Advanced PCI express board assembly

    公开(公告)号:US10664431B2

    公开(公告)日:2020-05-26

    申请号:US15970919

    申请日:2018-05-04

    摘要: An advanced PCI express board assembly is mountable in a PCI express slot. The assembly includes a main board that is attached to an adapter board by a connector section that includes mechanical and electrical connectors. When the main board is attached to the adapter board, the plane defined by the main board is parallel to, and laterally offset from, the plane defined by the adapter board. The adapter board is connectable to a female PCI express connector in the PCI slot. When the adapter board is connected to the female PCI express connector, the main board plane is perpendicular to the motherboard and is laterally offset from the PCI express slot. More and larger components can be placed on the main board while the assembly remains within the reserved PCI express space.

    PCI EXPRESS CLUSTER
    2.
    发明申请
    PCI EXPRESS CLUSTER 审中-公开

    公开(公告)号:US20160034412A1

    公开(公告)日:2016-02-04

    申请号:US14450273

    申请日:2014-08-03

    IPC分类号: G06F13/40 G06F13/42

    CPC分类号: G06F13/4027 G06F13/4221

    摘要: PCI Express Cluster dedicated for system expansion through installation of up to four high-performance PCI Express boards (example: graphics processing units—GPU).Cluster includes a special chassis and a backplane. Add-in PCI Express boards are plugged into PCI Express connectors that are located on both sides of the backplane (two on the top side and two on the bottom side); said boards are specially oriented, relative to each other, thereby ensuring that all component sides of said four PCI Express boards will be directed outwards.This type of PCI Express board placement allows the cooling fans, located on the component side of each PCI Express board, to intake cooling air at ambient temperature, and to eliminate the possibility of airflow obstruction or intake of air that has already been heated by nearby boards.PCI Express Cluster can be connected to host computer in the first implementation or operate independently as a stand-alone device in the second implementation.

    摘要翻译: PCI Express集群专用于通过安装最多四个高性能PCI Express板(例如:图形处理单元-GPU)进行系统扩展。 集群包括专用机箱和背板。 附加PCI Express板插入位于背板两侧的两个PCI Express接口(两个位于上侧,两个位于底面); 所述板相对于彼此特别定向,从而确保所述四个PCI Express板的所有组件侧面将被向外引导。 这种类型的PCI Express板放置允许位于每个PCI Express板的组件侧的冷却风扇在环境温度下进入冷却空气,并消除气流阻塞或吸入附近已被加热的空气的可能性 董事会 PCI Express群集可以在第一个实现中连接到主机,或者在第二个实现中独立地作为独立设备运行。

    Protection against natural dangers connected with huge streams mainly water, mud, locust
    3.
    发明申请
    Protection against natural dangers connected with huge streams mainly water, mud, locust 审中-公开
    防止与巨大的河流相关的自然危险,主要是水,泥土,蝗虫

    公开(公告)号:US20120175427A1

    公开(公告)日:2012-07-12

    申请号:US12930433

    申请日:2011-01-07

    IPC分类号: A01G15/00

    CPC分类号: A01G15/00

    摘要: A method and system for protection against natural temperature-dependent dangerous phenomena connected with huge streams mainly water, mud, locust. The method allows weakening these streams and allows protecting against these dangers at least at of the first two stages of development of said phenomena: forming these masses and their moving, as far as possible. The method allows protecting ecology and increasing CO2 absorption. The system allows also transporting the electrical energy that is received from solar radiation with help of solar cells flying in stratosphere to ground-based reception stations.

    摘要翻译: 一种用于防止与大量溪流,主要是水,泥土,蝗虫相关的自然依赖于温度的危险现象的方法和系统。 该方法允许减弱这些流并且至少在所述现象的开发的前两个阶段中至少防止这些危险:尽可能地形成这些质量和它们的移动。 该方法允许保护生态学和增加二氧化碳吸收。 该系统还可以通过在平流层中飞行的太阳能电池到地面接收站来传输从太阳辐射接收的电能。

    Advanced PCI express board assembly

    公开(公告)号:US09996495B2

    公开(公告)日:2018-06-12

    申请号:US14683147

    申请日:2015-04-10

    摘要: An advanced PCI Express board assembly is intended for efficiently placing more electronic components or modules having a large height (up to 8.57 mm) in comparison with traditional PCI Express add-in boards. This assembly comprises two PCBs connected together. The first one has the minimum possible sizes. This PCB includes a PCI Express male edge connector and is intended to be plugged in to motherboard female PCI Express connector. The second PCB is parallel to first one and is located in the middle of the space (slot) defined for one add-in PCI Express board. This position makes possible to place high electronic components or modules on the both sides (top and bottom) of the second PCB.

    Advanced PCI Express Board Assembly
    5.
    发明申请
    Advanced PCI Express Board Assembly 审中-公开
    高级PCI Express板组装

    公开(公告)号:US20160299863A1

    公开(公告)日:2016-10-13

    申请号:US14683147

    申请日:2015-04-10

    摘要: An advanced PCI Express board assembly is intended for efficiently placing more electronic components or modules having a large height (up to 8.57 mm) in comparison with traditional PCI Express add-in boards. This assembly comprises two PCBs connected together. The first one has the minimum possible sizes. This PCB includes a PCI Express male edge connector and is intended to be plugged in to motherboard female PCI Express connector. The second PCB is parallel to first one and is located in the middle of the space (slot) defined for one add-in PCI Express board. This position makes possible to place high electronic components or modules on the both sides (top and bottom) of the second PCB.

    摘要翻译: 与传统PCI Express附加板相比,高级PCI Express板组件旨在有效地放置更多高度(高达8.57 mm)的电子组件或模块。 该组件包括两个连接在一起的PCB。 第一个具有最小可能的尺寸。 该PCB包括一个PCI Express公接头连接器,旨在插入主板母PCI Express接口。 第二个PCB与第一个PCB平行,位于为一个附加PCI Express板定义的空间(插槽)的中间。 该位置使得可以在第二PCB的两侧(顶部和底部)上放置高电子部件或模块。

    Motherboard expansion device
    8.
    发明申请
    Motherboard expansion device 审中-公开
    主板扩展设备

    公开(公告)号:US20090190297A1

    公开(公告)日:2009-07-30

    申请号:US12011646

    申请日:2008-01-29

    IPC分类号: G06F1/16

    CPC分类号: G06F1/185

    摘要: The invention is to provide a motherboard expansion device that expands the possibility to use non-portable computers in different applied systems and allows them to operate with a plurality of external devices.

    摘要翻译: 本发明是提供一种扩展在不同应用系统中使用非便携式计算机的可能性的主板扩展装置,并允许它们与多个外部设备一起操作。

    Smart batteryless backup device and method therefor
    9.
    发明申请
    Smart batteryless backup device and method therefor 有权
    智能无电池备份设备及其方法

    公开(公告)号:US20080235471A1

    公开(公告)日:2008-09-25

    申请号:US11726751

    申请日:2007-03-23

    IPC分类号: G06F12/00

    摘要: A proposed smart batteryless backup device is designed for the reception of data transmitted by controlled equipment, backing up said data in the case of the controlled equipment power failure or in accordance with several program requirements, and also for the subsequent restoration. Proposed device improves trust level of the backup if device is powered by interface signal lines and doesn't have batteries and electrical characteristics of the backup device fluctuating due to humidity and temperature influences as well as during device lifetime.

    摘要翻译: 提出的智能无电池备份设备被设计用于接收受控设备发送的数据,在受控设备电源故障的情况下或根据多个程序要求备份所述数据,以及随后的恢复。 如果设备由接口信号线供电,并且没有电池和备用设备的电气特性由于湿度和温度影响以及器件寿命而波动,则提出的器件可以提高备份的信任级别。

    Batteryless data logger with backup status indication and method therefor

    公开(公告)号:US10481660B1

    公开(公告)日:2019-11-19

    申请号:US16394321

    申请日:2019-04-25

    摘要: Data storage device has a super-capacitor, a control unit with multiple operational states, non-volatile memory, and a bus connected to a computing device with a separate power source. The control unit state is set by the power level of the computing device and the super-capacitor. In a backup state, the control unit stores backup data from the computing device in the non-volatile memory using power from the super-capacitor. In an inactive state, the control unit does not receive power from the super-capacitor. The control unit is set to the backup state when the device power level is less than a first threshold and the super-capacitor voltage level is greater than a second threshold. The control unit is set to the inactive state when the super-capacitor voltage level decreases below a third threshold that is less than the second threshold by more than the dielectric absorption voltage gain of the super-capacitor.