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36 条记录 (耗时 0.016 秒)

    Drying of fibrous,porous coating base wet material by percolation of hot gas therethrough
    1.
    发明授权
    Drying of fibrous,porous coating base wet material by percolation of hot gas therethrough 失效
    干燥的薄膜，多孔涂层底部湿材料通过热气渗透

    公开(公告)号：US3822182A

    公开(公告)日：1974-07-02

    申请号：US25552872

    申请日：1972-05-22

    申请人： DEXTER CORP

    发明人： HEYSE W ,  LANKHORST J ,  MENDOZA C

    IPC分类号： D21F5/00 ,  D21F1/00 ,  D21F5/02 ,  D21F5/18 ,  D21H13/00 ,  D21H5/08 ,  F26B3/06

    CPC分类号： D21F5/18 ,  D21F5/02

    摘要： IMPROVED QUALITY IS IMPARTED TO FIBROUS WEB MATERIALS USED AS BASE STOCK FOR SATURATING AND COATING APPLICATIONS BY EMPLOYING PRODUCTION CONDITIONS THAT ELIMINATE NONUNIFORM AND PREFERENTIAL SHRINKAGE AND THE TENDENCY OF THE OPEN FIBROUS WEBS TO DEVELOP DISCRETE STRESS AREAS IN THE FORM OF COCKLES AND PUCKERS. THE PROCESS HAS PARTICULAR ADVANTAGE FOR BASE STOCK OF LOW DENSIMETER VALUE, SUCH AS A VALUE OF LESS THAN 1 SEC./100 ML. AND PREFERABLY LESS THAN 0.1 SEC./100 ML., AS MEASURED BY TAPPI TEST METHOD T 460 OS-68 AND INVOLVES THE PERCOLATION OF GASES THROUGH THE WET WEB MATERIAL AS IT IS HELD BY THE GASES IN A RESTRAINED CONDITION ON A SINGLE FORAMINOUS SUPPORT DURING DRYING UNTIL ITS MOISTURE CONTENT IS REDUCED TO A LEVEL OF ABOUT 8 PERCENT BY WEIGHT AND LWSS.

    Electrically conductive resinous compositions
    7.
    发明授权
    Electrically conductive resinous compositions 失效
    导电树脂组合物

    公开(公告)号：US3412043A

    公开(公告)日：1968-11-19

    申请号：US57039766

    申请日：1966-08-05

    申请人： DEXTER CORP

    发明人： GILLILAND JAMES R

    IPC分类号： C08K3/08 ,  C09D5/24 ,  C09D167/00 ,  C09J167/00 ,  H01B1/22 ,  H05K1/09 ,  H05K3/32

    CPC分类号： H01B1/22 ,  C08K3/08 ,  C08L2666/54 ,  C09D5/24 ,  C09D167/00 ,  C09J167/00 ,  H05K1/095 ,  H05K3/321

    摘要： 1,189,199. Conductive resinous composition DEXTER CORP. 1 Aug., 1967 [5 Aug., 1966], No. 35197/67. Headings C3B, C3P arid C3R. An electrically conductive composition comprises silver flake and a resinous binder in the weight ratio of 0À6 : 1 to 2 : 1 and from 0À3 to 2 to parts by weight of a particulate inert filler having a particle size not greater than 420Á for each part by weight of combined silver flake and binder; the particle size of the silver flake is less than that of the filler. The particle size of the silver may vary from 65Á for a filler of 420 Á to 10Á for a filler of particle size 44 Á. The filler may be inorganic, e.g. silica, alumina or metallic aluminium, barytes, mica, asbestos or Wollastonite. The resinous binder may be a phenolic, polyester or especially an epoxy resin which is a diglycidyl ether of bisphenol A having an epoxide equivalent of 175-16000. This may be cured with a polyamine or a polyamine/epoxy resin adduct. The composition may also contain up to 70% by wt. of a solvent for the resin, which may be a high molecular weight diglycidyl ether of bisphenol A having epoxide equivalent of 5000-16000; this does not necessarily require a curing agent. Examples' relate to the use of binders comprising the above epoxy resins, a phenolic resin and a polyester prepared by reacting maleic acid with diethylene glycol and catalysed with methyl ethyl ketone peroxide.

    Encapsulant compositions for semiconductors
    8.
    发明授权
    Encapsulant compositions for semiconductors 失效
    用于半导体的包封组合物

    公开(公告)号：US3849187A

    公开(公告)日：1974-11-19

    申请号：US23869772

    申请日：1972-03-27

    申请人： DEXTER CORP

    发明人： FETSCHER C ,  ROSSO M

    IPC分类号： C08G59/14 ,  C08L63/00 ,  H01L23/29 ,  H01L7/00

    CPC分类号： H01L23/296 ,  C08G59/145 ,  C08K5/54 ,  H01L2924/0002 ,  Y10T428/31529 ,  H01L2924/00 ,  C08L63/00

    摘要： Encapsulant compositions for transistors and other semiconductor assemblages consisting essentially of an epoxy resin system having good electrical insulating properties and selected from the group consisting of amine cured, phenolic cured and anhydride cured epoxy resin systems containing 0 to 70 percent by weight of inorganic filler, and having uniformly blended with the resin and/or filler components about 0.1 to 5 percent, and preferably about 0.3 to 3 percent of a lower alkyl di- or tri-lower alkoxy silane having a substituent in the alkyl group which is reactive with epoxy resin systems and selected from the group consisting of amine and epoxy substituents. The silane is suitably introduced by blending with the resin or pre-coating on the filler component, and the small amount of silane so enhances the insulating properties and durability of the encapsulant as to eliminate the need for prior treatment or passivation of the semiconductor assemblage.

    摘要翻译： 用于晶体管和其它半导体组合物的封装组合物，其基本上由具有良好电绝缘性能的环氧树脂体系组成，并且选自含有0至70重量％无机填料的胺固化，酚固化和酸酐固化的环氧树脂体系，以及 与树脂和/或填料组分均匀混合约0.1〜5％，优选约0.3〜3％的烷基中具有取代基的低级烷基二 - 或三 - 低级烷氧基硅烷，其与环氧树脂体系具有反应性 并选自胺和环氧基取代基。 通过与树脂共混或填料组分上的预涂层适当地引入硅烷，并且少量的硅烷增强了密封剂的绝缘性能和耐久性，从而消除了对半导体组件的预先处理或钝化的需要。