Abstract:
The present invention relates to a semiconductor package. The semiconductor package includes a substrate, at least one chip, a plurality of conductive elements, a plurality of first conductors and a molding compound. The substrate has a plurality of first pads and a solder mask. The first pads are exposed to a first surface of the substrate, and the material of the first pads is copper. The solder mask is disposed on the first surface, contacts the first pads directly, and has at least on opening so as to expose part of the first pads. The chip is mounted on the first surface of the substrate. The conductive elements electrically connect the chip and the substrate. The first conductors are disposed on the first pads. The molding compound is disposed on the first surface of the substrate, and encapsulates the chip, the conductive elements and part of the first conductors. Whereby, the solder mask contacts the first pads directly, and thus results in higher bonding strength, so as to avoid the bridge between the first conductors caused by the first conductors permeating into the interface between the solder mask and the first pads.
Abstract:
An LED lamp includes a rectifier; an inverted cup shaped heat sink comprising spaced heat radiating members projecting upward, and spaced hollow cylindrical heat radiating elements arranged around the heat radiating members; a mounting plate fastened between the rectifier and the heat radiating members; L-shaped heat conduction members each having a longitudinal part inserted through the heat radiating element and a lateral part engaged with bottom of the heat sink; and a circuit board secured to the bottom of the heat sink to fasten the lateral parts of the heat conduction members, the circuit board comprising LEDs each electrically connected to the rectifier and being in contact with the lateral parts of the heat conduction members. The heat sink further includes first, second, and third heat radiating plates arranged around the heat radiating element.
Abstract:
An LED lamp includes a rectifier; an inverted cup shaped heat sink comprising spaced heat radiating members projecting upward, and spaced hollow cylindrical heat radiating elements arranged around the heat radiating members; a mounting plate fastened between the rectifier and the heat radiating members; L-shaped heat conduction members each having a longitudinal part inserted through the heat radiating element and a lateral part engaged with bottom of the heat sink; and a circuit board secured to the bottom of the heat sink to fasten the lateral parts of the heat conduction members, the circuit board comprising LEDs each electrically connected to the rectifier and being in contact with the lateral parts of the heat conduction members. The heat sink further includes first, second, and third heat radiating plates arranged around the heat radiating element.
Abstract:
A direct current (DC) drive includes a voltage input unit, a comparing unit, a latch unit and a voltage output unit. The voltage input unit has at least one input terminal and at least one output terminal provides a DC voltage. The comparing unit receives the DC voltage and generates a comparison control signal according to a comparison result obtained by comparing a voltage of a positive voltage terminal with a voltage of a negative voltage terminal. The latch unit is connected to the comparing unit and the voltage input unit. The voltage output unit connected to the latch unit receives the DC voltage from the voltage input unit. The latch unit selectively provides the DC voltage to the voltage output unit according to the comparison control signal.
Abstract:
A substrate structure having a solder mask and a process for making the same, including (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. The substrate structure can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.
Abstract:
A make-up container includes a containing body, a soft application device, a rigid reinforcement element for the soft application device, and a cap; the containing body has an opening, and the reinforcement element is positioned on the opening of the containing body; the application device surrounds and covers an annular portion of the reinforcement element at a base portion thereof therefore the base portion of the application device can't change shape easily even if it is subjected to pressure; the application device and the containing body are joined together so as to be inseparable; the application device has a through hole on one end thereof, which communicates with an inside of the containing body; the cap serves to cover the application device.
Abstract:
The present invention relates to a substrate structure having a solder mask and a process for making the same. The process comprises: (a) providing a substrate having a top surface, the top surface having a die pad and a plurality of solder pads; (b) forming a first solder mask on the top surface, the first solder mask having a plurality of openings, each opening corresponding to each solder pad so as to expose at least part of the solder pad; and (c) forming a second solder mask on the first solder mask. Whereby, the substrate structure of the invention can be used for packaging a thicker die so as to prevent the die crack and the overflow of molding compound will be avoided.
Abstract:
A method for preparing a gate oxide layer is described. First, a trench surrounding an active area is formed in a substrate, and a dielectric block is then formed in the trench such that an upper surface of the dielectric block is not aligned with that of the substrate. Subsequently, an ion implantation process is performed to implant nitrogen-containing dopants into the substrate in the active area, and a thermal oxidation process is then performed to form a gate oxide layer on the surface of the substrate in the active area. Particularly, the concentration of the nitrogen-containing dopants at the center of the active area is higher than that at the edge of the active area. The nitrogen-containing dopants inhibit the reaction rate of the thermal oxidation process, so as to prevent the gate oxide layer from thinning at the edge near the trench.
Abstract:
A frame including a first edge and a second edge, wherein on outer surfaces of the first edge, first hooks are formed to protrude outwardly, and on outer surfaces of the second edge, first holes are formed. A bezel has a first sidewall and a second sidewall, wherein on the first sidewall, second holes are formed, and on outer surfaces of the second sidewall, second hooks are formed to protrude outwardly. When the frame is mounted onto the bezel, the first edge is disposed onto inside surfaces of the first sidewall, and the first hooks are inserted and engaged in the second holes for fastening the frame and bezel, simultaneously the second edge is disposed onto the outside surfaces of the second sidewall, and the second hooks are inserted and engaged in the first holes for fastening the frame and the bezel.