Abstract:
A method and system is disclosed for processing one or more oblique features on a mask or reticle substrate. After aligning the mask or reticle substrate with a predetermined reference system, an offset angle of a feature to be processed on the mask or reticle substrate with regard to either the horizontal or vertical reference direction of the predetermined reference system is determined. The mask or reticle substrate is rotated in a predetermined direction by the offset angle; and the feature on the mask or reticle substrate is processed using the predetermined reference system wherein the feature is processed in either the horizontal or vertical reference direction thereof.
Abstract:
A photolithography mask critical dimension metrology system is provided. The system includes a radiation source, a holder operable to securely hold at least one mask oriented to receive radiation emitted from the radiation source, a projection system operable to direct radiation passing through the at least one mask, and an image capture system operable to receive radiation directed by the projection system and capture a projected image of the at least one mask.
Abstract:
A system comprising a radiation source, a holder operable to securely hold at least one mask oriented to receive radiation emitted from the radiation source, a projection system operable to direct radiation passing through the at least one mask, and an image capture system operable to receive radiation directed by the projection system and capture a projected image of the at least one mask.