公开(公告)号：US06923658B2

公开(公告)日：2005-08-02

申请号：US10725512

申请日：2003-12-03

申请人： Dan Cromwell ,  Xiang Dai

发明人： Dan Cromwell ,  Xiang Dai

IPC分类号： H01L23/32 ,  H01R12/00 ,  H05K1/00 ,  H05K3/30

CPC分类号： H05K3/301 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10734 ,  H05K2201/2036

摘要： A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.

摘要翻译： 在IC封装焊接后，通过在IC封装和PCB之间插入支撑装置来提供用于机械地支撑具有与印刷电路板（PCB）的列格栅阵列（CGA）互连的集成电路（IC）封装的方法 到PCB。 支撑装置可拆卸地机械地紧固到PCB上，并且被设计成这样的形状，使得支撑装置不能与CGA的焊料柱接触以造成损坏或短路。 本发明消除了IC封装的最大保持载荷约束，并且能够实现各种各样的热解决方案实现而不包括可靠性。

公开(公告)号：US20050124185A1

公开(公告)日：2005-06-09

申请号：US10725512

申请日：2003-12-03

申请人： Dan Cromwell ,  Xiang Dai

发明人： Dan Cromwell ,  Xiang Dai

IPC分类号： H01L23/32 ,  H01R12/00 ,  H05K1/00 ,  H05K3/30

CPC分类号： H05K3/301 ,  H05K2201/10409 ,  H05K2201/10598 ,  H05K2201/10734 ,  H05K2201/2036

摘要： A method for mechanically supporting a integrated circuit (IC) package having a column grid array (CGA) interconnection with a printed circuit board (PCB) is provided by inserting a supporting device between the IC package and the PCB after the IC package is solder attached to the PCB. The supporting device is removably and mechanically fastened to the PCB and is designed in such a shape so that the supporting device cannot come into contact with the solder columns of the CGA to cause damage or shorting. This invention eliminates the maximum retention load constraint of the IC package and enables a wide variety of thermal solution implementations without comprising reliability.

摘要翻译： 在IC封装焊接后，通过在IC封装和PCB之间插入支撑装置来提供用于机械地支撑具有与印刷电路板（PCB）的列格栅阵列（CGA）互连的集成电路（IC）封装的方法 到PCB。 支撑装置可拆卸地机械地紧固到PCB上，并且被设计成这样的形状，使得支撑装置不能与CGA的焊料柱接触以造成损坏或短路。 本发明消除了IC封装的最大保持载荷约束，并且能够实现各种各样的热解决方案实现而不包括可靠性。

公开(公告)号：US07372147B2

公开(公告)日：2008-05-13

申请号：US10612663

申请日：2003-07-02

申请人： Xiang Dai ,  Dan Cromwell

发明人： Xiang Dai ,  Dan Cromwell

IPC分类号： H01L23/34 ,  H01L29/40 ,  H01L21/00 ,  H05K7/20

CPC分类号： H01L23/49811 ,  H01L23/40 ,  H01L2924/0002 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/0278 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00

摘要： A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.

摘要翻译： 一种方法在印刷电路板上支持包括具有焊料柱阵列的衬底的电路封装。 所述方法包括向所述电路封装提供在所述基板的边缘上向外延伸的超大尺寸的盖。 电路封装通过焊料柱阵列与印刷电路板电连接，并且多个支撑件在电路封装的盖子的正下方固定到印刷电路板的位置，同时留下盖子和支架之间的间隙。 相对于印刷电路板施加静电压力并将其维持到电路封装，从而导致焊料柱阵列蠕变，直到间隙闭合，并且压缩力的大部分由载体承受。

公开(公告)号：US20050001310A1

公开(公告)日：2005-01-06

申请号：US10612663

申请日：2003-07-02

申请人： Xiang Dai ,  Dan Cromwell

发明人： Xiang Dai ,  Dan Cromwell

IPC分类号： H05K3/34 ,  H01L23/40 ,  H01L23/498 ,  H05K3/30 ,  H01L23/32

CPC分类号： H01L23/49811 ,  H01L23/40 ,  H01L2924/0002 ,  H05K3/301 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/10734 ,  H05K2201/2036 ,  H05K2203/0278 ,  H05K2203/0415 ,  Y02P70/613 ,  H01L2924/00

摘要： A method supports, on a printed circuit board, a circuit package including a substrate having a solder column array. The method comprises providing the circuit package with an over-sized lid that extends outwardly over an edge of the substrate. The circuit package is electrically connected to the printed circuit board via the solder column array and a plurality of supports are secured to the printed circuit board in position underneath the lid of the circuit package while leaving a gap between the lid and the support. A static compressive force is applied and maintained to the circuit package relative to the printed circuit board, thereby causing the solder column array to creep until the gap is closed and a substantial portion of the compressive force is borne by the supports.

摘要翻译： 一种方法在印刷电路板上支持包括具有焊料柱阵列的衬底的电路封装。 所述方法包括向所述电路封装提供在所述基板的边缘上向外延伸的超大尺寸的盖。 电路封装通过焊料柱阵列与印刷电路板电连接，并且多个支撑件在电路封装的盖子的正下方固定到印刷电路板的位置，同时留下盖子和支架之间的间隙。 相对于印刷电路板施加静电压力并将其维持到电路封装，从而导致焊料柱阵列蠕变，直到间隙闭合，并且压缩力的大部分由载体承受。

公开(公告)号：US07171742B2

公开(公告)日：2007-02-06

申请号：US10698780

申请日：2003-10-31

申请人： Dan Cromwell ,  Rudy Rivera ,  James Hensley

发明人： Dan Cromwell ,  Rudy Rivera ,  James Hensley

IPC分类号： B23P19/00 ,  H05K3/30

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H05K3/325 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number of fasteners associated with the compression devices. The device is able to assist in the formation of an electrical contact between a chip package in the land grid array assembly and a circuit board by the lower surface being pressed against the compression devices to compress the compression devices and then allowing the plurality of fasteners to be tightened.

摘要翻译： 一种用于组装电路板的装置。 该装置具有用于接收压缩力的上表面。 该装置还具有用于压缩陆地网格阵列组件中的多个压缩装置的下表面，同时允许接近与压缩装置相关联的多个紧固件。 该装置能够帮助在陆地网格阵列组件中的芯片封装和电路板之间形成电接触，该电路板被下表面压靠压缩装置以压缩压缩装置，然后允许多个紧固件 收紧

公开(公告)号：US06660563B1

公开(公告)日：2003-12-09

申请号：US10159150

申请日：2002-05-31

申请人： Dan Cromwell ,  Rudy Rivera ,  James Hensley

发明人： Dan Cromwell ,  Rudy Rivera ,  James Hensley

IPC分类号： H01L2144

CPC分类号： H01L23/4006 ,  H01L2924/0002 ,  H05K3/325 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/53174 ,  Y10T29/53178 ,  H01L2924/00

摘要： A device for assembling circuit boards. The device has an upper surface for receiving a compressing force. The device also has a lower surface for compressing a number of compression devices in a land grid array assembly while allowing access to a number of fasteners associated with the compression devices. The device is able to assist in the formation of an electrical contact between a chip package in the land grid array assembly and a circuit board by the lower surface being pressed against the compression devices to compress the compression devices and then allowing the plurality of fasteners to be tightened.

摘要翻译： 一种用于组装电路板的装置。 该装置具有用于接收压缩力的上表面。 该装置还具有用于压缩陆地网格阵列组件中的多个压缩装置的下表面，同时允许接近与压缩装置相关联的多个紧固件。 该装置能够帮助在陆地网格阵列组件中的芯片封装和电路板之间形成电接触，该电路板被下表面压靠压缩装置以压缩压缩装置，然后允许多个紧固件 收紧