘要： A method and structure for fabricating semiconductor wafers. The method comprises providing a plurality of semiconductor wafers. The plurality of semiconductor wafers comprises a first semiconductor wafer and a second semiconductor wafer. The first semiconductor wafer is located adjacent to the second semiconductor wafer. A relationship is provided between a plurality of values for an electrical characteristic and a plurality of materials. A material is chosen from the plurality of materials existing in the relationship. A substructure is formed comprising the material sandwiched between a topside of the first semiconductor wafer and a backside of a portion of the of the second semiconductor wafer. The plurality of semiconductor wafers are placed into a furnace comprising an elevated temperature for processing resulting in a value for the first semiconductor wafer of the electrical characteristic that corresponds to said material in said relationship.

摘要翻译： 一种用于制造半导体晶片的方法和结构。 该方法包括提供多个半导体晶片。 多个半导体晶片包括第一半导体晶片和第二半导体晶片。 第一半导体晶片位于第二半导体晶片附近。 在电特性和多种材料的多个值之间提供关系。 从存在于该关系中的多种材料中选择材料。 形成了包括夹在第一半导体晶片的顶侧和第二半导体晶片的一部分的背面之间的材料的子结构。 将多个半导体晶片放置在包括用于处理的升高的温度的炉中，从而产生与所述关系中的所述材料对应的电特性的第一半导体晶片的值。

公开(公告)号：US06670283B2

公开(公告)日：2003-12-30

申请号：US09989389

申请日：2001-11-20

申请人： Faye D. Baker ,  Casey J. Grant ,  Mousa H. Ishaq ,  Joel M. Sharrow ,  James D. Weil

发明人： Faye D. Baker ,  Casey J. Grant ,  Mousa H. Ishaq ,  Joel M. Sharrow ,  James D. Weil

IPC分类号： H01L2131

CPC分类号： H01L21/02164 ,  H01L21/02115 ,  H01L21/0217 ,  H01L21/022 ,  H01L21/02271 ,  H01L21/02274 ,  H01L21/31612

摘要： Disclosed is a method of fabricating a semiconductor device, comprising: (a) providing a bare semiconductor substrate, the substrate having a frontside and a backside; (b) forming one or more protective films on the backside of the substrate; and (c) performing one or more wafer fabrication steps. Some or all the protective films may be removed and the method repeated multiple times during fabrication of the semiconductor device.

摘要翻译： 公开了一种制造半导体器件的方法，包括：（a）提供裸半导体衬底，所述衬底具有前侧和后侧; （b）在衬底的背面形成一个或多个保护膜; 和（c）执行一个或多个晶片制造步骤。 可以去除一些或全部保护膜，并且在制造半导体器件期间该方法重复多次。

公开(公告)号：US08849440B2

公开(公告)日：2014-09-30

申请号：US13485862

申请日：2012-05-31

申请人： Casey J. Grant ,  Kurt A. Tallman ,  Sabastian T. Ventrone

发明人： Casey J. Grant ,  Kurt A. Tallman ,  Sabastian T. Ventrone

IPC分类号： G05B13/02

CPC分类号： G05B19/4097 ,  G05B2219/32031 ,  G05B2219/32033 ,  G05B2219/45031

摘要： Disclosed are embodiments of an improved design method, the results of which are a final design structure for an integrated circuit that incorporates, not only layout information, but also client-specific manufacturing information (e.g., import/export information, service requests, processing directives, purchase order requirements, design rule information, etc.) in the same data format in hierarchical form. Also disclosed are embodiments of a manufacturing control method and system. In these embodiments, a final design structure, such as that described above, is received at tape-in. The information contained therein (particularly, the client-specific manufacturing information) is sorted by type and then forwarded to the appropriate tools within the manufacturing facility for processing. By providing the client-specific manufacturing information directly to each manufacturing facility in the final design structure in conjunction with the layout information, the embodiments eliminate the need for independent information gathering by each manufacturing facility.

摘要翻译： 公开了一种改进的设计方法的实施例，其结果是集成电路的最终设计结构，不仅包括布局信息，而且包括客户特定制造信息（例如，导入/导出信息，服务请求，处理指令 ，采购订单要求，设计规则信息等）以相同的数据格式分层格式。 还公开了制造控制方法和系统的实施例。 在这些实施例中，诸如上述的最终设计结构在磁带入口处被接收。 其中包含的信息（特别是客户特定的制造信息）按类型排序，然后转发到制造设施内的适当工具进行处理。 结合布局信息，通过在终端设计结构中直接向每个制造设施提供特定于客户的制造信息，实施例消除了对每个制造设备的独立信息收集的需要。

公开(公告)号：US20120151748A1

公开(公告)日：2012-06-21

申请号：US13404485

申请日：2012-02-24

申请人： Mete Erturk ,  John D. Gillis ,  Casey J. Grant ,  David Scagnelli ,  Anthony K. Stamper

发明人： Mete Erturk ,  John D. Gillis ,  Casey J. Grant ,  David Scagnelli ,  Anthony K. Stamper

IPC分类号： G01R31/28 ,  G06F17/50

CPC分类号： H01F17/0006 ,  H01F17/04 ,  H01F27/2847 ,  H01F41/04 ,  H01F41/041 ,  H01F41/045 ,  H01F2017/0053 ,  H01F2017/0073 ,  H01F2017/046 ,  H01L23/5227 ,  H01L23/528 ,  H01L23/645 ,  H01L28/10 ,  H01L2924/0002 ,  H01L2924/3011 ,  Y10T29/49004 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49073 ,  Y10T29/49156 ,  H01L2924/00

摘要： Embodiments disclosed include methods of designing an inductor. The inductor can include a conductive line including at least one turn and an opening positioned within an interior of a region of the conductive line.

摘要翻译： 公开的实施例包括设计电感器的方法。 电感器可以包括包括至少一个匝的导电线和位于导电线的区域的内部内的开口。

公开(公告)号：US06939408B1

公开(公告)日：2005-09-06

申请号：US09650103

申请日：2000-08-29

申请人： Francis A. Abramovich ,  Nicole S. Carpenter ,  Joseph R. Drennan ,  Rick H. Gaylord ,  Casey J. Grant ,  Kenneth F. McAvey, Jr. ,  Mark A. Pakulski ,  Joel M. Sharrow ,  William A. Syverson ,  Alison K. Easton ,  Kenneth H. Yao

发明人： Francis A. Abramovich ,  Nicole S. Carpenter ,  Joseph R. Drennan ,  Rick H. Gaylord ,  Casey J. Grant ,  Kenneth F. McAvey, Jr. ,  Mark A. Pakulski ,  Joel M. Sharrow ,  William A. Syverson ,  Alison K. Easton ,  Kenneth H. Yao

IPC分类号： B08B3/00 ,  B08B3/08 ,  H01L21/00 ,  H01L21/306

CPC分类号： H01L21/02052 ,  B08B3/08 ,  H01L21/02019 ,  H01L21/30604 ,  H01L21/67086 ,  Y10S134/902

摘要： A method for preparing a workpiece surface utilizing two more fluids of differing density and miscibility which create one or more fluid interfaces wherein the fluids are chosen such that the solubility or affinity of one of the fluids is high for a material to be removed from the workpiece surface while the other fluid has a low solubility or affinity for the material to be removed. The workpiece surface is treated by passing the workpiece through the fluid interface. The two or more fluids are preferably dispensed into an apparatus and allowed to settle into two or more predominant layers separated by an interface. Surface preparation techniques which may benefit from the present invention include etching, cleaning or drying processes and the like.

摘要翻译： 一种用于制备工件表面的方法，其使用两种不同密度和混溶性的流体，其产生一个或多个流体界面，其中选择流体使得流体之一的溶解度或亲和力对于从工件中去除的材料是高的 而另一种流体对待除去的材料具有低溶解度或亲和性。 通过使工件通过流体界面来处理工件表面。 两种或更多种流体优选地分配到装置中并允许沉降到由界面分开的两个或更多个主要层中。 可受益于本发明的表面处理技术包括蚀刻，清洗或干燥过程等。

公开(公告)号：US08399181B2

公开(公告)日：2013-03-19

申请号：US13346776

申请日：2012-01-10

申请人： Casey J. Grant ,  Jude L. Hankey

发明人： Casey J. Grant ,  Jude L. Hankey

IPC分类号： G03F7/16 ,  G03F7/20 ,  G03F7/40 ,  G06F17/50

CPC分类号： H01L21/7684 ,  G03F1/36 ,  H01L21/3212 ,  H01L23/522 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of improving damascene wire uniformity without reducing performance. The method includes simultaneously forming a multiplicity of damascene wires and a multiplicity of metal dummy shapes in a dielectric layer of a wiring level of an integrated circuit chip, the metal dummy shapes being dispersed between damascene wires of the multiplicity of damascene wires; and removing or modifying those metal dummy shapes of the multiplicity of metal dummy shapes within exclusion regions around selected damascene wires of the multiplicity of damascene wires. Also a method of fabricating a photomask and a photomask for use in improving damascene wire uniformity without reducing performance.

摘要翻译： 改善镶嵌丝均匀性而不降低性能的方法。 该方法包括在集成电路芯片的布线层的电介质层中同时形成多个镶嵌线和多个金属虚拟形状，金属虚拟形状分散在多个镶嵌线的镶嵌线之间; 以及在多个镶嵌线的所选择的镶嵌线周围的排除区域内去除或修改多个金属假形状的那些金属虚拟形状。 还有一种制造光掩模和光掩模的方法，其用于改善镶嵌线的均匀性而不降低性能。

公开(公告)号：US07531059B2

公开(公告)日：2009-05-12

申请号：US10798816

申请日：2004-03-10

申请人： Nicole S Carpenter ,  Joseph R Drennan ,  Alison K Easton ,  Casey J Grant ,  Andrew S Hoadley ,  Kenneth F McAvey, Jr. ,  Joel M Sharrow ,  William A Syverson ,  Kenneth H Yao

发明人： Nicole S Carpenter ,  Joseph R Drennan ,  Alison K Easton ,  Casey J Grant ,  Andrew S Hoadley ,  Kenneth F McAvey, Jr. ,  Joel M Sharrow ,  William A Syverson ,  Kenneth H Yao

IPC分类号： H01L21/00 ,  C23C16/00 ,  C23C14/00

CPC分类号： B08B7/0014

摘要： An apparatus and method are provided for removing contaminate particulate matter from substrate surfaces such as semiconductor wafers. The method and apparatus use a material, preferably a liquid curable polymer, which is applied as a sacrificial coating to the surface of a substrate containing contaminate particulate matter thereon. An energy source is used to dislodge the contaminate particulate matter from the surface of the wafer into the sacrificial coating so that the particles are partially or fully encapsulated and suspended in the sacrificial coating. The sacrificial coating is then removed. The coating is preferably formed into a film to facilitate removal of the coating by pulling (stripping) the film providing a cleaner substrate surface.

摘要翻译： 提供了用于从诸如半导体晶片的衬底表面去除污染颗粒物质的装置和方法。 该方法和装置使用材料，优选液体可固化聚合物，其作为牺牲涂层施加到其上含有污染颗粒物质的基材的表面上。 使用能量源将污染颗粒物质从晶片的表面移走到牺牲涂层中，使得颗粒被部分或完全包封并悬浮在牺牲涂层中。 然后去除牺牲涂层。 涂层优选形成薄膜以通过拉（剥离）提供更清洁的基底表面的薄膜来去除涂层。

公开(公告)号：US20130325156A1

公开(公告)日：2013-12-05

申请号：US13485862

申请日：2012-05-31

申请人： Casey J. Grant ,  Kurt A. Tallman ,  Sebastian T. Ventrone

发明人： Casey J. Grant ,  Kurt A. Tallman ,  Sebastian T. Ventrone

IPC分类号： G05B13/02

CPC分类号： G05B19/4097 ,  G05B2219/32031 ,  G05B2219/32033 ,  G05B2219/45031

摘要： Disclosed are embodiments of an improved design method, the results of which are a final design structure for an integrated circuit that incorporates, not only layout information, but also client-specific manufacturing information (e.g., import/export information, service requests, processing directives, purchase order requirements, design rule information, etc.) in the same data format in hierarchical form. Also disclosed are embodiments of a manufacturing control method and system. In these embodiments, a final design structure, such as that described above, is received at tape-in. The information contained therein (particularly, the client-specific manufacturing information) is sorted by type and then forwarded to the appropriate tools within the manufacturing facility for processing. By providing the client-specific manufacturing information directly to each manufacturing facility in the final design structure in conjunction with the layout information, the embodiments eliminate the need for independent information gathering by each manufacturing facility.

摘要翻译： 公开了一种改进的设计方法的实施例，其结果是集成电路的最终设计结构，不仅包括布局信息，而且包括客户特定制造信息（例如，导入/导出信息，服务请求，处理指令 ，采购订单要求，设计规则信息等）以相同的数据格式分层格式。 还公开了制造控制方法和系统的实施例。 在这些实施例中，诸如上述的最终设计结构在磁带入口处被接收。 其中包含的信息（特别是客户特定的制造信息）按类型排序，然后转发到制造设施内的适当工具进行处理。 结合布局信息，通过在终端设计结构中直接向每个制造设施提供特定于客户的制造信息，实施例消除了对每个制造设备的独立信息收集的需要。

公开(公告)号：US07773159B2

公开(公告)日：2010-08-10

申请号：US11276130

申请日：2006-02-15

申请人： Ahmed Y. Ginawi ,  Casey J. Grant ,  Christopher Ro ,  Sebastian T. Ventrone

发明人： Ahmed Y. Ginawi ,  Casey J. Grant ,  Christopher Ro ,  Sebastian T. Ventrone

IPC分类号： H04N5/50 ,  H04N5/44

CPC分类号： H04N5/50 ,  H04N7/163 ,  H04N21/4383 ,  H04N21/4394 ,  H04N21/44008 ,  H04N21/472 ,  H04N21/812

摘要： Systems for switching a displayed signal for a display between a plurality of signals are disclosed. In one embodiment, the system includes a microcontroller; a chooser for choosing a primary signal from a plurality of program-variable signals at the microcontroller; a monitor tuner coupled to the microcontroller for tuning the primary signal during switching of the displayed signal from the primary signal to a secondary signal; a detector coupled to the monitor tuner and the microcontroller for detecting a predetermined condition in the primary signal; and a selector coupled to the microcontroller for switching the displayed signal from the secondary signal to the primary signal upon occurrence of the predetermined condition. A user can switch between signals such as television channels or other dedicated functions without the risk of missing a portion of the program material.

摘要翻译： 公开了用于在多个信号之间切换用于显示的显示信号的系统。 在一个实施例中，该系统包括微控制器; 用于在微控制器处从多个可编程信号中选择主信号的选择器; 耦合到微控制器的监视器调谐器，用于在将所显示的信号从主信号切换到辅助信号期间调谐主信号; 耦合到所述监视器调谐器和所述微控制器的检测器，用于检测所述主信号中的预定条件; 以及耦合到微控制器的选择器，用于在发生预定条件时将显示的信号从次级信号切换到主信号。 用户可以在诸如电视频道或其他专用功能的信号之间切换，而不会丢失节目素材的一部分。

公开(公告)号：US20080172641A1

公开(公告)日：2008-07-17

申请号：US12056795

申请日：2008-03-27

申请人： Ahmed Y. Ginawi ,  Casey J. Grant ,  Christopher Ro ,  Sebastian T. Ventrone

发明人： Ahmed Y. Ginawi ,  Casey J. Grant ,  Christopher Ro ,  Sebastian T. Ventrone

IPC分类号： G06F17/50

CPC分类号： H04N7/163 ,  H04N21/4383 ,  H04N21/4394 ,  H04N21/44008 ,  H04N21/472 ,  H04N21/812

摘要： A design structure for systems for switching a displayed signal for a display between a plurality of signals are disclosed. In one embodiment, the design structure is embodied in a machine readable medium for designing, manufacturing, or testing an integrated circuit, and includes: a system for switching a displayed signal for a display between a plurality of signals, the system including: a microcontroller; a chooser for setting a primary signal from a plurality of program-variable signals; a monitor tuner coupled to the microcontroller for tuning the primary signal during switching of the displayed signal from the primary signal to a secondary signal; a detector coupled to the monitor tuner and the microcontroller for detecting a predetermined condition in the primary signal; and a selector coupled to the microcontroller for switching the displayed signal from the secondary signal to the primary signal upon occurrence of the predetermined condition.

摘要翻译： 公开了用于在多个信号之间切换用于显示的显示信号的系统的设计结构。 在一个实施例中，设计结构体现在用于设计，制造或测试集成电路的机器可读介质中，并且包括：用于在多个信号之间切换用于显示的显示信号的系统，所述系统包括：微控制器 ; 用于从多个可编程信号设置主信号的选择器; 耦合到微控制器的监视器调谐器，用于在将所显示的信号从主信号切换到辅助信号期间调谐主信号; 耦合到所述监视器调谐器和所述微控制器的检测器，用于检测所述主信号中的预定条件; 以及耦合到微控制器的选择器，用于在发生预定条件时将显示的信号从次级信号切换到主信号。