Modular probe system
    1.
    发明授权
    Modular probe system 有权
    模块式探头系统

    公开(公告)号:US07764079B1

    公开(公告)日:2010-07-27

    申请号:US12023787

    申请日:2008-01-31

    IPC分类号: G01R31/26

    CPC分类号: G01R31/2889 G01R31/31907

    摘要: A modular probe system that includes components that are selected to test different devices-under-test (DUTs) in a number of different scientific fields. The system includes quick-release connectors that may be used to releasably secure components of the modular probe system to one another or to a mounting interface. These connectors permit quick and easy attachment and detachment of various components in a manner that permits a user to readily configure the probe system for each DUT.

    摘要翻译: 模块化探测系统,其包括被选择用于测试不同设备的组件 - 被测试(DUT)在许多不同的科学领域。 该系统包括快速释放连接器,其可以用于将模块化探针系统的组件彼此或组件接口可释放地固定。 这些连接器允许以允许用户容易地为每个DUT配置探针系统的方式快速和容易地附接和拆卸各种部件。

    Apparatus for testing substrates
    2.
    发明申请
    Apparatus for testing substrates 有权
    用于测试基板的装置

    公开(公告)号:US20050083036A1

    公开(公告)日:2005-04-21

    申请号:US10928975

    申请日:2004-08-27

    CPC分类号: H01L21/6719 H01L21/67173

    摘要: An apparatus for testing substrates reduces the area required and the costs which arise with the testing of substrates, in particular semiconductor wafers, during the production process. The apparatus includes testing arrangements comprising a chuck, a chuck drive, control electronics, probe or probe board holding means with a handling system, a substrate magazine station and an alignment station. The testing arrangements include at least two testing arrangements, both of which are all jointly operatively connected to the handling system, the substrate magazine station and the alignment station.

    摘要翻译: 用于测试衬底的装置减少了在制造过程中通过测试衬底,特别是半导体晶片所需的面积和成本。 该装置包括测试装置,其包括卡盘,卡盘驱动器,控制电子装置,具有处理系统的探针板或探针板保持装置,基板杂志站和对准站。 测试装置包括至少两个测试装置,这两个测试装置都共同操作地连接到处理系统,基板仓库站和对准站。

    Arrangement and method for testing substrates under load
    3.
    发明申请
    Arrangement and method for testing substrates under load 审中-公开
    在负载下测试基板的布置和方法

    公开(公告)号:US20050083037A1

    公开(公告)日:2005-04-21

    申请号:US10928985

    申请日:2004-08-27

    CPC分类号: H01L21/67207 H01L21/67253

    摘要: Arrangement and method for testing a substrate under load with a prober are provided, by which the full productivity of the prober can be exploited. The arrangement includes a chuck, a chuck driver, control electronics, probe or probe card holding means, and has a loading means for applying a thermal, mechanical, electrical or other physical or chemical loading to the substrate. The substrate is subjected to a loading and then its properties are measured by means of the prober. The loading means is arranged as a separate subassembly separated from the prober and therein is connected to the latter via a handling system. The method provides for the substrate to be brought into operative connection with a loading means, subjected to the loading in this loading means, then removed from the loading means and tested in terms of its functions.

    摘要翻译: 该装置具有仅在测试期间通过处理系统(3)连接到探测器(1)的温度控制站(2)。 温度控制站向半导体晶片施加热,机械,电气,物理或其他化学载荷,然后通过处理系统将晶片转移到探测器进行进一步测试。 在负载下测试半导体晶片的方法也包括独立权利要求。

    Modular Probe System
    4.
    发明申请
    Modular Probe System 审中-公开
    模块化探头系统

    公开(公告)号:US20100277195A1

    公开(公告)日:2010-11-04

    申请号:US12837693

    申请日:2010-07-16

    IPC分类号: G01R31/00

    CPC分类号: G01R31/2889 G01R31/31907

    摘要: A modular probe system that includes components that are selected to test different devices-under-test (DUTs) in a number of different scientific fields. The system includes quick-release connectors that may be used to releasably secure components of the modular probe system to one another or to a mounting interface. These connectors permit quick and easy attachment and detachment of various components in a manner that permits a user to readily configure the probe system for each DUT.

    摘要翻译: 模块化探测系统,其包括被选择用于测试不同设备的组件 - 被测试(DUT)在许多不同的科学领域。 该系统包括快速释放连接器,其可以用于将模块化探针系统的组件彼此或组件接口可释放地固定。 这些连接器允许以允许用户容易地为每个DUT配置探针系统的方式快速和容易地附接和拆卸各种部件。

    Apparatus for testing substrates
    5.
    发明授权
    Apparatus for testing substrates 有权
    用于测试基板的装置

    公开(公告)号:US07196507B2

    公开(公告)日:2007-03-27

    申请号:US10928975

    申请日:2004-08-27

    IPC分类号: G01R31/28

    CPC分类号: H01L21/6719 H01L21/67173

    摘要: An apparatus for testing substrates reduces the area required and the costs which arise with the testing of substrates, in particular semiconductor wafers, during the production process. The apparatus includes testing arrangements comprising a chuck, a chuck drive, control electronics, probe or probe board holding means with a handling system, a substrate magazine station and an alignment station. The testing arrangements include at least two testing arrangements, both of which are all jointly operatively connected to the handling system, the substrate magazine station and the alignment station.

    摘要翻译: 用于测试衬底的装置减少了在制造过程中通过测试衬底,特别是半导体晶片所需的面积和成本。 该装置包括测试装置,其包括卡盘,卡盘驱动器,控制电子装置,具有处理系统的探针板或探针板保持装置,基板杂志站和对准站。 测试装置包括至少两个测试装置,这两个测试装置都共同操作地连接到处理系统,基板仓库站和对准站。