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    POLYMER TUBING LASER MICROMACHINING
    1.
    发明申请
    POLYMER TUBING LASER MICROMACHINING 有权
    聚合物管激光微孔机

    公开(公告)号：US20120037609A1

    公开(公告)日：2012-02-16

    申请号：US13208259

    申请日：2011-08-11

    申请人： David Gaudiosi ,  Michael Greenberg ,  Michael Mielke ,  Tim Booth ,  Gordon Masor

    发明人： David Gaudiosi ,  Michael Greenberg ,  Michael Mielke ,  Tim Booth ,  Gordon Masor

    IPC分类号： H05B7/18

    CPC分类号： A61F2/91 ,  B23K2103/42 ,  B23K2103/50

    摘要： An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

    摘要翻译： 一种用于工件无热消融的装置。 该装置可以包括激光装置，用于将激光束引导到工件处，以通过无热消融从工件移除多个部分。 这种去除可能发生在多个离散的运动中，这些运动使得激光束以特定顺序的外周的外周沿着多个部分的机械稳定性进行追踪。 该装置还可以包括工艺气体喷嘴，用于与激光束同轴地输送工艺气体以清除碎屑并冷却工件，以及工件保持器，以在移除多个部件期间保持和操纵工件。

    Laser based processing of layered materials
    3.
    发明授权
    Laser based processing of layered materials 有权
    激光加工层状材料

    公开(公告)号：US09114482B2

    公开(公告)日：2015-08-25

    申请号：US13234751

    申请日：2011-09-16

    申请人： Ramanujapuram A. Srinivas ,  Michael Greenberg ,  David Gaudiosi ,  Michael Mielke ,  Tim Booth

    发明人： Ramanujapuram A. Srinivas ,  Michael Greenberg ,  David Gaudiosi ,  Michael Mielke ,  Tim Booth

    IPC分类号： B23K26/40 ,  B23K26/36

    CPC分类号： B23K26/40 ,  B23K26/36 ,  B23K2103/172

    摘要： Systems and methods for laser based processing of layered materials. Methods may include selectively adjusting ultrafast laser output of an ultrafast laser device based upon one or more physical attributes of a layer of the layered material, applying the ultrafast laser output of the ultrafast laser device to the layer of the layered material along a tool path to ablate the layer along the tool path, and then re-executing the steps to ablate one or more additional layers, the re-execution occurring for each distinct layer of the layered material that is to be ablated.

    摘要翻译： 层状材料激光加工的系统和方法。 方法可以包括基于层状材料层的一个或多个物理属性来选择性地调节超快激光装置的超快激光输出，将超快激光装置的超快激光输出沿工具路径施加到分层材料层 沿着刀具路径烧蚀层，然后重新执行步骤以消融一个或多个附加层，对于要被消融的层状材料的每个不同层发生重新执行。

    Singulation of layered materials using selectively variable laser output
    4.
    发明授权
    Singulation of layered materials using selectively variable laser output 有权
    使用选择性可变的激光输出分层材料

    公开(公告)号：US09120181B2

    公开(公告)日：2015-09-01

    申请号：US13234795

    申请日：2011-09-16

    申请人： Ramanujapuram A. Srinivas ,  Michael Greenberg ,  David Gaudiosi ,  Michael Mielke ,  Tim Booth

    发明人： Ramanujapuram A. Srinivas ,  Michael Greenberg ,  David Gaudiosi ,  Michael Mielke ,  Tim Booth

    IPC分类号： B23K26/40 ,  B23K26/36

    CPC分类号： B23K26/40 ,  B23K26/36 ,  B23K2103/172

    摘要： Systems and methods for processing, selectively ablating, and singulating layered materials. According to some embodiments, methods for selectively ablating a layered material may include selectively varying a wavelength of at least a portion of a primary ultrafast laser beam to create a secondary ultrafast laser beam with a second wavelength, the primary ultrafast laser beam being configured to ablate a layer of the layered material, the secondary ultrafast laser beam being configured to ablate an additional layer of the layered material and applying the first and second ultrafast laser beams to the layered material to create a singulated product.

    摘要翻译： 用于处理，选择性地烧蚀和分层的材料的系统和方法。 根据一些实施例，用于选择性地烧蚀层状材料的方法可以包括选择性地改变主要超快激光束的至少一部分的波长以产生具有第二波长的次级超快激光束，所述主超快激光束被配置为消融 所述层状材料层，所述次级超快激光束被配置为消除所述分层材料的附加层，并将所述第一和第二超快激光束施加到所述分层材料以产生单一产品。

    High-order harmonic generation in a capillary discharge
    6.
    发明申请
    High-order harmonic generation in a capillary discharge 失效
    毛细管放电中高次谐波产生

    公开(公告)号：US20080069171A1

    公开(公告)日：2008-03-20

    申请号：US11804888

    申请日：2007-05-21

    申请人： Jorge Rocca ,  Henry Kapteyn ,  Magaret Mumane ,  David Gaudiosi ,  Michael Grisham ,  Tenio Popmintchev ,  Brenda Reagan

    发明人： Jorge Rocca ,  Henry Kapteyn ,  Magaret Mumane ,  David Gaudiosi ,  Michael Grisham ,  Tenio Popmintchev ,  Brenda Reagan

    IPC分类号： H01S3/03

    CPC分类号： G02F1/353 ,  G02F1/3501 ,  G02F1/355 ,  H05G2/003 ,  H05G2/008

    摘要： A pre-ionized medium created by a capillary discharge results in more efficient use of laser energy in high-order harmonic generation (HHG) from ions. It extends the cutoff photon energy, and reduces the distortion of the laser pulse as it propagates down the waveguide. The observed enhancements result from a combination of reduced ionization energy loss and reduced ionization-induced defocusing of the driving laser as well as waveguiding of the driving laser pulse. The discharge plasma also provides a means to spectrally tune the harmonics by tailoring the initial level of ionization of the medium.

    摘要翻译： 通过毛细管放电产生的预电离介质可以更有效地利用来自离子的高次谐波产生（HHG）中的激光能量。 它扩展了截止光子能量，并且当激光脉冲向下传播时减小激光脉冲的失真。 所观察到的增强是由驱动激光器的电离能量损失减少和离子化引起的散焦以及驱动激光脉冲波导的组合引起的。 放电等离子体还提供了通过调节介质的初始电离水平来光谱调谐谐波的手段。

    Methods and systems for trimming circuits
    7.
    发明授权
    Methods and systems for trimming circuits 有权
    修剪电路的方法和系统

    公开(公告)号：US08921733B2

    公开(公告)日：2014-12-30

    申请号：US13446879

    申请日：2012-04-13

    申请人： David Gaudiosi ,  Laurent Vaissie

    发明人： David Gaudiosi ,  Laurent Vaissie

    IPC分类号： B23K26/04 ,  B23K26/00 ,  B23K26/06 ,  B23K26/02 ,  G06K9/00 ,  G01N23/00 ,  G01N21/86 ,  G01M7/00 ,  B23K26/40 ,  H01C17/242 ,  H01L21/66 ,  B23K26/36

    CPC分类号： B23K26/0635 ,  B23K26/0624 ,  B23K26/351 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01C17/242 ,  H01L22/14 ,  H01L22/20

    摘要： Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

    摘要翻译： 从第一电路的表面去除材料包括使用脉冲发生器产生第一激光脉冲; 使用聚焦组件瞄准第一电路上的点; 将第一激光脉冲传送到第一电路上的点，第一电路包括数字分量; 使用第一激光脉冲从现场烧蚀材料，而不改变数字分量的状态; 测试第一电路的性能，在不消耗材料和测试性能的步骤之间执行测试，而不重新初始化电路。 针对第一电路上的点包括使用脉冲发生器产生第二激光脉冲; 将第二激光脉冲传送到牺牲材料片; 用形成图像的视觉系统检测由第二激光脉冲引起的消融的位置; 并使用此图像将第一个激光引导到现场。

    Polymer tubing laser micromachining
    8.
    发明授权
    Polymer tubing laser micromachining 有权
    聚合物管激光微加工

    公开(公告)号：US08884184B2

    公开(公告)日：2014-11-11

    申请号：US13208259

    申请日：2011-08-11

    申请人： David Gaudiosi ,  Michael Greenberg ,  Michael Mielke ,  Tim Booth ,  Gordon Masor

    发明人： David Gaudiosi ,  Michael Greenberg ,  Michael Mielke ,  Tim Booth ,  Gordon Masor

    IPC分类号： B23K26/38 ,  B23K26/40 ,  A61F2/91

    CPC分类号： A61F2/91 ,  B23K2103/42 ,  B23K2103/50

    摘要： An apparatus for athermal ablation of a workpiece. The apparatus may include a laser device to direct a laser beam at the workpiece to remove a plurality of sections from the workpiece by athermal ablation. The removal may occur in a plurality of discrete motions that cause the laser beam to trace along outer perimeters of the sections in a specific order maintaining mechanical stability of the plurality of sections. The apparatus may further include a process gas nozzle to deliver process gas coaxially with the laser beam to clear debris and cool the workpiece, and a workpiece holder to hold and maneuver the workpiece during the removal of the plurality of sections.

    摘要翻译： 一种用于工件无热消融的装置。 该装置可以包括激光装置，用于将激光束引导到工件处，以通过无热消融从工件移除多个部分。 这种去除可能发生在多个离散的运动中，这些运动使得激光束以特定顺序的外周的外周沿着多个部分的机械稳定性进行追踪。 该装置还可以包括工艺气体喷嘴，用于与激光束同轴地输送工艺气体以清除碎屑并冷却工件，以及工件保持器，以在移除多个部件期间保持和操纵工件。

    METHODS AND SYSTEMS FOR TRIMMING CIRCUITS
    9.
    发明申请
    METHODS AND SYSTEMS FOR TRIMMING CIRCUITS 有权
    用于修剪电路的方法和系统

    公开(公告)号：US20120217230A1

    公开(公告)日：2012-08-30

    申请号：US13446879

    申请日：2012-04-13

    申请人： David Gaudiosi ,  Laurent Vaissie

    发明人： David Gaudiosi ,  Laurent Vaissie

    IPC分类号： B23K26/02

    CPC分类号： B23K26/0635 ,  B23K26/0624 ,  B23K26/351 ,  B23K26/361 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50 ,  H01C17/242 ,  H01L22/14 ,  H01L22/20

    摘要： Removing material from the surface of a first circuit comprises generating a first laser pulse using a pulse generator; targeting a spot on the first circuit using a focusing component; delivering the first laser pulse to the spot on the first circuit, the first circuit including a digital component; ablating material from the spot using the first laser pulse without changing a state of the digital component; testing performance of the first circuit, the testing being performed without reinitializing the circuit between the steps of ablating material and testing performance. Targeting the spot on the first circuit comprises generating a second laser pulse using a pulse generator; delivering a second laser pulse to a sacrificial piece of material; detecting the position of the ablation caused by the second laser pulse with a vision system that forms an image; and using this image to guide the first laser to the spot.

    摘要翻译： 从第一电路的表面去除材料包括使用脉冲发生器产生第一激光脉冲; 使用聚焦组件瞄准第一电路上的点; 将第一激光脉冲传送到第一电路上的点，第一电路包括数字分量; 使用第一激光脉冲从现场烧蚀材料，而不改变数字分量的状态; 测试第一电路的性能，在不消耗材料和测试性能的步骤之间执行测试，而不重新初始化电路。 针对第一电路上的点包括使用脉冲发生器产生第二激光脉冲; 将第二激光脉冲传送到牺牲材料片; 用形成图像的视觉系统检测由第二激光脉冲引起的消融的位置; 并使用此图像将第一个激光引导到现场。

    LASER BASED PROCESSING OF LAYERED MATERIALS
    10.
    发明申请
    LASER BASED PROCESSING OF LAYERED MATERIALS 有权
    层状材料的激光加工

    公开(公告)号：US20120156875A1

    公开(公告)日：2012-06-21

    申请号：US13234751

    申请日：2011-09-16

    申请人： Ramanujapuram A. Srinivas ,  Michael Greenberg ,  David Gaudiosi ,  Michael Mielke ,  Tim Booth

    发明人： Ramanujapuram A. Srinivas ,  Michael Greenberg ,  David Gaudiosi ,  Michael Mielke ,  Tim Booth

    IPC分类号： H01L21/768 ,  B23K26/00

    CPC分类号： B23K26/40 ,  B23K26/36 ,  B23K2103/172

    摘要： Systems and methods for laser based processing of layered materials. Methods may include selectively adjusting ultrafast laser output of an ultrafast laser device based upon one or more physical attributes of a layer of the layered material, applying the ultrafast laser output of the ultrafast laser device to the layer of the layered material along a tool path to ablate the layer along the tool path, and then re-executing the steps to ablate one or more additional layers, the re-execution occurring for each distinct layer of the layered material that is to be ablated.

    摘要翻译： 层状材料激光加工的系统和方法。 方法可以包括基于层状材料层的一个或多个物理属性来选择性地调节超快激光装置的超快激光输出，将超快激光装置的超快激光输出沿工具路径施加到分层材料层 沿着刀具路径烧蚀层，然后重新执行步骤以消融一个或多个附加层，对于要被消融的层状材料的每个不同层发生重新执行。