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    SEMICONDUCTOR PACKAGE
    1.
    发明申请
    SEMICONDUCTOR PACKAGE 审中-公开
    半导体封装

    公开(公告)号：US20130161816A1

    公开(公告)日：2013-06-27

    申请号：US13773896

    申请日：2013-02-22

    Applicant: Chi-Chih Chu ,  Cheng-Yi Weng

    Inventor： Chi-Chih Chu ,  Cheng-Yi Weng

    IPC: H01L23/498

    CPC classification number: H01L23/3128 ,  H01L23/49816 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

    Abstract: The present invention relates to a semiconductor package. The semiconductor package includes a substrate, at least one chip, a plurality of conductive elements, a plurality of first conductors and a molding compound. The substrate has a plurality of first pads and a solder mask. The first pads are exposed to a first surface of the substrate, and the material of the first pads is copper. The solder mask is disposed on the first surface, contacts the first pads directly, and has at least on opening so as to expose part of the first pads. The chip is mounted on the first surface of the substrate. The conductive elements electrically connect the chip and the substrate. The first conductors are disposed on the first pads. The molding compound is disposed on the first surface of the substrate, and encapsulates the chip, the conductive elements and part of the first conductors. Whereby, the solder mask contacts the first pads directly, and thus results in higher bonding strength, so as to avoid the bridge between the first conductors caused by the first conductors permeating into the interface between the solder mask and the first pads.

    Abstract translation: 本发明涉及一种半导体封装。 半导体封装包括衬底，至少一个芯片，多个导电元件，多个第一导体和模制化合物。 基板具有多个第一焊盘和焊接掩模。 第一焊盘暴露于衬底的第一表面，并且第一焊盘的材料是铜。 焊接掩模设置在第一表面上，直接接触第一焊盘，并且至少具有开口以暴露第一焊盘的部分。 芯片安装在基板的第一表面上。 导电元件电连接芯片和基板。 第一导体设置在第一焊盘上。 模塑料配置在基板的第一表面上，并封装芯片，导电元件和第一导体的一部分。 由此，焊接掩模直接接触第一焊盘，从而导致更高的焊接强度，以避免第一导体之间由第一导体渗入焊料掩模和第一焊盘之间的界面引起的桥。

    LED lamp with improved heat sink
    2.
    发明授权
    LED lamp with improved heat sink 失效
    LED灯具具有改善的散热器

    公开(公告)号：US08403542B2

    公开(公告)日：2013-03-26

    申请号：US13004871

    申请日：2011-01-11

    Applicant: Wei-chih Chu

    Inventor： Wei-chih Chu

    IPC: B60Q1/06 ,  F21V29/00 ,  H01J1/02 ,  H01J7/24 ,  H01J61/52 ,  H01K1/58

    CPC classification number: F21V29/006 ,  F21V29/51 ,  F21V29/773 ,  F21V29/80 ,  F21V29/81 ,  F21V29/83 ,  F21Y2115/10

    Abstract: An LED lamp includes a rectifier; an inverted cup shaped heat sink comprising spaced heat radiating members projecting upward, and spaced hollow cylindrical heat radiating elements arranged around the heat radiating members; a mounting plate fastened between the rectifier and the heat radiating members; L-shaped heat conduction members each having a longitudinal part inserted through the heat radiating element and a lateral part engaged with bottom of the heat sink; and a circuit board secured to the bottom of the heat sink to fasten the lateral parts of the heat conduction members, the circuit board comprising LEDs each electrically connected to the rectifier and being in contact with the lateral parts of the heat conduction members. The heat sink further includes first, second, and third heat radiating plates arranged around the heat radiating element.

    Abstract translation: LED灯包括整流器; 倒置的杯形散热器，包括向上突出的间隔开的散热构件，以及布置在散热构件周围的隔开的中空圆柱形散热元件; 紧固在整流器和散热构件之间的安装板; L形导热构件各自具有插入穿过散热元件的纵向部分和与散热器的底部接合的侧部; 以及电路板，其固定到散热器的底部以紧固导热构件的侧部，该电路板包括LED，每个LED电连接到整流器并与导热构件的侧部接触。 散热器还包括围绕热辐射元件布置的第一，第二和第三散热板。

    LED LAMP WITH IMPROVED HEAT SINK
    3.
    发明申请
    LED LAMP WITH IMPROVED HEAT SINK 失效
    LED灯具改善了散热

    公开(公告)号：US20120176032A1

    公开(公告)日：2012-07-12

    申请号：US13004871

    申请日：2011-01-11

    Applicant: Wei-chih Chu

    Inventor： Wei-chih Chu

    IPC: H01K1/62

    CPC classification number: F21V29/006 ,  F21V29/51 ,  F21V29/773 ,  F21V29/80 ,  F21V29/81 ,  F21V29/83 ,  F21Y2115/10

    Abstract: An LED lamp includes a rectifier; an inverted cup shaped heat sink comprising spaced heat radiating members projecting upward, and spaced hollow cylindrical heat radiating elements arranged around the heat radiating members; a mounting plate fastened between the rectifier and the heat radiating members; L-shaped heat conduction members each having a longitudinal part inserted through the heat radiating element and a lateral part engaged with bottom of the heat sink; and a circuit board secured to the bottom of the heat sink to fasten the lateral parts of the heat conduction members, the circuit board comprising LEDs each electrically connected to the rectifier and being in contact with the lateral parts of the heat conduction members. The heat sink further includes first, second, and third heat radiating plates arranged around the heat radiating element.

    Abstract translation: LED灯包括整流器; 倒置的杯形散热器，包括向上突出的间隔开的散热构件，以及布置在散热构件周围的隔开的中空圆柱形散热元件; 紧固在整流器和散热构件之间的安装板; L形导热构件各自具有插入穿过散热元件的纵向部分和与散热器的底部接合的侧部; 以及电路板，其固定到散热器的底部以紧固导热构件的侧部，该电路板包括LED，每个LED电连接到整流器并与导热构件的侧部接触。 散热器还包括围绕热辐射元件布置的第一，第二和第三散热板。

    DC drive
    4.
    发明申请
    DC drive 审中-公开
    直流驱动

    公开(公告)号：US20100118460A1

    公开(公告)日：2010-05-13

    申请号：US12289988

    申请日：2008-11-10

    Applicant: Jian-Shen Li ,  Cheng-Chih Chu ,  Chun-Liang Lin

    Inventor： Jian-Shen Li ,  Cheng-Chih Chu ,  Chun-Liang Lin

    IPC: H02H3/00 ,  G05F5/00

    CPC classification number: H02P7/285

    Abstract: A direct current (DC) drive includes a voltage input unit, a comparing unit, a latch unit and a voltage output unit. The voltage input unit has at least one input terminal and at least one output terminal provides a DC voltage. The comparing unit receives the DC voltage and generates a comparison control signal according to a comparison result obtained by comparing a voltage of a positive voltage terminal with a voltage of a negative voltage terminal. The latch unit is connected to the comparing unit and the voltage input unit. The voltage output unit connected to the latch unit receives the DC voltage from the voltage input unit. The latch unit selectively provides the DC voltage to the voltage output unit according to the comparison control signal.

    Abstract translation: 直流（DC）驱动器包括电压输入单元，比较单元，锁存单元和电压输出单元。 电压输入单元具有至少一个输入端子，并且至少一个输出端子提供直流电压。 比较单元接收DC电压，并根据通过将正电压端子的电压与负电压端子的电压进行比较而获得的比较结果来生成比较控制信号。 闩锁单元连接到比较单元和电压输入单元。 连接到闩锁单元的电压输出单元从电压输入单元接收直流电压。 闩锁单元根据比较控制信号选择性地将电压提供给电压输出单元。

    Structure of a make-up container
    6.
    发明申请
    Structure of a make-up container 审中-公开
    化妆品容器的结构

    公开(公告)号：US20080314405A1

    公开(公告)日：2008-12-25

    申请号：US11812539

    申请日：2007-06-20

    Applicant: Ming-Chih Chu ,  Cheng-Yi Wang

    Inventor： Ming-Chih Chu ,  Cheng-Yi Wang

    IPC: A45D40/26

    CPC classification number: A45D34/04 ,  A45D2200/051 ,  A61H7/003 ,  A61H2201/105 ,  A61H2201/169

    Abstract: A make-up container includes a containing body, a soft application device, a rigid reinforcement element for the soft application device, and a cap; the containing body has an opening, and the reinforcement element is positioned on the opening of the containing body; the application device surrounds and covers an annular portion of the reinforcement element at a base portion thereof therefore the base portion of the application device can't change shape easily even if it is subjected to pressure; the application device and the containing body are joined together so as to be inseparable; the application device has a through hole on one end thereof, which communicates with an inside of the containing body; the cap serves to cover the application device.

    Abstract translation: 一种化妆容器包括容纳体，软涂敷装置，用于软涂敷装置的刚性加强件和帽; 容纳体具有开口，并且加强元件位于容纳体的开口上; 应用装置在其基部围绕并覆盖加强元件的环形部分，因此施加装置的基部即使经受压力也不容易改变形状; 所述应用装置和所述容纳体是不可分离的， 所述应用装置的一端具有与所述容纳体的内部连通的通孔， 盖用于覆盖应用设备。

    Method for preparing a gate oxide layer
    8.
    发明申请
    Method for preparing a gate oxide layer 审中-公开
    制备栅极氧化层的方法

    公开(公告)号：US20070155187A1

    公开(公告)日：2007-07-05

    申请号：US11387888

    申请日：2006-03-24

    Applicant: Chung Chen ,  Chih Chu ,  Jih Chou

    Inventor： Chung Chen ,  Chih Chu ,  Jih Chou

    IPC: H01L21/31 ,  H01L21/469

    CPC classification number: H01L21/7621 ,  H01L21/28211 ,  H01L21/2822 ,  H01L21/28238 ,  H01L21/76213

    Abstract: A method for preparing a gate oxide layer is described. First, a trench surrounding an active area is formed in a substrate, and a dielectric block is then formed in the trench such that an upper surface of the dielectric block is not aligned with that of the substrate. Subsequently, an ion implantation process is performed to implant nitrogen-containing dopants into the substrate in the active area, and a thermal oxidation process is then performed to form a gate oxide layer on the surface of the substrate in the active area. Particularly, the concentration of the nitrogen-containing dopants at the center of the active area is higher than that at the edge of the active area. The nitrogen-containing dopants inhibit the reaction rate of the thermal oxidation process, so as to prevent the gate oxide layer from thinning at the edge near the trench.

    Abstract translation: 描述了制备栅氧化层的方法。 首先，在基板中形成围绕有源区的沟槽，然后在沟槽中形成介质块，使得介质块的上表面与衬底的上表面不一致。 随后，进行离子注入工艺以将含氮掺杂剂注入到有源区域中的衬底中，然后执行热氧化工艺以在有源区域中在衬底的表面上形成栅极氧化层。 特别地，有源区中心的含氮掺杂剂的浓度高于有源区的边缘处的浓度。 含氮掺杂剂抑制热氧化过程的反应速率，以防止栅极氧化层在沟槽附近的边缘变薄。

    Frame and bezel structure for backlight unit
    9.
    发明授权
    Frame and bezel structure for backlight unit 有权
    背光单元的框架和边框结构

    公开(公告)号：US06976781B2

    公开(公告)日：2005-12-20

    申请号：US10446103

    申请日：2003-05-28

    Applicant: Chi-Chih Chu ,  Wen-Yuan Cheng ,  Hui-Kai Chou

    Inventor： Chi-Chih Chu ,  Wen-Yuan Cheng ,  Hui-Kai Chou

    IPC: F21V8/00 ,  F21V7/04

    CPC classification number: G02B6/0088 ,  G02B6/0086

    Abstract: A frame including a first edge and a second edge, wherein on outer surfaces of the first edge, first hooks are formed to protrude outwardly, and on outer surfaces of the second edge, first holes are formed. A bezel has a first sidewall and a second sidewall, wherein on the first sidewall, second holes are formed, and on outer surfaces of the second sidewall, second hooks are formed to protrude outwardly. When the frame is mounted onto the bezel, the first edge is disposed onto inside surfaces of the first sidewall, and the first hooks are inserted and engaged in the second holes for fastening the frame and bezel, simultaneously the second edge is disposed onto the outside surfaces of the second sidewall, and the second hooks are inserted and engaged in the first holes for fastening the frame and the bezel.

    Abstract translation: 一种框架，包括第一边缘和第二边缘，其中在所述第一边缘的外表面上形成有第一钩子向外突出，并且在所述第二边缘的外表面上形成有第一孔。 边框具有第一侧壁和第二侧壁，其中在第一侧壁上形成第二孔，并且在第二侧壁的外表面上形成第二钩向外突出。 当框架安装在边框上时，第一边缘设置在第一侧壁的内表面上，并且第一钩被插入并接合在用于紧固框架和边框的第二孔中，同时第二边缘设置在外侧 第二侧壁的表面和第二钩被插入并接合在用于紧固框架和边框的第一孔中。

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