Method for Substrate Pretreatment To Achieve High-Quality III-Nitride Epitaxy
    1.
    发明申请
    Method for Substrate Pretreatment To Achieve High-Quality III-Nitride Epitaxy 有权
    用于基板预处理以实现高质量III-氮化物外延的方法

    公开(公告)号:US20130337639A1

    公开(公告)日:2013-12-19

    申请号:US13533812

    申请日:2012-06-26

    IPC分类号: H01L21/205

    摘要: The present invention relates to a method for producing a modified surface of a substrate that stimulates the growth of epitaxial layers of group-III nitride semiconductors with substantially improved structural perfection and surface flatness. The modification is conducted outside or inside a growth reactor by exposing the substrate to a gas-product of the reaction between hydrogen chloride (HCl) and aluminum metal (Al). As a single-step or an essential part of the multi-step pretreatment procedure, the modification gains in coherent coordination between the substrate and group-III nitride epitaxial structure to be deposited. Along with epilayer, total epitaxial structure may include buffer inter-layer to accomplish precise substrate-epilayer coordination. While this modification is a powerful tool to make high-quality group-III nitride epitaxial layers attainable even on foreign substrates having polar, semipolar and nonpolar orientation, it remains gentle enough to keep the surface of the epilayer extremely smooth. Various embodiments are disclosed.

    摘要翻译: 本发明涉及一种以显着改善的结构完整性和表面平坦度来刺激III族氮化物半导体的外延层的生长的衬底的改性表面的制造方法。 通过将衬底暴露于氯化氢(HCl)和铝金属(Al)之间的反应的气体产物,在生长反应器的外部或内部进行改性。 作为多步预处理方法的一个步骤或重要部分,修饰增益将沉积在衬底和III族氮化物外延结构之间的相干协调。 与外延层一起,总外延结构可以包括缓冲层,以实现精确的基底 - 外延层协调。 虽然这种修改是使得即使在具有极性,半极性和非极性取向的异质衬底上也能获得高质量III族氮化物外延层的强大工具,但它仍然足够柔和以保持外延层的表面非常光滑。 公开了各种实施例。

    Method for substrate pretreatment to achieve high-quality III-nitride epitaxy
    4.
    发明授权
    Method for substrate pretreatment to achieve high-quality III-nitride epitaxy 有权
    用于衬底预处理以实现高质量III族氮化物外延的方法

    公开(公告)号:US08728938B2

    公开(公告)日:2014-05-20

    申请号:US13533812

    申请日:2012-06-26

    摘要: The present invention relates to a method for producing a modified surface of a substrate that stimulates the growth of epitaxial layers of group-III nitride semiconductors with substantially improved structural perfection and surface flatness. The modification is conducted outside or inside a growth reactor by exposing the substrate to a gas-product of the reaction between hydrogen chloride (HCl) and aluminum metal (Al). As a single-step or an essential part of the multi-step pretreatment procedure, the modification gains in coherent coordination between the substrate and group-III nitride epitaxial structure to be deposited. Along with epilayer, total epitaxial structure may include buffer inter-layer to accomplish precise substrate-epilayer coordination. While this modification is a powerful tool to make high-quality group-III nitride epitaxial layers attainable even on foreign substrates having polar, semipolar and nonpolar orientation, it remains gentle enough to keep the surface of the epilayer extremely smooth. Various embodiments are disclosed.

    摘要翻译: 本发明涉及一种以显着改善的结构完整性和表面平坦度来刺激III族氮化物半导体的外延层的生长的衬底的改性表面的制造方法。 通过将衬底暴露于氯化氢(HCl)和铝金属(Al)之间的反应的气体产物,在生长反应器的外部或内部进行改性。 作为多步预处理方法的一个步骤或重要部分,修饰增益将沉积在衬底和III族氮化物外延结构之间的相干协调。 与外延层一起,总外延结构可以包括缓冲层,以实现精确的基底 - 外延层协调。 虽然这种修改是使得即使在具有极性,半极性和非极性取向的异质衬底上也能获得高质量III族氮化物外延层的强大工具,但它仍然足够柔和以保持外延层的表面非常光滑。 公开了各种实施例。