摘要:
According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.
摘要:
A package member includes a first cushioning member coupled to one end of a flat panel display apparatus, and a second cushioning member coupled to the other end of the flat panel display apparatus. The package member further includes a reinforcing pad formed of a plate-shaped member and having both ends supported by the first cushioning member and the second cushioning member. The reinforcing member increases the strength of the first and second cushioning members, enabling more safe protection of the flat panel display apparatus packaged in the package member.
摘要:
According to example embodiments, an automatic packing apparatus includes at least one box supply unit configured to move a box stack upwards such that a product is inserted into a packing box of the box stack, the packing box being the uppermost box of the box stack, an inlet formation unit configured to lift the upper surface of the packing box to form an inlet on at least one unbonded side surface of the packing box, a product supply unit configured to transfer the product to the inlet; and a side surface bonding unit configured to bond the at least one unbonded side surface of the packing box. The at least one unbonded side surface includes the inlet and the packing box includes the product inserted therein.
摘要:
Disclosed herein are a coupling structure for a multi-layered chip filter capable of overcoming a limitation of an existing coupling by improving a coupling structure and a multi-layered chip filter with the structure.The coupling structure according to an exemplary embodiment of the present invention includes: at least two overlap portion patterns each overlapped with a pattern formed on a resonator layer stacked therewith to form at least two overlap areas spaced from each other; and a connecting portion pattern formed by connecting at least three linear lines having a predetermined length to each other to connect the at least two overlap portion patterns to each other.
摘要:
Disclosed is a foamed resin molding machine including a first mold having a first molding surface, a second mold having a second molding surface, and a third mold. A cavity is formed between the first molding surface and the second molding surface, and the third mold is movably mounted with respect to the first molding surface, such that the third mold can protrude into the cavity. The cavity is fillable with resin particles.
摘要:
There are provided a multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength, and a fabrication method thereof. Dummy electrodes connected to the outer electrodes are formed on cover areas and an active area of a ceramic main body. A multilayered ceramic electronic component having outer electrodes with excellent corner coverage and adhesive strength can be obtained.
摘要:
A multilayer filter includes: a ceramic body in which a plurality of dielectric layers are laminated; an external ground electrode provided on an outer surface of the ceramic body and connected to a ground; an inductor pattern electrode provided on at least one of the dielectric layers and having one end connected to the external ground electrode; a capacitor pattern electrode provided on at least one of the dielectric layers; an external terminal electrode electrically connecting the inductor pattern electrode to the capacitor pattern electrode and forming a closed loop for generating inductance through the external ground electrode; and a variable dielectric layer provided between the capacitor pattern electrode and the inductor pattern electrode and adjusting a magnitude of inductance generated by the inductor pattern electrode.
摘要:
A coupling structure for a multi-layered chip filter includes a resonator layer including a resonator pattern with spaced areas and a coupling layer including at least two separated overlap portion patterns overlapped with the spaced areas of the resonator pattern respectively and a connecting portion pattern having multiple linear portions connecting the separated overlap portion patterns in an area not-overlapped with the resonator pattern.
摘要:
Disclosed herein is a laminated chip inductor including: a laminate including a plurality of first sheets having conductive patterns printed thereon and laminated in order; and a sheet having a discrimination via hole and provided on and/or under the laminate.
摘要:
A package member includes a first cushioning member coupled to one end of a flat panel display apparatus, and a second cushioning member coupled to the other end of the flat panel display apparatus. The package member further includes a reinforcing pad formed of a plate-shaped member and having both ends supported by the first cushioning member and the second cushioning member. The reinforcing member increases the strength of the first and second cushioning members, enabling more safe protection of the flat panel display apparatus packaged in the package member