MAGNETIC ACTUATOR
    3.
    发明申请
    MAGNETIC ACTUATOR 有权
    磁力执行器

    公开(公告)号:US20160111238A1

    公开(公告)日:2016-04-21

    申请号:US14784445

    申请日:2013-07-11

    IPC分类号: H01H50/18 H01H50/64 H01H50/42

    摘要: A magnetic actuator includes: a movable unit, movable between a first position and a second position, and including an integrally formed eddy-current component and first magnet yoke component; a second magnet yoke component to form a magnetic circuit with the first magnet yoke component; an electromagnetic coil capable of generating an exciting magnetic field when being energized, magnetic lines generated thereby being energized penetrating the magnetic circuit formed by the first and second magnet yoke components; an eddy-current coil to enable an eddy current to be generated in the eddy-current component, to produce an electromagnetic repulsive force to the movable unit; and a permanent magnetic holding component to hold the movable unit in the first position or the second position. The magnetic actuator can simplify the actuator, reduce the number of components and the size thereof, as well as reducing the energy consumption and improving the stability thereof.

    摘要翻译: 磁致动器包括:可移动单元,可在第一位置和第二位置之间移动,并且包括一体形成的涡流部件和第一磁轭部件; 第二磁轭组件,用于与第一磁轭组件形成磁路; 能够在被通电时产生励磁磁场的电磁线圈,由此产生的磁线穿过由第一和第二磁轭部件形成的磁路; 涡流线圈,用于在涡电流分量中产生涡电流,以产生对可移动单元的电磁排斥力; 以及永磁保持部件,用于将可动单元保持在第一位置或第二位置。 磁致动器可以简化致动器,减少部件数量及其尺寸,并且降低能量消耗并提高其稳定性。

    Method to fabricate copper wiring structures and structures formed thereby
    7.
    发明授权
    Method to fabricate copper wiring structures and structures formed thereby 有权
    制造铜布线结构和由此形成的结构的方法

    公开(公告)号:US09048296B2

    公开(公告)日:2015-06-02

    申请号:US13025322

    申请日:2011-02-11

    摘要: Techniques formation of high purity copper (Cu)-filled lines and vias are provided. In one aspect, a method of fabricating lines and vias filled with high purity copper with is provided. The method includes the following steps. A via is etched in a dielectric. The via is lined with a diffusion barrier. A thin ruthenium (Ru) layer is conformally deposited onto the diffusion barrier. A Cu layer is deposited on the Ru layer by a sputtering process. A reflow anneal is performed to eliminate voids in the lines and vias.

    摘要翻译: 提供了高纯铜(Cu)填充线和通孔的技术形成。 在一个方面,提供了一种制造填充有高纯度铜的管线和通孔的方法。 该方法包括以下步骤。 在电介质中蚀刻通孔。 通孔内有一个扩散屏障。 薄的钌(Ru)层共形沉积到扩散阻挡层上。 通过溅射工艺在Ru层上沉积Cu层。 进行回流退火以消除管线和通孔中的空隙。