摘要:
An antenna structure consists of a substrate, a radiation element, a signal feeding element, and a grounding element. The radiation element includes a first radiator and a second radiator coupled to the first radiator, wherein the first radiator is identical to the second radiator. The signal feeding element is coupled to a joint of the first radiator and the second radiator, wherein the first radiator and the second radiator are symmetrically disposed in the left and right sides of the signal feeding element to permute an array. The grounding element includes a first grounding sub-element and a second grounding sub-element, wherein the first grounding sub-element is coupled between the first radiator and the substrate and the second grounding sub-element is coupled between the second radiator and the substrate. The first grounding sub-element is identical to the second grounding sub-element.
摘要:
The present invention provides an electronic wallet device for a mobile phone comprising a SIM card interface, comprising: a processing unit configured to provide a top-up service interface to the mobile phone and to receive and convert a first transaction instruction from the mobile phone into a top-up instruction; an authentication unit provided with an electronic wallet and configured to receive and convert the top-up instruction into an authorized top-up instruction and to write an amount to the electronic wallet according to the authorized top-up instruction; and an NFC antenna electrically connected to the authentication unit.
摘要:
The present disclosure provides a signal processing device comprising: a first substrate, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact, there being an electrical connection between the first and third contacts; a second substrate, one side surface thereof being provided with at least an integrated circuit or an antenna; and a first connecting portion for connecting the first and second substrates; wherein the second and fourth contacts are electrically connected to the integrated circuit or antenna via the first connecting portion.
摘要:
A high temperature test system is adapted for testing a device under test (DUT) under a high temperature environment. The high temperature test system includes a preheating unit, a first moving unit, a testing unit, and a second moving unit. The preheating unit is adapted for preheating the DUT. The first moving unit is adapted for removing the preheated DUT from the preheating unit. The testing unit is adapted for placement of the DUT removed by the first moving unit, for testing the DUT, and for providing the high temperature environment to the DUT during testing. The second moving unit is adapted for removing the DUT that has passed testing from the testing unit.
摘要:
A method of programming a first cell in a memory, wherein the first cell has a first S/D region and shares a second S/D region with a second cell that has a third S/D region opposite to the second S/D region. The channels of the first and the second cells are turned on, a first voltage is applied to the first S/D region, a second voltage is applied to the second S/D region and a third voltage is applied to the third S/D region. The second voltage is between the first voltage and the third voltage, and the first to third voltages make carriers flow from the third S/D region to the first S/ID region and cause hot carriers in the channel of the first cell to be injected into the charge storage layer of the first cell.
摘要:
The present invention provides a dual chip signal conversion device, comprising: a carrier, one side surface thereof being provided with at least a first contact and a second contact while the other side surface thereof being provided with at least a third contact and a fourth contact; a first chip disposed at one side surface of the carrier and electrically connected to the second and fourth contacts; a second chip disposed at one side surface of the carrier and electrically connected to the first chip; and an antenna disposed within the carrier and electrically connected to the second chip.
摘要:
The present invention provides a signal conversion device comprising: a substrate having a first surface and a second surface, the first surface being provided with a first contact region comprising at least a first contact and a second contact while the second surface being provided with a second contact region comprising at least a third contact and a fourth contact; wherein there is an electrical connection between the first and third contacts, and the second and fourth contacts are electrically connected to an IC fabricated using Wafer Level Chip Scale Package (WLCSP) or Chip On Film (COF) technology, and wherein the IC is disposed at the first surface or the second surface.
摘要:
A HDD tray structure is disclosed. The HDD tray structure includes a tray housing, a flexible printed circuit board (FPC) installed on the tray housing, and at least one indicator, wherein one end of the FPC has a metal pad electrically connected to a connector of a printed circuit board, and the other end of the FPC is in electrical contact with the indicator, so as to control the on/off state of the indicator.
摘要:
A method of fabricating circuitry without conductive circles has steps of providing a plate with multiple apertures defined therein, the plate and inner walls of the apertures are coated with a copper layer; the copper layers are coated with a photoresist layer, which is then covered with a protective film; partly removing the photoresist layer at the apertures; removing the protective film to expose the photoresist layer; electroplating the inner walls of the apertures with copper; exposing and developing the photoresist layers; and finally, etching the copper layers to form a circuit pattern without any conductive circles.
摘要:
An automatic retractable device of a flexible printed circuit board is described. The automatic retractable device of the flexible printed circuit board comprises a bracket, two elastic components and two rollers. By combining the elastic components, the rollers and the flexible printed circuit board, the flexible printed circuit board can revert to an original position after the flexible printed circuit board is used.