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    Case burning rocket with drive system for combustion chamber and nozzle
    2.
    发明授权
    Case burning rocket with drive system for combustion chamber and nozzle 失效
    燃烧火箭与燃烧室和喷嘴驱动系统的情况

    公开(公告)号：US06782693B1

    公开(公告)日：2004-08-31

    申请号：US10037365

    申请日：2002-01-04

    Applicant: Brian A. Floyd

    Inventor： Brian A. Floyd

    IPC: B63H1100

    CPC classification number: F02K9/72 ,  F02K9/28 ,  F02K9/34 ,  F02K9/343

    Abstract: A case-burning rocket booster includes a combustible case containing a solid rocket fuel, a combustion chamber adjustably coupled to the case for burning the case and the solid rocket fuel, a nozzle connected to the combustion chamber for expelling the burned case and fuel to generate thrust, and a drive system for pulling the combustion chamber and nozzle up the case as the case and fuel burn. A hybrid version of the case-burning rocket also includes an oxygen supply system for supplying varying amounts of oxygen to the combustion chamber to vary the thrust generated by burning the case and the fuel.

    Abstract translation: 一种燃烧式火箭助推器包括一个包含固体火箭燃料的可燃壳体，一个可调节地联接到壳体上用于燃烧壳体和固体火箭燃料的燃烧室，连接到燃烧室的喷嘴，用于排出燃烧的壳体和燃料以产生 推力和驱动系统，用于拉动燃烧室并在壳体和燃料燃烧时将喷嘴向上喷出。 壳体燃烧火箭的混合版本还包括用于向燃烧室供应不同量的氧气以改变由燃烧壳体和燃料产生的推力的氧气供应系统。

    Compact millimeter wave packages with integrated antennas
    3.
    发明授权
    Compact millimeter wave packages with integrated antennas 有权
    具有集成天线的紧凑型毫米波封装

    公开(公告)号：US08256685B2

    公开(公告)日：2012-09-04

    申请号：US12494671

    申请日：2009-06-30

    Applicant: Ho Chung Chen ,  Brian A. Floyd ,  Duixian Liu

    Inventor： Ho Chung Chen ,  Brian A. Floyd ,  Duixian Liu

    IPC: G06K19/06

    CPC classification number: G06K19/07749 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/09701 ,  H01L2924/1903 ,  H01Q1/2283 ,  H01L2924/00014

    Abstract: A radio-frequency integrated circuit chip package has at least one integrated antenna. The package includes at least one generally planar ground plane formed with at least one slot therein. A first substrate structure has an outer surface and an inner surface. The at least one generally planar ground plane is formed on the outer surface of the first substrate structure. At least one feed line is spaced inwardly from the ground plane and parallel thereto. The at least one feed line has an inner surface and an outer surface and is a transmission line formed on the inner surface of the first substrate structure with the outer surface of the at least one feed line adjacent the inner surface of the first substrate structure. At least one radio frequency chip is coupled to the feed line and the ground plane. A second substrate structure, spaced inwardly from the feed line, defines a chip-receiving cavity. The chip is located in the chip-receiving cavity. The inner surface of the at least one feed line borders the chip-receiving cavity. An antenna patch may be provided. Planar phased array embodiments, assemblies with motherboards and heat sinks, and fabrication techniques are also disclosed.

    Abstract translation: 射频集成电路芯片封装具有至少一个集成的天线。 该封装包括至少一个在其中形成有至少一个槽的大致平面的接地平面。 第一衬底结构具有外表面和内表面。 至少一个大致平面的接地平面形成在第一基板结构的外表面上。 至少一个进料管线从接地平面向内隔开并与其平行。 所述至少一个进料管线具有内表面和外表面，并且是形成在所述第一基材结构的内表面上的传输线，所述至少一个进料管线的外表面邻近所述第一基材结构的内表面。 至少一个射频芯片被耦合到馈线和接地平面。 从馈电线向内隔开的第二衬底结构限定了芯片接收腔。 芯片位于芯片接收腔中。 所述至少一个馈送线的内表面与所述芯片接收腔相接。 可以提供天线贴片。 还公开了平面相控阵实施例，具有主板和散热器的组件以及制造技术。

    Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities
    4.
    发明授权
    Radio frequency (RF) integrated circuit (IC) packages with integrated aperture-coupled patch antenna(s) in ring and/or offset cavities 有权
    射频（RF）集成电路（IC）封装，在环和/或偏移空腔中集成了孔耦合贴片天线

    公开(公告)号：US07696930B2

    公开(公告)日：2010-04-13

    申请号：US12102051

    申请日：2008-04-14

    Applicant: Johannes A. G. Akkermans ,  Brian A. Floyd ,  Duixian Liu

    Inventor： Johannes A. G. Akkermans ,  Brian A. Floyd ,  Duixian Liu

    IPC: H01Q1/38

    CPC classification number: H01Q21/065 ,  G06K19/07749 ,  G06K19/07786 ,  H01L23/3121 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15323 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/0457 ,  H01Q21/061 ,  H01Q23/00 ,  Y10T29/49016

    Abstract: A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.

    Abstract translation: 射频集成电路芯片封装具有N个集成的孔耦合贴片天线，N为至少两个，并且包括N个通常为平面的贴片，以及至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并基本上与之平行。 。 接地平面在其中形成有至少N个耦合孔隙，并且槽基本上与贴片相对。 N个进料管线从接地平面向内隔开并基本上与其平行，并且至少一个射频芯片与进料管线向内间隔开并连接到进料管线和接地平面。 第一衬底层从馈电线向内隔开，并且形成有芯片接收腔，芯片位于芯片接收腔中。 第二基板层插入在接地平面和由贴片限定的平面之间的区域中，贴片形成在第一金属层中，接地平面形成在第二金属层中，第二基板层限定天线 其中N个大体平面的贴片位于其中。 还公开了“岛”和“偏移”结构以及制造方法。

    Gas strut separation for staged rocket
    6.
    发明授权
    Gas strut separation for staged rocket 有权
    气体支柱分离用于分段火箭

    公开(公告)号：US08091481B1

    公开(公告)日：2012-01-10

    申请号：US12434388

    申请日：2009-05-01

    Applicant: Brian A. Floyd

    Inventor： Brian A. Floyd

    IPC: F42B15/10

    CPC classification number: F42B15/36

    Abstract: A staged rocket apparatus includes first and second stages connected by a releasable connector. A plurality of pressurized gas struts are connected between the first and second stages and provide a separating force urging the first and second stages apart. The gas struts are held in a telescopingly collapsed first position by the releasable connector. The separating force is maintained at a minimum value so long as the releasable connector holds the struts in their first position. When the releasable connector is disconnected the separating force increases due to gas flow through a metering passage having a progressively increasing flow area from a high pressure chamber to a low pressure chamber.

    Abstract translation: 分段火箭装置包括通过可释放连接器连接的第一和第二阶段。 多个加压气体支柱连接在第一和第二平台之间，并提供分开力，以使第一和第二平台分开。 气体支柱通过可释放的连接器保持在可伸缩的第一位置。 分离力保持在最小值，只要可释放连接器将支柱固定在其第一位置即可。 当可释放连接器断开时，分离力由于气流通过具有从高压室到低压室逐渐增加的流动面积的计量通道而增加。

    RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES
    9.
    发明申请
    RADIO FREQUENCY (RF) INTEGRATED CIRCUIT (IC) PACKAGES WITH INTEGRATED APERTURE-COUPLED PATCH ANTENNA(S) IN RING AND/OR OFFSET CAVITIES 有权
    无线电频率（RF）集成电路（IC）包装与环形和/或偏移CAVIENS中的集成光纤耦合天线

    公开(公告)号：US20090256752A1

    公开(公告)日：2009-10-15

    申请号：US12102051

    申请日：2008-04-14

    Applicant: Johannes A.G. Akkermans ,  Brian A. Floyd ,  Duixian Liu

    Inventor： Johannes A.G. Akkermans ,  Brian A. Floyd ,  Duixian Liu

    IPC: H01Q9/04 ,  H01P11/00

    CPC classification number: H01Q21/065 ,  G06K19/07749 ,  G06K19/07786 ,  H01L23/3121 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2224/16 ,  H01L2224/16227 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/15153 ,  H01L2924/15323 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q9/0457 ,  H01Q21/061 ,  H01Q23/00 ,  Y10T29/49016

    Abstract: A radio-frequency integrated circuit chip package has N integrated aperture-coupled patch antennas, N being at least two, and includes N generally planar patches, and at least one generally planar ground plane spaced inwardly from the N generally planar patches and substantially parallel thereto. The ground plane is formed with at least N coupling aperture slots therein, and the slots are substantially opposed to the patches. N feed lines are spaced inwardly from the ground plane and substantially parallel thereto, and at least one radio frequency chip is spaced inwardly from the feed lines and coupled to the feed lines and the ground plane. A first substrate layer is spaced inwardly from the feed lines, and is formed with a chip-receiving cavity, with the chip located in the chip-receiving cavity. A second substrate layer is interposed in a region between the ground plane and a plane defined by the patch, the patch is formed in a first metal layer, the ground plane is formed in a second metal layer, and the second substrate layer defines an antenna cavity in which the N generally planar patches are located. “Island” and “offset” configurations, as well as fabrication methods, are also disclosed.

    Abstract translation: 射频集成电路芯片封装具有N个集成的孔耦合贴片天线，N为至少两个，并且包括N个通常为平面的贴片，以及至少一个大致平面的接地平面，与N个大致平坦的贴片间隔开并基本上与之平行。 。 接地平面在其中形成有至少N个耦合孔隙，并且槽基本上与贴片相对。 N个进料管线从接地平面向内隔开并基本上与其平行，并且至少一个射频芯片与进料管线向内间隔开并连接到进料管线和接地平面。 第一衬底层从馈电线向内隔开，并且形成有芯片接收腔，芯片位于芯片接收腔中。 第二基板层插入在接地平面和由贴片限定的平面之间的区域中，贴片形成在第一金属层中，接地平面形成在第二金属层中，第二基板层限定天线 其中N个大体平面的贴片位于其中。 还公开了“岛”和“偏移”结构以及制造方法。

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