RAM cell with soft error protection using ferroelectric material
    1.
    发明申请
    RAM cell with soft error protection using ferroelectric material 审中-公开
    使用铁电材料的具有软错误保护的RAM单元

    公开(公告)号:US20070103961A1

    公开(公告)日:2007-05-10

    申请号:US11268006

    申请日:2005-11-07

    IPC分类号: G11C11/22

    CPC分类号: G11C11/22 G11C11/4125

    摘要: A static random access memory (SRAM) cell with single event and soft error protection using ferroelectric material is presented. The SRAM cell comprises two inverters in a mutual feedback loop, with the output of each of the inverters coupled to the input of the other. A ferroelectric capacitor is coupled to the output of one of the inverters in order to induce an RC delay and provide single event upset (SEU), single event effect (SEE), single event transient (SET), and soft error protection. In addition, a method is presented where ferroelectric capacitor of the system is fabricated after the underlayers of the SRAM cell have been implemented in order to avoid substantial changes to standard underlayer processing.

    摘要翻译: 介绍了使用铁电材料的单事件和软错误保护的静态随机存取存储器(SRAM)单元。 SRAM单元包括互反馈环路中的两个反相器,每个反相器的输出耦合到另一个的输入端。 铁电电容器耦合到一个逆变器的输出端,以引起RC延迟,并提供单次事件不平衡(SEU),单事件效应(SEE),单事件瞬态(SET)和软错误保护。 另外,在SRAM单元的底层已被实现以避免对标准底层处理的实质性改变之后,制造了系统的铁电电容器的方法。

    Low loss contact structures for silicon based optical modulators and methods of manufacture
    2.
    发明申请
    Low loss contact structures for silicon based optical modulators and methods of manufacture 失效
    用于硅基光学调制器的低损耗接触结构和制造方法

    公开(公告)号:US20050207704A1

    公开(公告)日:2005-09-22

    申请号:US10915607

    申请日:2004-08-10

    摘要: The present invention provides silicon based thin-film structures that can be used to form high frequency optical modulators. Devices of the invention are formed as layered structures that have a thin-film dielectric layer, such as silicon dioxide, sandwiched between silicon layers. In one aspect of the invention an electrical contact structure is provided. The electrical contact structure comprises a connecting portion that electrically connects an active region of at least one of the silicon layers to a contact portion of the electrical contact structure.

    摘要翻译: 本发明提供了可用于形成高频光学调制器的硅基薄膜结构。 本发明的器件形成为具有夹在硅层之间的诸如二氧化硅的薄膜电介质层的分层结构。 在本发明的一个方面,提供一种电接触结构。 电接触结构包括将至少一个硅层的有源区电连接到电接触结构的接触部分的连接部分。

    Heavy Ion Upset Hardened Floating Body SRAM Cells
    3.
    发明申请
    Heavy Ion Upset Hardened Floating Body SRAM Cells 审中-公开
    重离子颠簸硬化浮体SRAM单元

    公开(公告)号:US20100200918A1

    公开(公告)日:2010-08-12

    申请号:US12368880

    申请日:2009-02-10

    IPC分类号: H01L27/11 H01L27/12

    摘要: A CMOS memory element comprising silicon-on-insulator MOSFET transistors is disclosed wherein at least one of the MOSFET transistors is configured such that the body of the transistor is not connected to a voltage source and is instead permitted to electrically float. Implementations of the disclosed memory element with increased immunity to errors caused by heavy ion radiation are also disclosed.

    摘要翻译: 公开了一种包括绝缘体上硅MOSFET晶体管的CMOS存储元件,其中至少一个MOSFET晶体管被配置为使得晶体管的主体不连接到电压源,而是允许电浮动。 还公开了对由重离子辐射引起的误差增加的免疫性的公开的存储元件的实现。

    Planar Metal-Insulator-Metal Circuit Element and Method for Planar Integration of Same
    4.
    发明申请
    Planar Metal-Insulator-Metal Circuit Element and Method for Planar Integration of Same 审中-公开
    平面金属绝缘体 - 金属电路元件及其平面集成方法

    公开(公告)号:US20100006912A1

    公开(公告)日:2010-01-14

    申请号:US12368900

    申请日:2009-02-10

    IPC分类号: H01L29/68 H01L23/52 H01L21/02

    摘要: A complementary metal-oxide-semiconductor (CMOS) static random-access-memory (SRAM) element comprising a planar metal-insulator-metal (MIM) capacitor is disclosed, and the planar MIM capacitor is electrically connected to the transistors in the CMOS memory element to reduce the effects of charged particle radiation on the CMOS memory element. Methods for immunizing a CMOS SRAM element to the effects of charged particle radiation are also disclosed, along with methods for manufacturing CMOS SRAM including planar MIM capacitors as integrated circuits.

    摘要翻译: 公开了包括平面金属 - 绝缘体 - 金属(MIM)电容器的互补金属氧化物半导体(CMOS)静态随机存取存储器(SRAM)元件,并且平面MIM电容器电连接到CMOS存储器中的晶体管 元素,以减少带电粒子辐射对CMOS存储元件的影响。 还公开了将CMOS SRAM元件免受带电粒子辐射的影响的方法,以及用于制造包括平面MIM电容器作为集成电路的CMOS SRAM的方法。

    Semiconductor-insulator-semiconductor structure for high speed applications
    5.
    发明申请
    Semiconductor-insulator-semiconductor structure for high speed applications 审中-公开
    半导体 - 绝缘体 - 半导体结构用于高速应用

    公开(公告)号:US20060063679A1

    公开(公告)日:2006-03-23

    申请号:US11224808

    申请日:2005-09-13

    IPC分类号: H01L39/22

    CPC分类号: G02F1/025

    摘要: A semiconductor-insulator-semiconductor (SIS) device is presented along with a device for fabricating the same. The SIS device includes a lower semiconductor layer, an upper semiconductor layer, and a central insulating layer located between the overlapping portions of the lower semiconductor layer and the upper semiconductor layer. The central insulating layer is nitridized in order to make the layer less permeable to dopant species and to therefore minimize dopant cross-diffusion. Subsequently the switching characteristics of the SIS device are optimized when the SIS device is used as, for example, an integrated optical modulator.

    摘要翻译: 呈现了半导体 - 绝缘体半导体(SIS)器件及其制造装置。 SIS器件包括下半导体层,上半导体层和位于下半导体层和上半导体层的重叠部分之间的中心绝缘层。 将中心绝缘层氮化以使层对掺杂物种类的渗透性较差,从而使掺杂剂交叉扩散最小化。 随后,当SIS器件用作例如集成光调制器时,SIS器件的开关特性被优化。

    Bonded thin-film structures for optical modulators and methods of manufacture
    6.
    发明申请
    Bonded thin-film structures for optical modulators and methods of manufacture 失效
    用于光学调制器的粘结薄膜结构和制造方法

    公开(公告)号:US20050208694A1

    公开(公告)日:2005-09-22

    申请号:US10915081

    申请日:2004-08-10

    CPC分类号: G02F1/025 G02F1/2257

    摘要: The present invention provides silicon based thin-film structures that can be used to form high frequency optical modulators. Devices of the invention are formed as layered structures that have a thin-film dielectric layer, such as silicon dioxide, sandwiched between silicon layers. The silicon layers have high free carrier mobility. In one aspect of the invention a single crystal silicon material is bonded to a thin-film dielectric material to form a silicon-insulator-silicon thin-film structure for an optical modulator.

    摘要翻译: 本发明提供了可用于形成高频光学调制器的硅基薄膜结构。 本发明的器件形成为具有夹在硅层之间的诸如二氧化硅的薄膜电介质层的分层结构。 硅层具有高自由载流子迁移率。 在本发明的一个方面,将单晶硅材料结合到薄膜电介质材料上以形成用于光学调制器的硅 - 绝缘体 - 硅薄膜结构。

    Radiation hardened field oxide for VLSI sub-micron MOS device
    8.
    发明授权
    Radiation hardened field oxide for VLSI sub-micron MOS device 失效
    用于VLSI亚微米MOS器件的辐射硬化场氧化物

    公开(公告)号:US06225178B1

    公开(公告)日:2001-05-01

    申请号:US07466709

    申请日:1990-01-02

    IPC分类号: H01L21336

    CPC分类号: H01L21/76216

    摘要: A process for oxidizing the silicon layer into a device-isolating field oxide having a radiation-hardened reduced bird's beak. An angled and rotated field implant prior to oxidation is used to increase the doping concentration in the edge region of the MOS transistors to compensate for boron leaching during oxidation. The field oxide is grown at a low temperature by high pressure oxidation which increases total dose hardness by making a silicon-rich oxide film.

    摘要翻译: 将硅层氧化成具有辐射硬化的还原鸟喙的装置隔离场氧化物的方法。 在氧化之前使用倾斜和旋转的场注入来增加MOS晶体管的边缘区域中的掺杂浓度,以补偿氧化过程中的硼浸出。 场氧化物通过高压氧化在低温下生长,通过制造富硅氧化物膜来增加总剂量硬度。

    Silicon based optical waveguide structures and methods of manufacture
    9.
    发明申请
    Silicon based optical waveguide structures and methods of manufacture 审中-公开
    基于硅的光波导结构及其制造方法

    公开(公告)号:US20070101927A1

    公开(公告)日:2007-05-10

    申请号:US11271107

    申请日:2005-11-10

    CPC分类号: G02B6/136 G02B6/131 G02B6/132

    摘要: Silicon based thin-film optical waveguides and method of making. A method in accordance with one aspect of the present invention generally comprises the steps of providing a substrate, depositing a thin-film dielectric layer on the substrate, forming a channel in the thin-film dielectric layer, and providing a silicon layer in the channel. The silicon layer provided in the channel can be epitaxially grown in the channel. In another aspect of the present invention, the silicon layer provided in the channel can be provided as an amorphous or partially crystalline material that is subsequently crystallized.

    摘要翻译: 硅基薄膜光波导及其制造方法。 根据本发明的一个方面的方法通常包括以下步骤:提供衬底,在衬底上沉积薄膜电介质层,在薄膜电介质层中形成通道,以及在沟道中提供硅层 。 设置在通道中的硅层可以在通道中外延生长。 在本发明的另一方面,提供在通道中的硅层可以提供为随后结晶的无定形或部分结晶的材料。

    Frontside contact on silicon-on-insulator substrate
    10.
    发明授权
    Frontside contact on silicon-on-insulator substrate 有权
    绝缘体上硅衬底上的前端接触

    公开(公告)号:US06603166B2

    公开(公告)日:2003-08-05

    申请号:US09995400

    申请日:2001-11-27

    IPC分类号: H01L27108

    CPC分类号: H01L21/743 H01L21/7624

    摘要: A method of forming a frontside contact to a Silicon-On-Insulator (SOI) wafer is described. A connection polysilicon connects a silicon substrate layer to a contact plug. This connection provides a means to ground or bias the bottom substrate of the SOI wafer. Spacers may be added to provide additional doping.

    摘要翻译: 描述了向绝缘体上硅(SOI)晶片形成前端接触的方法。 连接多晶硅将硅衬底层连接到接触插塞。 该连接提供了将SOI晶片的底部基板接地或偏置的方法。 可以添加间隔物以提供额外的掺杂。