公开(公告)号：US20080259752A1

公开(公告)日：2008-10-23

申请号：US11738551

申请日：2007-04-23

Applicant: Te-Wang Tseng ,  Chih-Chiang Chu

Inventor： Te-Wang Tseng ,  Chih-Chiang Chu

IPC: G11B5/09

CPC classification number: G11B20/1816 ,  G11B2220/2537

Abstract: An optical disc drive and method thereof. The optical disc drive comprises a rotating means, an optical pickup head, a servo unit, and a controller. The rotating means rotates an optical disc. The optical pickup head generates an optical beam to detect defects in a predetermined range on the optical disc. The servo unit, coupled to the optical pickup head, is responsive to an operating parameter to control the optical pickup head. The controller, coupled to the optical pickup head and the servo unit, identifies a defect type based on the defect detection result; and determines the operating parameter of the servo unit according to the defect type.

Abstract translation: 一种光盘驱动器及其方法。 光盘驱动器包括旋转装置，光学拾取头，伺服单元和控制器。 旋转装置旋转光盘。 光学拾取头产生光束以检测光盘上的预定范围内的缺陷。 耦合到光学拾取头的伺服单元响应于操作参数来控制光学拾取头。 耦合到光学拾取头和伺服单元的控制器基于缺陷检测结果识别缺陷类型; 并根据缺陷类型确定伺服单元的运行参数。

公开(公告)号：US5431328A

公开(公告)日：1995-07-11

申请号：US239380

申请日：1994-05-06

Applicant: Shyh-Ming Chang ,  Chih-Chiang Chu ,  Yu-Chi Lee

Inventor： Shyh-Ming Chang ,  Chih-Chiang Chu ,  Yu-Chi Lee

IPC: H01L21/60 ,  H01L23/485 ,  H05K3/34

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H05K3/3436 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K2201/0212 ,  H05K3/3431 ,  Y02P70/613

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.

Abstract translation: 一种结合结构，其包括使用由低杨氏模量的单一聚合物主体组成的复合凸块的集成电路元件和基板之间的物理和电连接，覆盖聚合物主体的导电阻挡金属涂层和覆盖导电阻挡金属的焊接金属涂层 涂层。 当形成接合结构时，复合凸块变形，并且聚合物主体的低杨氏模量允许具有非常低的结合力的非常可靠的结合结构。 由于低的杨氏模量，在结合结构形成之后，很少有应力打破焊点。 使用焊接工艺形成接合，使得焊接金属在复合凸块与衬底输入/输出焊盘或集成电路元件输入/输出焊盘之间形成导电粘合剂。

公开(公告)号：US07800992B2

公开(公告)日：2010-09-21

申请号：US11738551

申请日：2007-04-23

Applicant: Te-Wang Tseng ,  Chih-Chiang Chu

Inventor： Te-Wang Tseng ,  Chih-Chiang Chu

IPC: G11B7/00 ,  G11B27/36

CPC classification number: G11B20/1816 ,  G11B2220/2537

Abstract: An optical disc drive and method thereof. The optical disc drive comprises a rotating means, an optical pickup head, a servo unit, and a controller. The rotating means rotates an optical disc. The optical pickup head generates an optical beam to detect defects in a predetermined range on the optical disc. The servo unit, coupled to the optical pickup head, is responsive to an operating parameter to control the optical pickup head. The controller, coupled to the optical pickup head and the servo unit, identifies a defect type based on the defect detection result; and determines the operating parameter of the servo unit according to the defect type.

Abstract translation: 一种光盘驱动器及其方法。 光盘驱动器包括旋转装置，光学拾取头，伺服单元和控制器。 旋转装置旋转光盘。 光学拾取头产生光束以检测光盘上的预定范围内的缺陷。 耦合到光学拾取头的伺服单元响应于操作参数来控制光学拾取头。 耦合到光学拾取头和伺服单元的控制器基于缺陷检测结果识别缺陷类型; 并根据缺陷类型确定伺服单元的运行参数。

公开(公告)号：US06249051B1

公开(公告)日：2001-06-19

申请号：US08428775

申请日：1995-04-24

Applicant: Shyh-Ming Chang ,  Chih-Chiang Chu ,  Yu-Chi Lee

Inventor： Shyh-Ming Chang ,  Chih-Chiang Chu ,  Yu-Chi Lee

IPC: H01L2352

CPC classification number: H01L24/10 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05164 ,  H01L2224/05166 ,  H01L2224/05169 ,  H01L2224/05171 ,  H01L2224/05184 ,  H01L2224/05644 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3431 ,  H05K3/3436 ,  H05K2201/0212 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A bonded structure comprising the physical and electrical connections between an integrated circuit element and substrate using a composite bump comprised of a single polymer body of low Young's Modulus, a conductive barrier metal coating covering the polymer body and a soldering metal coating covering the conductive barrier metal coating. When the bonded structure is formed the composite bump is deformed and the low Young's Modulus of the polymer body allows a very reliable bonded structure with very low bonding force. Due to the low Young's Modulus there is little stress tending to break the solder joint after the bonded structure is formed. The bond is formed using a soldering process so that the soldering metal forms a conductive adhesive between the composite bumps and either the substrate input/output pads or the integrated circuit element input/output pads.

Abstract translation: 一种结合结构，其包括使用由低杨氏模量的单一聚合物主体组成的复合凸块的集成电路元件和基板之间的物理和电连接，覆盖聚合物主体的导电阻挡金属涂层和覆盖导电阻挡金属的焊接金属涂层 涂层。 当形成接合结构时，复合凸块变形，并且聚合物主体的低杨氏模量允许具有非常低的结合力的非常可靠的结合结构。 由于低的杨氏模量，在结合结构形成之后，很少有应力打破焊点。 使用焊接工艺形成接合，使得焊接金属在复合凸块与衬底输入/输出焊盘或集成电路元件输入/输出焊盘之间形成导电粘合剂。