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公开(公告)号：US4810318A
公开(公告)日：1989-03-07
申请号：US11416
申请日：1987-02-03
IPC分类号： C04B37/00 , B32B7/04 , C03C27/06 , C03C27/10 , C09J5/00 , C09J5/02 , G02B1/10 , G02B5/00 , G02B5/08 , G02B5/28 , G02B5/30 , B32B31/00
CPC分类号： B32B7/04 , C03C27/06 , Y10T156/10 , Y10T29/49885
摘要： By means of a method of bonding a first part and a second part together, in which at least one thin layer is provided on at least one of the parts and is activated by a slight polishing treatment, after which the likewise activated surface of the second part is bonded to the activated surface of the first part by mechanical wringing, a rigid bond can be obtained in which the spacing between the parts can be accurately adjusted.
摘要翻译： 通过将第一部分和第二部分结合在一起的方法，其中在至少一个部分上提供至少一个薄层，并通过轻微的抛光处理而被激活，之后第二部分和第二部分的同样激活的表面 部分通过机械拧紧与第一部分的活化表面接合，可以获得刚性接合，其中可以精确地调节部件之间的间距。
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公开(公告)号：US4391622A
公开(公告)日：1983-07-05
申请号：US264738
申请日：1981-05-18
申请人： Cornelis L. Alting , Rudolf Brehm , Jan Haisma
发明人： Cornelis L. Alting , Rudolf Brehm , Jan Haisma
CPC分类号： C03B11/084 , C03B2215/05 , C03B2215/76
摘要： By using special dies, lenses from glass can be manufactured with great precision. Such dies are manufactured from quartz glass. Quartz glass can be worked with the required shape accuracy and the required smoothness, for example, by a polishing treatment succeeded by sputtering.
摘要翻译： 通过使用特殊的模具，可以精确地制造来自玻璃的透镜。 这种模具由石英玻璃制成。 石英玻璃可以以所需的形状精度和所需的平滑度加工，例如通过溅射成功进行抛光处理。
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公开(公告)号：US5009689A
公开(公告)日：1991-04-23
申请号：US7153
申请日：1987-01-27
IPC分类号： H01L27/00 , H01L21/20 , H01L21/268 , H01L21/31
CPC分类号： H01L21/268 , H01L21/2007
摘要： In a method of manufacturing a semiconductor device, at least a support body (1) and a monocrystalline semiconductor body (2) are provided with at least one flat optically smooth surface obtained by means of bulk-reducing polishing (mirror polishing), while at least the semiconductor body is provided at the optically smooth surface with an oxide layer (3). The two bodies (1 and 2) are brought into contact with each other in a dust-free atmosphere after their flat surfaces have been cleaned in order to obtain a mechanical connection. Before the bodies are brought into contact with each other, at least the oxide layer (3) on the semiconductor body (2) is subjected to a bonding-activating operation, while after a connection has been formed between the surfaces, radiation (5) of a laser is focused on the connection surface of the two bodies and material of at least the semiconductor body is molten locally near the connection surface by means of the laser radiation. After solidification, a locally fused connection has been established between the two bodies. The semiconductor body (2) is formed from a material admitting a sufficient oxygen diffusion.
摘要翻译： 在制造半导体器件的方法中，至少一个支撑体（1）和单晶体半导体本体（2）设置有至少一个通过大量减少抛光（镜面抛光）获得的平坦的光学光滑表面，而在 至少半导体体在光学平滑表面上设置有氧化物层（3）。 为了获得机械连接，两个主体（1和2）在其平坦表面被清洁之后在无尘环境中彼此接触。 在物体彼此接触之前，至少在半导体主体（2）上的氧化物层（3）进行接合激活操作，而在表面之间形成连接之后，辐射（5） 激光的焦点集中在两个主体的连接表面上，并且至少半导体主体的材料通过激光辐射局部地熔融在连接表面附近。 凝固后，两个体之间建立了局部融合的连接。 半导体本体（2）由承受足够的氧扩散的材料形成。
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公开(公告)号：US4780899A
公开(公告)日：1988-10-25
申请号：US852051
申请日：1986-04-15
CPC分类号： G21K1/06 , G21K2201/062 , G21K2201/067
摘要： A crystal for an X-ray analysis apparatus is mounted on a carrier of an amorphous material whose bonding surface preferably obtains its desired geometry by grinding and polishing. Using a suitably transparent carrier, use can be made of a UV-curable type of adhesive which is irradiated through the carrier. The thickness of the layer of glue can be checked, if desired, via the same path. Because no disturbing background radiation is generated by an amorphous carrier, local irregularities are avoided, and better thermal adaptation of carrier and crystal material is feasible, such a crystal will contribute to a substantially higher resolution when used in an X-ray analysis apparatus.
摘要翻译： 用于X射线分析装置的晶体安装在非晶材料的载体上，其结合面优选通过研磨和抛光获得所需的几何形状。 使用适当透明的载体，可以使用通过载体照射的可UV固化型粘合剂。 如果需要，可以通过相同的路径检查胶层的厚度。 由于无定形载体不产生干扰背景辐射，因此避免了局部不规则，并且载体和晶体材料的热适应性更好，这样的晶体在X射线分析装置中使用时会有更高的分辨率。
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