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公开(公告)号:US20110105183A1
公开(公告)日:2011-05-05
申请号:US12851249
申请日:2010-08-05
申请人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
发明人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
IPC分类号: G06Q40/00 , G06K19/073 , H04W88/02
CPC分类号: G06Q20/349 , G06Q20/32 , G06Q20/322 , G06Q20/3226 , G06Q20/3229 , G06Q20/353 , G06Q20/36 , G06Q20/363 , G06Q20/3672 , G07F7/0886
摘要: The present invention provides an electronic wallet device for a mobile phone comprising a SIM card interface, comprising: a processing unit configured to provide a top-up service interface to the mobile phone and to receive and convert a first transaction instruction from the mobile phone into a top-up instruction; an authentication unit provided with an electronic wallet and configured to receive and convert the top-up instruction into an authorized top-up instruction and to write an amount to the electronic wallet according to the authorized top-up instruction; and an NFC antenna electrically connected to the authentication unit.
摘要翻译: 本发明提供了一种用于移动电话的电子钱包装置,包括SIM卡接口,包括:处理单元,被配置为向移动电话提供补充服务接口,并且将来自移动电话的第一交易指令接收并转换成 补充说明; 设置有电子钱包并被配置为接收并将充值指令转换为授权充值指令并根据授权充值指令向电子钱包写入数量的认证单元; 以及电连接到认证单元的NFC天线。
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公开(公告)号:US20100190528A1
公开(公告)日:2010-07-29
申请号:US12691922
申请日:2010-01-22
申请人: Feng-Chi Hsiao , Kun-Shan Yang , Tung-Fu Lin , Chin-Fen Cheng , Chih-Wei Lee
发明人: Feng-Chi Hsiao , Kun-Shan Yang , Tung-Fu Lin , Chin-Fen Cheng , Chih-Wei Lee
CPC分类号: G06K19/077 , G06K19/041 , G06K19/07739 , G06K19/07743 , G06K19/07749 , G06K19/07769 , H04B1/3816 , H05K1/028 , H05K1/0281 , H05K3/0064 , H05K2201/0116 , H05K2201/055 , H05K2201/056 , H05K2201/10037
摘要: The present disclosure provides a signal processing device comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate, one side surface thereof being provided with at least an integrated circuit or an antenna; and a first connecting portion for connecting the first and second substrates; wherein the second and fourth contacts are electrically connected to the integrated circuit or antenna via the first connecting portion.
摘要翻译: 本公开提供一种信号处理装置,包括:第一基板,其一个侧表面设置有至少第一触点和第二触点,而另一个侧表面设置有至少第三触点和第四触点, 是第一和第三触点之间的电连接; 第二基板,其一个侧表面至少设置有集成电路或天线; 以及用于连接第一和第二基板的第一连接部分; 其中所述第二和第四触点经由所述第一连接部分电连接到所述集成电路或天线。
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公开(公告)号:US20110065476A1
公开(公告)日:2011-03-17
申请号:US12883920
申请日:2010-09-16
申请人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
发明人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
CPC分类号: H01Q1/38 , G06K7/10237 , H01Q1/2283 , H01Q1/243 , H01Q7/00 , H04B1/3816
摘要: The present invention provides an antenna device comprising: a contact substrate with a plurality of electrical contacts, an antenna substrate, and a connecting member connected between said contact substrate and said antenna substrate. Said connecting member is flexible and foldable and is provided with at least one corner portion. Said corner portion defines at least one horizontal section and at least one vertical section to render the antenna device better adaptability.
摘要翻译: 本发明提供一种天线装置,包括:具有多个电触头的接触基板,天线基板,以及连接在所述接触基板和所述天线基板之间的连接部件。 所述连接构件是柔性的和可折叠的,并且设置有至少一个角部。 所述角部分限定至少一个水平部分和至少一个垂直部分,以使天线装置更好的适应性。
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公开(公告)号:US08649184B2
公开(公告)日:2014-02-11
申请号:US12787978
申请日:2010-05-26
申请人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
发明人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
IPC分类号: H05K1/11
CPC分类号: H05K1/14 , G06K7/10237 , G06K19/072 , G06K19/07741 , G06K19/07749 , G06K19/07769
摘要: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.
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公开(公告)号:US20100259904A1
公开(公告)日:2010-10-14
申请号:US12759223
申请日:2010-04-13
申请人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
发明人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
IPC分类号: H05K1/18
CPC分类号: G06K19/0719 , G06K19/07741 , G06K19/07743 , H01L23/3121 , H01L2924/0002 , H01L2924/00
摘要: The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.
摘要翻译: 本发明提供了一种信号转换装置,包括:具有第一表面和第二表面的基底,所述第一表面设置有包括至少第一触点和第二触点的第一接触区域,而所述第二表面设置有第二触点 接触区域包括至少第三触点和第四触点; 其中在第一和第三触点之间存在电连接,并且第二和第四触点电连接到使用晶片级芯片级封装(WLCSP)或芯片上膜(COF)技术制造的IC,并且其中IC被布置 在第一表面或第二表面。
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公开(公告)号:US08422238B2
公开(公告)日:2013-04-16
申请号:US12759223
申请日:2010-04-13
申请人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
发明人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
CPC分类号: G06K19/0719 , G06K19/07741 , G06K19/07743 , H01L23/3121 , H01L2924/0002 , H01L2924/00
摘要: The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.
摘要翻译: 本发明提供了一种信号转换装置,包括:具有第一表面和第二表面的基底,所述第一表面设置有包括至少第一触点和第二触点的第一接触区域,而所述第二表面设置有第二触点 接触区域包括至少第三触点和第四触点; 其中在第一和第三触点之间存在电连接,并且第二和第四触点电连接到使用晶片级芯片级封装(WLCSP)或芯片上膜(COF)技术制造的IC,并且其中IC被布置 在第一表面或第二表面。
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公开(公告)号:US20100309642A1
公开(公告)日:2010-12-09
申请号:US12787978
申请日:2010-05-26
申请人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
发明人: Feng Chi Hsiao , Kun Shan Yang , Tung Fu Lin , Chin Fen Cheng , Chih Wei Lee
IPC分类号: H05K1/14
CPC分类号: H05K1/14 , G06K7/10237 , G06K19/072 , G06K19/07741 , G06K19/07749 , G06K19/07769
摘要: The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.
摘要翻译: 本发明提供一种双芯片信号转换装置,包括:载体,其一个侧表面设置有至少第一触点和第二触点,而另一个侧表面设置有至少第三触点和第四触点 ; 第一芯片,设置在所述载体的一个侧表面处并电连接到所述第二和第四触点; 第二芯片,设置在所述载体的一个侧表面处并电连接到所述第一芯片; 以及设置在所述载体内并电连接到所述第二芯片的天线。
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