公开(公告)号：US20130207071A1

公开(公告)日：2013-08-15

申请号：US13584689

申请日：2012-08-13

申请人： Wen-Fei Fong ,  Der-Lin Hsia

发明人： Wen-Fei Fong ,  Der-Lin Hsia

IPC分类号： H01L33/04

CPC分类号： H01L27/156 ,  H01L24/24 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

摘要： A light emitting diode (LED) array includes a substrate with an array having a plurality of LED chips thereon, a dielectric layer, a plug, and a conductive connection layer. Each of the LED chips is isolated from another LED chip adjacent thereto by a trench. The dielectric layer covers a surface of the substrate exposed by the trench and sidewalls and partial surfaces of the LED chips adjacent to the trench. The plug fills the trench. The conductive connection layer is disposed over the plug and the dielectric layer to connect the LED chips with the LED chips adjacent thereto. Radiation emitted from one of the LED chips can be reflected by the dielectric layer and the plug, and finally reflected and output from a side of the LED chip not adjacent to the trench, thereby not affecting the adjacent LED chip and being absorbed by it.

摘要翻译： 发光二极管（LED）阵列包括具有其上具有多个LED芯片的阵列的基板，介电层，插头和导电连接层。 每个LED芯片通过沟槽与其相邻的另一LED芯片隔离。 电介质层覆盖由沟槽暴露的衬底的表面，并且邻近沟槽的LED芯片的侧壁和部分表面。 插头填充沟槽。 导电连接层设置在插头和电介质层之上，以将LED芯片与与其相邻的LED芯片连接。 从一个LED芯片发射的辐射可以被电介质层和插塞反射，最后从LED芯片的不与沟槽相邻的一侧反射和输出，从而不影响相邻的LED芯片并被其吸收。

公开(公告)号：US20130026491A1

公开(公告)日：2013-01-31

申请号：US13241563

申请日：2011-09-23

申请人： CHENG-HUNG CHEN ,  DER-LIN HSIA ,  CHIA-HUNG HOU

发明人： CHENG-HUNG CHEN ,  DER-LIN HSIA ,  CHIA-HUNG HOU

IPC分类号： H01L33/02 ,  H01L33/60

CPC分类号： H01L33/46 ,  H01L33/007 ,  H01L33/10 ,  H01L33/20

摘要： The present invention discloses a LED structure and a method for manufacturing the LED structure. The LED structure includes a substrate, a reflection layer, a first conducting layer, a light emitting layer, and a second conducting layer. The substrate has a plurality of grooves, and the reflection layer is disposed inside the plurality of grooves. The reflection layer is formed as a reflection block inside each of the grooves. The first conducting layer is disposed on the substrate, that is, the reflection layer is disposed between the first conducting layer and the substrate. The light emitting layer and the second conducting layer are sequentially disposed on the first conducting layer. The light emitting layer generates light when a current pass through the light emitting layer. Accordingly, the light generated by the light emitting layer can be emitted to the same side of the LED structure.

摘要翻译： 本发明公开了一种LED结构及其制造方法。 LED结构包括基板，反射层，第一导电层，发光层和第二导电层。 基板具有多个槽，反射层配置在多个槽内。 反射层在每个槽内形成为反射块。 第一导电层设置在基板上，即，反射层设置在第一导电层和基板之间。 发光层和第二导电层依次设置在第一导电层上。 当电流通过发光层时，发光层产生光。 因此，由发光层产生的光可以发射到LED结构的同一侧。

公开(公告)号：US08642994B2

公开(公告)日：2014-02-04

申请号：US13584689

申请日：2012-08-13

申请人： Wen-Fei Fong ,  Der-Lin Hsia

发明人： Wen-Fei Fong ,  Der-Lin Hsia

IPC分类号： H01L29/06 ,  H01L31/072

CPC分类号： H01L27/156 ,  H01L24/24 ,  H01L33/60 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

摘要： A light emitting diode (LED) array includes a substrate with an array having a plurality of LED chips thereon, a dielectric layer, a plug, and a conductive connection layer. Each of the LED chips is isolated from another LED chip adjacent thereto by a trench. The dielectric layer covers a surface of the substrate exposed by the trench and sidewalls and partial surfaces of the LED chips adjacent to the trench. The plug fills the trench. The conductive connection layer is disposed over the plug and the dielectric layer to connect the LED chips with the LED chips adjacent thereto. Radiation emitted from one of the LED chips can be reflected by the dielectric layer and the plug, and finally reflected and output from a side of the LED chip not adjacent to the trench, thereby not affecting the adjacent LED chip and being absorbed by it.

摘要翻译： 发光二极管（LED）阵列包括具有其上具有多个LED芯片的阵列的基板，介电层，插头和导电连接层。 每个LED芯片通过沟槽与其相邻的另一LED芯片隔离。 电介质层覆盖由沟槽暴露的衬底的表面，并且邻近沟槽的LED芯片的侧壁和部分表面。 插头填充沟槽。 导电连接层设置在插头和电介质层之上，以将LED芯片与与其相邻的LED芯片连接。 从一个LED芯片发射的辐射可以被电介质层和插塞反射，最后从LED芯片的不与沟槽相邻的一侧反射和输出，从而不影响相邻的LED芯片并被其吸收。