公开(公告)号：US10784221B2

公开(公告)日：2020-09-22

申请号：US13312395

申请日：2011-12-06

申请人： Hsiu-Jen Lin ,  Chung-Shi Liu ,  Ming-Da Cheng ,  Chung-Cheng Lin ,  Yu-Peng Tsai ,  Cheng-Ting Chen

发明人： Hsiu-Jen Lin ,  Chung-Shi Liu ,  Ming-Da Cheng ,  Chung-Cheng Lin ,  Yu-Peng Tsai ,  Cheng-Ting Chen

IPC分类号： H01L21/58 ,  H01L23/00 ,  H05K3/34 ,  H05K3/28 ,  H01L21/48

摘要： A method includes vacuum annealing on a substrate having at least one solder bump to reduce voids at an interface of the at least one solder bump. A die is mounted over the substrate.

公开(公告)号：US20130274092A1

公开(公告)日：2013-10-17

申请号：US13614455

申请日：2012-09-13

申请人： Chung-Cheng LIN ,  Meng--Hsin Chen ,  Jen-Chun Chiu ,  Chih-Hsiang Lin

发明人： Chung-Cheng LIN ,  Meng--Hsin Chen ,  Jen-Chun Chiu ,  Chih-Hsiang Lin

IPC分类号： C08F4/46 ,  C08F4/42

CPC分类号： C08G63/83 ,  C08G63/85

摘要： The disclosure provides a catalyst composition, including: a metal or metal compound; and an organic diacid metal salt. The metal includes titanium (Ti), stibium (Sb) or combinations thereof and the metal compound includes antimony oxide (Sb2O3) or tetra-n-butoxy titanium (TBT). The catalyst composition includes about 0.3-6 wt % of the metal or metal compound and about 94-99.7 wt % of the organic diacid metal salt.

摘要翻译： 本公开提供了一种催化剂组合物，包括：金属或金属化合物; 和有机二酸金属盐。 金属包括钛（Ti），锑（Sb）或其组合，金属化合物包括氧化锑（Sb 2 O 3）或四正丁氧基钛（TBT）。 催化剂组合物包含约0.3-6重量％的金属或金属化合物和约94-99.7重量％的有机二酸金属盐。

公开(公告)号：US20050247859A1

公开(公告)日：2005-11-10

申请号：US11181935

申请日：2005-07-15

申请人： Chih-Ming Hsu ,  Chung-Cheng Lin ,  Chin-Ting Lee

发明人： Chih-Ming Hsu ,  Chung-Cheng Lin ,  Chin-Ting Lee

IPC分类号： H01L25/18 ,  H01L27/00 ,  H01L31/0203

CPC分类号： H01L31/0203 ,  H01L25/18 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/48225 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2225/06558 ,  H01L2225/06568

摘要： The present invention discloses a package structure of a stack-type light-sensing element and a package method thereof, wherein firstly, a substrate is provided; next, a signal-processing IC chip and a light-sensing chip are sequentially stacked above the substrate in bottom-up sequence; next, lead lines are used to electrically connect the substrate with the signal-processing IC chip and the light-sensing chip in order to form a unitary light-sensing element. The present invention has the advantages that light-sensor signals are directly processed and then output to a display device, and that the volume of a light-sensing element can be reduced to such an extent that it can be easily applied to miniature electronic products. In contrast with the conventional light-sensing element needing massive volume of electronic circuits to process signal and also needing minute and complicated assemblage, the present invention has superior novelty and futurity.

摘要翻译： 本发明公开了一种堆叠型感光元件的封装结构及其封装方法，首先，提供衬底; 接下来，信号处理IC芯片和感光芯片按顺序堆叠在基板上方; 接下来，引线用于将基板与信号处理IC芯片和感光芯片电连接，以形成单一的光感测元件。 本发明的优点是光传感器信号被直接处理，然后输出到显示装置，并且光​​感测元件的体积可以减小到可以容易地应用于微型电子产品的程度。 与需要大量电子电路处理信号并且还需要微小和复杂的组合的常规光感测元件相反，本发明具有优越的新颖性和未来。

公开(公告)号：US20060131010A1

公开(公告)日：2006-06-22

申请号：US11218630

申请日：2005-09-06

申请人： Chih-Ming Hsu ,  Chung-Cheng Lin ,  Chin-Ting Lee

发明人： Chih-Ming Hsu ,  Chung-Cheng Lin ,  Chin-Ting Lee

IPC分类号： H05K7/20

CPC分类号： H05K7/205 ,  H01L23/3735 ,  H01L33/641 ,  H01L2924/0002 ,  H01L2924/00

摘要： The present invention provides a heat dissipating assembly for a heat element comprising a board on which at least a heat source, heat conductive layer and a heat dissipating sheet are set. The heat conductive layer is formed between the heat dissipating sheet and the board by squeeze bonding, thermal fusion or ultrasonic fusion. The heat conductive layer is made up of a material possessing the properties of quick heat conduction and compressive flexibility. While the heat conductive layer is adhered by squeeze bonding, thermal fusion or ultrasonic fusion, heat is conducted by its entire surface. The present invention is able to raise the heat dissipating efficacy and draw out the heat from the heat source quickly, therefore, increases the brightness and durability of the light source.

摘要翻译： 本发明提供了一种用于热元件的散热组件，其包括至少设置有热源，导热层和散热片的板。 通过挤压接合，热熔融或超声波融合，在散热片和板之间形成导热层。 导热层由具有快速导热性和压缩柔韧性的材料构成。 当通过挤压接合，热熔融或超声波熔融来粘合导热层时，其整个表面进行热传导。 本发明能够提高散热效能，并且快速地从热源引出热量，从而提高光源的亮度和耐久性。

公开(公告)号：US4834278A

公开(公告)日：1989-05-30

申请号：US194264

申请日：1988-05-16

申请人： Chung-Cheng Lin

发明人： Chung-Cheng Lin

IPC分类号： B25C1/06

CPC分类号： B25C1/06

摘要： The principle of the present invention is to turn an electric power to a mechanical power and to make use of a mechanical mechanism to control the action of stapling and the opening of position switch with the arrangement of a thermo breaker and a LED to detect power source and to give alarm signal at time of shortage of power.

摘要翻译： 本发明的原理是将电力转换成机械动力并利用机械机构来控制装订动作和位置开关的打开，并配置热断路器和LED以检测电源 并在发电不足的时候发出报警信号。

公开(公告)号：US5944410A

公开(公告)日：1999-08-31

申请号：US122886

申请日：1998-07-28

申请人： Wen-Bin Chiou ,  Chung-Cheng Lin ,  Kuo-Fu Hsu ,  Rong-Yih Hwang ,  Tzer-Perng Chen

发明人： Wen-Bin Chiou ,  Chung-Cheng Lin ,  Kuo-Fu Hsu ,  Rong-Yih Hwang ,  Tzer-Perng Chen

IPC分类号： G02B27/20 ,  F21K7/00

CPC分类号： G02B27/20

摘要： An improved structure of a laser indicator includes an outer tube, a cover cap, a focus adjusting device, an optical lens, and a circuit board having a laser diode disposed thereon. The outer tube and the cover cap are joined to form a rod-shaped indicator housing. The optical lens and the laser diode are provided inside the focus adjusting device, which is comprised of an inner cover and an outer cover working in conjunction with a metallic spring. The laser diode is fittingly disposed inside the inner cover, while the outer cover is screwably connected to the outer cover. The spring is disposed between the inner cover and the optical lens. One end of the outer cover is screwably coupled to the cover cap, while the other end thereof forms a smooth holding surface to facilitate turning of the outer cover in focus adjustment. The arrangement of the spring ensures the positioning of the optical lens and forms a bridge for the conduction of electric currents between the outer and inner covers, thereby avoiding the problem that the inner cover is isolated from the outer tube after it is coated with a fixing glue.

摘要翻译： 激光指示器的改进的结构包括外管，盖帽，聚焦调节装置，光学透镜以及设置有激光二极管的电路板。 外管和盖帽接合形成一个杆状的指示器外壳。 光学透镜和激光二极管设置在聚焦调节装置内部，该调焦装置由内盖和与金属弹簧一起工作的外盖组成。 激光二极管适配地设置在内盖的内部，而外盖可旋转地连接到外盖。 弹簧设置在内盖和光学透镜之间。 外盖的一端可旋转地联接到盖帽，而其另一端形成平滑的保持表面，以便于外盖在聚焦调节中的转动。 弹簧的布置确保光学透镜的定位，并形成用于在外盖和内盖之间传导电流的桥，从而避免了内盖在涂覆固定之后与外管隔离的问题 胶。